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A 20/30 Gbps CMOS Backplane Driver with Digital Pre-emphasis Paul Westergaard, Timothy Dickson, and Sorin Voinigescu University of Toronto Canada.

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Presentation on theme: "A 20/30 Gbps CMOS Backplane Driver with Digital Pre-emphasis Paul Westergaard, Timothy Dickson, and Sorin Voinigescu University of Toronto Canada."— Presentation transcript:

1 A 20/30 Gbps CMOS Backplane Driver with Digital Pre-emphasis Paul Westergaard, Timothy Dickson, and Sorin Voinigescu University of Toronto Canada

2 Outline Motivation Design Goals Circuit Description and Design Experimental Results Summary and Conclusion

3 Motivation Application Serial inter-chip communications over backplanes at 20-Gb/s. Unfulfilled Needs CMOS implementation over 10-Gbps > 30 dB dynamic range, low-power Programmable width and height pre- emphasis to increase receiver simplicity Prior Art Previous CMOS backplane drivers have only achieved 10 Gb/s data rate.

4 Design Goals 30-Gb/s main path operation without pre-emphasis 20-Gb/s fully featured operation with –‘digital’ pre-emphasis –eye-crossing –output swing control High Sensitivity (<10 mVpp per side) Large output swing (>350 mVpp per side) 50-Ohm input/output matching 1.5 V supply 130 nm CMOS implementation

5 Circuit Design and Description

6 Biasing for peak f T and NF MIN Peak f T bias 0.3mA/um Min. NF MIN 0.15mA/um Multi-stage amplifiers with signal path transistors biased at half peak fT

7 Circuit Architecture Multi-stage amplifier implementation Input stage biased and sized for high gain and low noise Inductive broad-banding in every inverter stage to reduce power and increase speed Main (higher-speed) and pre- emphasis paths are parallelized

8 Block Diagram

9 Input Matching and Low-Noise Comparator

10 Eye-crossing Control *D. S. McPherson, S. Voinigescu et al IEEE GaAs IC Symp. - Oct. 2002

11 Digital Pre-emphasis Delay Circuit

12 Digital Differentiator

13 Inductor design considerations Inductor broadband “2-  ” model model extracted for design from ASITIC simulations. Multi-layer ( 2 or 3 metals) design used to minimize inductor area (400, 700, 900 pH used) Largest inductor side is 44 um (900 pH)

14 Experimental Results

15 Chip Photograph

16 Input/Output Return Loss

17 Measured Eye-diagrams: 0.3Vp-p output 20 Gb/s 25 Gb/s 30 Gb/s

18 Sensitivity 20 Gb/s30 Gb/s Input: 21mVpp one side only Output: 80mVpp per side

19 20-Gbs Eye with Pre-emphasis

20 Output Swing Control @20Gbps Input: 200mVpp one side only Output: 170mVppOutput: 340mVpp

21 Output Swing Control @30 Gbps Output: 170mVppOutput: 270mVpp (Gain at 30 Gb/s!) Input: 200mVpp one side only

22 30%-70% Crossing Control @20 Gbs 70%30% 50%

23 40%-60% Crossing Control @ 25 Gbs 60%40% 50%

24 Summary and Conclusion

25 Performance Summary ParameterMeasured val. Technology130nm CMOS Supply Voltage1.5 V Power Dissipation150 mW Output Swing @ 20 Gb/s170-350 mVp-p Pre-emphasis @ 20 Gb/s30%/10% Crossing Control @ 20Gb/s30% to 70% Eye sensitivity @ 20 Gb/s20(10) mVpp Dynamic Range @ 20 Gb/s 30 dB Noise Figure(10GHz,15GHz)16.5 dB, 17 dB S11/S22 up to 50 GHz<-12 dB

26 Conclusion First CMOS driver above 20 Gb/s Novel digital pre-emphasis High sensitivity, dynamic range Large output swing Eye-crossing control Communications between chips and backplanes is feasible at 20 Gb/s in 130-nm CMOS technology

27 Acknowledgements Rudy Beerkens and Boris Prokes of STMicroelectronics Ottawa STMicroelectronics for fabrication Micronet and Gennum Corporation for financial support Quake Technologies for access to 40 Gb/s BERT


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