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http://www.TheECMG.com 1 Presented To: Customer Name Company Name
http://www.TheECMG.com 2 ECMG At a glance –Business created in CY 2001 –Major focus on printed circuit boards –Represent six (6+) complementary China based PCB fabricators –Five (5) offices in North America, two (2) in Europe and one (1) in Asia –Seven (7) outside sales, Three (4) quotation analysts, Three (3) CSRs; Fourteen (14) employees total –ECMG is atypical of most electronics representatives –Provide Global coverage for customers and Principals alike
http://www.TheECMG.com 3 ECMGs Principals Complementary Principals with minimal overlap in product offering, becase we know no one shop can build all technology. Focused on rigid printed circuit boards (All China based) –Guang Dong Ellington Electronics Technology Co.,Ltd Ellington2 to 12 layerLow-med. Tech (LMHV) Large volumeEllington2 to 12 layerLow-med. Tech (LMHV) Large volume –Shenzhen Sun&LYNN Circuits Electronic Co.,Ltd Sun & Lynn2 to 12 layer Low-med tech HMLV (low MOV)Sun & Lynn2 to 12 layer Low-med tech HMLV (low MOV) –Shenzhen Fastprint Circuit Technology Co Ltd SFPCup to 50 layerAll technologies, time critical/QTA ShopSFPCup to 50 layerAll technologies, time critical/QTA Shop –BoardTek Electronic Corporation BoardTek 2 to 26 layerHi tech, Exotic Material, HDI & Metal BackedBoardTek 2 to 26 layerHi tech, Exotic Material, HDI & Metal Backed –Shenzhen Desow Technology Co.,Ltd Desow SS to 28 LayersDesow SS to 28 LayersHMLV PCB & FPC –Shenzhen Shennan Circuits Co., Ltd. Shennan2 to 42 layerHi tech, heavy Cu, XL formatShennan2 to 42 layerHi tech, heavy Cu, XL format –HD-FLEX TECHNOLOGY CO., LTD H-D Flex1 to 8 layer LMLV FLEXIABLE PCBSH-D Flex1 to 8 layer LMLV FLEXIABLE PCBS –Tat Chun Printed Circuit Board Co., Ltd. Tat ChunSS to 6 layerLow tech/hi volumeTat ChunSS to 6 layerLow tech/hi volume Extensive due diligence and customer feedback, world class pricing and quality
http://www.TheECMG.com 4 ECMGs Other Sources Other Items sourced in China –LCD/LCM –PCBA & Sub-Assembly –Cable Assemblies –Sheet metal & Stamping –Plastic Injection Modeling –CNC machines tooling –Full Box build assembly –Heat Sinks & RFI Shields –Antennas Cable Assemblies: –Semi-Rigid RF Cables and Flex RF Cables –Earphones –Medical Cables –Wire Harnesses –Wireless and Mobile Antennas –Fiber Optical Turnkey Solutions / System Integrations: –Electro-Mechanical Assemblies –Box Build and Sub-Systems –Engineering Services –Surface Mount and Through Hole Capability
http://www.TheECMG.com 5 How is ECMG different? PCB experts Significant investment in hardware and software Centralized hub for quoting, order entry/status and technical queries Global footprint Maintain own ftp site for large data package upload and dissemination to principals Direct sales/sales affiliate combination equates to 30+ sales people globally ECMG has an employee based in China
http://www.TheECMG.com 6 The ECMG Advantage Our Principals missions are to provide customers with the highest quality products at world class prices ECMGs mission is to provide a world class link between our Principals and our customers Asian pricing/ with domestic expertise. – Ability to deal with customers during the day in local language and the factories at night A Western face with Eastern advantages
http://www.TheECMG.com 7 Index Philippines (4) St. Louis, MO (6) Longmont, CO (1) Montreal, PQ (2) Budapest, HU (3) Hong, Kong CN (1) New England Area (2)
http://www.TheECMG.com 10 Location No. of Employees Years in business Capabilities Capacity Approvals Zhongshan, Guangdong, PRC 7000 6 Double-sided and Multi-layer to 12 FR1, FR2, CEM1, CEM3, FR4 HAL, Ni/Au plating, OSP ENIG, immersion silver Carbon paste surface print Peelable mask Single-sided PTH HDI, Laser Drilling 2,000,000 SqFt. per month ISO 9001, 14001, TS 16949 Ellington Electronics Technology Co., Ltd.
