1. Presented To: Customer Name Company Name
Rev

2. ECMG At a glance Business created in CY 2001
Major focus on printed circuit boards
Represent six (6+) complementary China based PCB fabricators
Five (5) offices in North America, two (2) in Europe and one (1) in Asia
Seven (7) outside sales, Three (4) quotation analysts, Three (3) CSRs; Fourteen (14) employees total
ECMG is atypical of most electronics representatives
Provide Global coverage for customers and Principals alike

3. ECMG’s Principals Guang Dong Ellington Electronics Technology Co. ,Ltd
Complementary Principals with minimal overlap in product offering, becase we know no one shop can build all technology.
Focused on rigid printed circuit boards (All China based)
Guang Dong Ellington Electronics Technology Co. ,Ltd
Ellington 2 to 12 layer Low-med. Tech (LMHV) Large volume
Shenzhen Sun&LYNN Circuits Electronic Co. ,Ltd
Sun & Lynn 2 to 12 layer Low-med tech HMLV (low MOV)
Shenzhen Fastprint Circuit Technology Co Ltd
SFPC up to 50 layer All technologies, time critical/QTA Shop
BoardTek Electronic Corporation
BoardTek 2 to 26 layer Hi tech, Exotic Material, HDI & Metal Backed
Shenzhen Desow Technology Co. ,Ltd
Desow SS to 28 Layers HMLV PCB & FPC
Shenzhen Shennan Circuits Co., Ltd.
Shennan 2 to 42 layer Hi tech, heavy Cu, XL format
HD-FLEX TECHNOLOGY CO., LTD
H-D Flex 1 to 8 layer LMLV FLEXIABLE PCBS
Tat Chun Printed Circuit Board Co., Ltd.
Tat Chun SS to 6 layer Low tech/hi volume
Extensive due diligence and customer feedback, world class pricing and quality

4. ECMG’s Other Sources Other Items sourced in China LCD/LCM
PCBA & Sub-Assembly
Cable Assemblies
Sheet metal & Stamping
Plastic Injection Modeling
CNC machines tooling
Full Box build assembly
Heat Sinks & RFI Shields
Antennas
Cable Assemblies:
Semi-Rigid RF Cables and Flex RF Cables
Earphones
Medical Cables
Wire Harnesses
Wireless and Mobile Antennas
Fiber Optical
Turnkey Solutions / System Integrations:
Electro-Mechanical Assemblies
Box Build and Sub-Systems
Engineering Services
Surface Mount and Through Hole Capability

5. How is ECMG different? PCB experts
Significant investment in hardware and software
Centralized hub for quoting, order entry/status and technical queries
Global footprint
Maintain own ftp site for large data package upload and dissemination to principals
Direct sales/sales affiliate combination equates to 30+ sales people globally
ECMG has an employee based in China

6. The ECMG Advantage
Our Principal’s missions are to provide customers with the highest quality products at world class prices
ECMG’s mission is to provide a world class link between our Principals and our customers
Asian pricing/ with domestic expertise.
Ability to deal with customers during the day in local language and the factories at night
“A Western face with Eastern advantages”

7. The ECM Group, LLC Global Footprint
Europe Headquarters
The ECM Group, LLC
Castrum House
Lechner Ödön fasor 3, B 8/2
1095 Budapest Hungary
Tel    
Fax   
Montreal, PQ (2)
Budapest , HU (3)
St. Louis, MO (6)
Longmont , CO (1)
New England Area (2)
Hong, Kong CN (1)
Philippines (4)
Asia Pacific Headquarters
The ECM Group, LLC
2nd Floor, FCIE Fire Station Bldg
First Cavite Industrial Estate
Brgy. Langkaan, Dasmarinas
Cavite 4114 Philippines
Phone:
Fax:
N. America Headquarters
The ECM Group, LLC
7 Document Drive
St. Louis, MO
Tel:
Fax:
Index

8. ECMG Major Customers

9. Ellington Electronics Technology Co., Ltd.

10. Ellington Electronics Technology Co., Ltd.
Location
No. of Employees
Years in business
Capabilities
Capacity
Approvals
Zhongshan, Guangdong, PRC
7000 6
Double-sided and Multi-layer to 12
FR1, FR2, CEM1, CEM3, FR4
HAL, Ni/Au plating, OSP
ENIG, immersion silver
Carbon paste surface print
Peelable mask
Single-sided PTH
HDI, Laser Drilling
2,000,000 SqFt. per month
ISO 9001, 14001, TS 16949

