Temperature Sensors on Flexible Substrates

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Presentation transcript:

Temperature Sensors on Flexible Substrates Z. Celik-Butler, D. Butler and M. Chitteboyina Nanotechnology Research and Teaching Facility University of Texas at Arlington http://www.uta.edu/engineering/nano/ March 13, 2009

Temperature Sensor Temperature Sensor - CoventorWare Model Flexible superstrate 0.15cm x 0.05cm x 0.005 cm Top surface is in contact with the structure cross-section cut Flexible substrate Temperature sensor is connected to external flexible circuitry through the flexible substrate

Temperature Sensor Z-scale exaggerated 5 times Aluminum Insulation Layers Sensor Element Right arm of the temperature sensor Left arm of the temperature sensor Flexible Substrate

Fabrication Process Flow for the Temperature Sensor Clean silicon wafer

Fabrication Process Flow for the Temperature Sensor 100 nm silicon nitride layer

Fabrication Process Flow for the Temperature Sensor Flexible Substrate Polyimide ~ 40 µm

Fabrication Process Flow for the Temperature Sensor Right electrode of the sensor

Fabrication Process Flow for the Temperature Sensor Sensor Element

Fabrication Process Flow for the Temperature Sensor First Insulation Layer

Fabrication Process Flow for the Temperature Sensor Left electrode of the sensor

Fabrication Process Flow for the Temperature Sensor Second Insulation Layer

Fabrication Process Flow for the Temperature Sensor Flexible Superstrate Polyimide ~ 40 µm Undercut made to access the sensor Second Insulation Layer Silicon Nitride ~ 100 nm

Fabrication Process Flow for the Temperature Sensor Top aluminum surface will be in contact with the structure Aluminum ~ 400 nm

Fabrication Process Flow for the Temperature Sensor Back side view of the Temperature Sensor Sensor are connected to flexible circuitry through the flexible substrate

Temperature Sensor Simulation Results Temperature pulse applied on the top aluminum surface 370.5 K 300.0 K Temperature Sensor CoventorWare Model Bottom Flexible substrate kept either floating or fixed at 300 K Simulated, heating thermal time constant = 0.07 ms cooling thermal time constant = 0.67 ms

Temperature Sensor Fabrication STEP 1 STEP 2 STEP 3 Right arm of the sensor Sensor Element First Insulation Layer STEP 4 STEP 5 STEP 6, 7, 8 Left arm of the sensor Second Insulation Layer Spin-coat and pattern polyimide superstrate layer Deposit Aluminum layer Etch the back-side of the wafer and get access to bond-pads

Temperature Sensor Fabrication Spin-coat and pattern polyimide superstrate layer Then deposited Aluminum on top of the superstrate layer to make contact with the structure

Temperature Sensor Results TS 80x80 µm Device 1 TS 80x80 µm Device 2