11. Ellington Electronics Technology Co., Ltd.
Items
Production
Prototype(<35ft 2 )
Panel Size
22 ” × 27 ”
24 ” × 30 “
Max Layer Counts 20 24
Board Thickness (max)
0.25 ”
0.25 “
                                (min)
0.012 “
0.010 ”
Core Thickness(min)
0.003 “
0.002 “
Drill Size Mechanical (min)
0.008 ”
0.006‘'
Drill Size Laser(min)
0.004 ”
Aspect Ratio
Line Width Spacing 1/3 oz (outer)
3.5mil/3.5mil
3mil/3mil
Line Width Spacing 1/2 oz (inner)
2.5mil/2.5mil
Layer to Layer Registration
0.003 ”
Soldermask Plug Hole
Hole Diameter: 24mil
Hole Diameter: 32mil
Min Soldermask Dam
0.004 “
Impedance Control
(50/60/70/100/110/120)+/-10%
(50/60/70/100/110/120)+/-8%
Multilayer : Copper Weight (inner) (outer)
4oz
5 oz
3oz
Double Side: Copper Weight
5oz
6oz
Buried Via
Yes
Blind Via
Rambus
28 Ohm +/-10%
28 Ohm ± 8%
HDI
1+N+1 4mil Via hole
2+N+2 4mil Via hloe
Items
Production
Prototype(<35ft 2 )
Surface Finishing
 HASL 
 Selective immersion gold plating 
 Entek
 HASL
 Immersion Gold v Flash Gold 
 Contact Finger Gold Plating 
 Glicoat
 Carbon Ink
 Immersion Gold 
 Immersion Sliver
 Flash Gold
 Immersion Tin
 Contact Finger Gold Plating
Green Technology
 OSP
 Laminate for lead-free processing
 Immersion Gold
 Halogen free material
 Immersion Silver
Rev

12. SHENZHEN SUN & LYNN CIRCUIT CO., LTD

13. SHENZHEN SUN & LYNN CIRCUIT CO., LTD
Location
No. of Employees
Years in business
Capabilities
Capacity
Approvals
Bao An region of Shenzhen
1700 10
Double-sided and Multi-layer to 12
FR1, FR2, CEM1, CEM3, FR4
HAL, Ni/Au plating, OSP
ENIG, immersion silver
Carbon paste surface print
Peelable mask
Single-sided PTH
700,000 SqFt. per month
ISO 9001, 14001, TS 16949

14. Shenzhen Fastprint Circuit Technology Co., LTD.
Largest QTA/Proto/small volume shop in China
24 hour to 7 day turns

15. Shenzhen Fastprint Circuits Co., LTD.
Location
No. of Employees
Years in business
Capabilities
Capacity
Approvals
Shenzhen, Guangdong, PRC
300 18
Material: FR4,Halogen Free, Different material mixing laminating
Max panel size: inch*35inch
The standard PCB thickness: mil
Max Aspect Ratio:1:12.5
Min layer by layer spacing: 2mil
Min track width/ gap / 3mil
Min pad size: mil
Surface finishes HASL, Flash Gold, Immersion Gold, Gold finger, OSP
Gold Fingers :
Ni/Au plated: (Ni>5um, Au>0.75um)
Select immersion Ni/Au or Chemical :
Ni/Au: Ni>4um, Au>0.05um
Flash gold plated: Ni>5um, Au>0.075um
Solder mask thickness: 9 +/- 2 um
OSP(ENTEK) thickness: um
 Via holes of Solder mask
Via holes solder mask covered.
Via holes of BGA solder mask plugged, No Sn/Pb in the via holes.
Impedance Control PCB
Controlled Impedance tolerance: up to 50Ω +/- 5 Ω; over 50 Ω +/- 10%
100,000 SqFt. per month, 4000 new jobs tooled monthly
ISO 9001, 14001,

16. Shenzhen Shennan Circuits Co., LTD.

17. Shenzhen Shennan Circuits Co., LTD.
Location
No. of Employees
Years in business
Capabilities
Capacity
Approvals
Shenzhen, Guangdong, PRC
800 22
Double-sided to Multi-layer up to 42
Large format backplanes up to 0.300”
FR1, FR2, CEM1, CEM3, FR4, RCC
Mixed Materials, high frequency,
Aluminum backed PCBs
HAL, Ni/Au plating, OSP
Immersion Gold Plating
HDI microvia blind and buried
Controlled Impedance
One of first IPC members in China
Peelable mask
Single-sided PTH
750,000 SqFt. per month
ISO 9001, 14001, TS 16949, TL 9000

18. Tat Chun PCB Co., Ltd.
Begin with a strong opening, relevant to the topic and your audience. Appeal to your audience’s interests. Your energy and attitude set the tone and provide momentum for the meeting.
Facilitation is a process that helps people communicate and work together. Establish an open environment conducive to problem solving and change.

19. Tat Chun PCB Co., Ltd. Location No. of Employees Years in business
Capabilities
Capacity
Approvals
Zhongshan, Guangdong, PRC
2500 18
Single-sided & Double-sided,
Multi-layer up to 6
XPC, FR1, FR2, CEM1, CEM3, FR4
HAL, Ni/Au plating, OSP
Immersion Gold Plating
Carbon paste surface print
Silver through hole
Peelable mask
Single-sided PTH
3,000,000 SqFt. per month
ISO 9001, 14001, TS 16949

20. H-D Flex Technology Co., LTD.

21. H-D Flex Technology Co., LTD.
Location
No. of Employees
Years in business
Capabilities
Capacity
Approvals
Doumen, Guangdong, PRC
400 3
Single Sided, double sided, multi layer flexible circuits and multi layer rigid flex PCBs
Number Of Layer
Flexible ~8
Rigid-Flex ~10
Material PI PET FR-4 BT
Copper Thickness 1/3oz 1/2oz 1oz max 2oz
Min Board thickness 2mil
Max. Board Thickness 126mil
Max Panel Size 18 X 24inch (460mm x 616mm)
Min. Trace line width and spacing
Single Sided 2mil / 2mil
Double Sided 3mil / 3mil
4 Layers 3mil / 3mil
6 Layers 3mil / 3mil
8 Layers 3mil / 3mil
Min. Hole Diameter 0.05mm(2mil)
Punching 0.30mm(12mil)
240,000 SqFt. per month
ISO , ISO 14000

22. H-D Flex Technology Co., LTD.
Location
No. of Employees
Years in business
Capabilities
Capacity
Approvals
Doumen, Guangdong, PRC
400 3
Single Sided, double sided, multi layer flexible circuits and multi layer rigid flex PCBs
Number Of Layer
Flexible ~8
Rigid-Flex ~10
Material PI PET FR-4 BT
Copper Thickness 1/3oz 1/2oz 1oz max 2oz
Min Board thickness 2mil
Max. Board Thickness 126mil
Max Panel Size 18 X 24inch (460mm x 616mm)
Min. Trace line width and spacing
Single Sided 2mil / 2mil
Double Sided 3mil / 3mil
4 Layers 3mil / 3mil
6 Layers 3mil / 3mil
8 Layers 3mil / 3mil
Min. Hole Diameter 0.05mm(2mil)
Punching 0.30mm(12mil)
240,000 SqFt. per month
ISO , ISO 14000

23. BoardTek Electronic Corporation
Multilayer PCB - BoardTek's main product. To differentiate with most of the PCB shop in Taiwan or Asia, BoardTek take a lot of effort in R&D to fulfill our customer's needs! BoardTek provide higher layer count, blind/buried vias, high performance material, heavy copper foil, impedance control, edge plating, multi-tier, castellation… into traditional multilayer PCB.
High performance laminate material BoardTek can process various material for different application. It includes High Tg, low Dk, low loss, low water absorption like GETEK, Polyimide, Cyanate ester, BT, PPE, and many others. We also specialize in mix-dielectric (or hybrid dielectric) multilayer (Please refer to RF/microwave PCB)
High speed circuits or impedance control PCB BoardTek worked for high speed module like Rambus memory module (RIMM) for many years. We can control the circuit characteristics in single-ended as well as differential impedance control with very tight tolerance (see below). For some application like RIMM, we also control the delta impedance (ΔZ0), propagation delay (Tpd), and ΔTpd by monitor the laminate dielectric constant and thickness.
Blind/buried via PCB For high density PCB application, BoardTek can build multilayer board by sequential lamination and laser via (please refer to Microvia PCB )
Heavy copper BoardTek can process multilayer PCB with very thick copper foil in inner or outer layer for high power PCB application.
High layer count BoardTek keep working with our customer in high layer count multilayer PCB. To improve the layer-to-layer registration, we installed the pin lamination system for this purpose. BoardTek is also plan to setup a new wet process line to increase the board thickness up to 0.25" or even higher.
Others: Laminate material: FR-4, high Tg FR-4, FR-5, GETEK, BT, Polyimide, PPE, PTFE(Teflon), Polyester (GIL), Cyanate ester, Green laminate (halogen free), Ohmega-ply, Resin coated copper foil (RCC), Thermal clad, T-clad Surface finishing: HASL, OSP, immersion Ni/Au, bondable Ni/Au, immersion Ag, immersion Sn Special offer: Castellation, multi-tier, pin insertion, selective plating, press-fit, edge plating…
Charlotte Ku BoardTek Electronic Corporation TEL: EXT, FAX:
Click on picture for PDF brochure

24. BoardTek's Capability Specification Standard Critical Layer count 2~22
28~32
Minimum Line/space
4/4
3/4
Minimum innerlayer core thickness
0.004"
0.003"
Minimum finished hole size (Mechanical drilling)
0.008"
0.006"
Minimum finished hole size (Laser drilling)
Maximum aspect ratio (conventional)
6:1
10:1
Maximum aspect ratio (laser via)
0.5:1
0.7:1
Hole size dimension tolerance
+/-0.003"
+/-0.002"
Minimum pad size (mechanical drilling)
0.018"
0.016"
Minimum pad size (laser drilling)
0.014"
0.012"
Maximum board thickness
0.250"
0.275"
Minimum board thickness (2L)
0.010"
0.005"
Minimum board thickness (4L)
Minimum board thickness (6L)
0.022"
Minimum board thickness (8L)
0.028"
0.024"
Maximum copper foil thickness (IL)
4 oz
5 oz
Maximum copper foil thickness (OL)
8 oz
Impedance control tolerance
+/-10%
+/-6%
Maximum panel size
18" x 22"
22" x 28"
Contour routing dimension tolerance
+/-0.005"
Depth control routing tolerance
+/-0.004"

25. ECMG Contact Information
Name Title
Employee First Name
Middle Initial
Employee Last Name
Nick Name/AKA
Company Name
Division
Title
Mr.
Kevin C.
Arns KC
The ECM Group, LLC.
Electronics Division
President/Principal
Paul S.
Director of Operations
Oscar
Cabahug
Inside Sales/Technical Service
Ms.
IVYMAE
CONCHAS
Ivy
Inside Sales/Customer Service
Dundee A
Espina
Cocoy
Asian Sales Manager
Timothy
Esposito
Tim
Venture Group
VP of Business Development
Brenda M.
Hampton
Corporate Controller
Mrs.
Susan E.
Hledin
Sue
Inside Sales Manger
Anne
Keating
Customer Service
Christopher
Chris
European Sales Manager
Michael
Mike
European Account Manager
Arturo H.
Lopez
Art
Vanessa
Martinez
Robert J.
Mills
Bob
Daniel R.
Pontis
Dan
Director of Sales - West USA
Bipin G.
Shah

26. ECMG Principal Contact Information
Tat Chun:
Dominic Leung
Tat Chun Printed Circuit Board Co., Ltd.
31/F., Aitken Vanson Centre,
No. 61 Hi Yuen Road,
Kwun Tong, Kowloon, Hong Kong.
Tel:
Fax:
Mobile: +852  /
Ellington
Mr David Ng
Guangdong Ellington Electronics Technology Co. Ltd.
88 Gaoping Industrial Zone, Sanjiao town of Zhongshan City,
Zhongshan Guangdong province China
Tel
Shennan:
Jackie Sun
Sales and Marketing Department
Shenzhen Shennan Circuits Co., Ltd.
The CATIC Shahe Industrial Zone, Shenzhen, , China
Tel:         
Fax:       
Cell Phone:
Website:   
    
SFPC:
Mrs. Tracy Leung 
Sales Engineer
Shenzhen Fast-print Circuit Tech Co., Ltd is
TEL:
FAX: or
HD FLEX:
Ms Shouyan Xu (Megan)
Sales Engineering HD-FLEX TECHNOLOGY CO., LTD
Zhufeng Road, Qian Wu Town
Doumen District Zhuhai City, Guangdong Province China
Phone:
Fax:
　 ：
Sun & Lynn PCB
Nancy Li
SHENZHEN SUN & LYNN CIRCUIT CO., LTD
Sun & Lynn industrial zone, Jin Xiu Heyi, shajing town
Bao'an District ,Shenzhen ,Guangdong province, China
Tel：
Fax：

27. ECMG Secondary Offerings
Information on all items below can be sent upon request:
Other Items sourced in China
LCD/LCM
PCBA & Sub-Assembly
Cable Assemblies
Sheet metal & Stamping
Plastic Injection Modeling
CNC machines tooling
Full Box build assembly
Heat Sinks & RFI Shields
Antennas
Cable Assemblies:
Semi-Rigid RF Cables and Flex RF Cables
Earphones
Medical Cables
Wire Harnesses
Wireless and Mobile Antennas
Fiber Optical
Turnkey Solutions / System Integrations:
Electro-Mechanical Assemblies
Box Build and Sub-Systems
Engineering Services
Surface Mount and Through Hole Capability

28. Thank You Very Much!