http://www.TheECMG.com Rev 06.30.0811 Ellington Electronics Technology Co., Ltd. Items ProductionPrototype(<35ft 2 ) Panel Size22 × 27 24 × 30 Max Layer Counts2024 Board Thickness (max)0.25 (min)0.012 0.010 Core Thickness(min)0.003 0.002 Drill Size Mechanical (min)0.008 0.006' Drill Size Laser(min)0.004 0.003 Aspect Ratio0.3340277780.500694444 Line Width Spacing 1/3 oz (outer) 3.5mil/3.5mil3mil/3mil Line Width Spacing 1/2 oz (inner) 3mil/3mil2.5mil/2.5mil Layer to Layer Registration0.004 0.003 Soldermask Plug HoleHole Diameter: 24milHole Diameter: 32mil Min Soldermask Dam0.004 0.003 Impedance Control (50/60/70/100/110/120)+/- 10% (50/60/70/100/110/120)+/-8% Multilayer : Copper Weight (inner) (outer) 4oz5 oz 3oz4oz Double Side: Copper Weight5oz6oz Buried ViaYes Blind ViaYes Rambus28 Ohm +/-10%28 Ohm ± 8% HDI1+N+1 4mil Via hole2+N+2 4mil Via hloe Items ProductionPrototype(<35ft 2 ) Surface Finishing HASL Selective immersion gold plating Entek HASL Immersion Gold v Flash Gold Entek Contact Finger Gold Plating Glicoat Carbon Ink Immersion Gold Immersion Sliver Flash Gold Immersion Tin Contact Finger Gold Plating Carbon Ink Immersion Sliver Immersion Tin Green Technology OSP Laminate for lead-free processing Immersion Gold Halogen free material Flash Gold Immersion Silver Immersion Tin
http://www.TheECMG.com 12 SHENZHEN SUN & LYNN CIRCUIT CO., LTD
http://www.TheECMG.com 13 SHENZHEN SUN & LYNN CIRCUIT CO., LTD Location No. of Employees Years in business Capabilities Capacity Approvals Bao An region of Shenzhen 1700 10 Double-sided and Multi-layer to 12 FR1, FR2, CEM1, CEM3, FR4 HAL, Ni/Au plating, OSP ENIG, immersion silver Carbon paste surface print Peelable mask Single-sided PTH 700,000 SqFt. per month ISO 9001, 14001, TS 16949
http://www.TheECMG.com 14 Shenzhen Fastprint Circuit Technology Co., LTD. Largest QTA/Proto/small volume shop in China 24 hour to 7 day turns
http://www.TheECMG.com 15 Shenzhen Fastprint Circuits Co., LTD. Location No. of Employees Years in business Capabilities Capacity Approvals Shenzhen, Guangdong, PRC 300 18 Material: FR4,Halogen Free, Different material mixing laminating Max panel size: 23inch*35inch The standard PCB thickness: 8.3-220mil Max Aspect Ratio:1:12.5 Min layer by layer spacing: 2mil Min track width/ gap 3/ 3mil Min pad size: 16mil Surface finishes HASL, Flash Gold, Immersion Gold, Gold finger, OSP Gold Fingers : Ni/Au plated: (Ni>5um, Au>0.75um) Select immersion Ni/Au or Chemical : Ni/Au: Ni>4um, Au>0.05um Flash gold plated: Ni>5um, Au>0.075um Solder mask thickness: 9 +/- 2 um OSP(ENTEK) thickness: 0.30-0.16um Via holes of Solder mask Via holes solder mask covered. Via holes of BGA solder mask plugged, No Sn/Pb in the via holes. Impedance Control PCB Controlled Impedance tolerance: up to 50Ω +/- 5 Ω; over 50 Ω +/- 10% 100,000 SqFt. per month, 4000 new jobs tooled monthly ISO 9001, 14001,
http://www.TheECMG.com 17 Shenzhen Shennan Circuits Co., LTD. Location No. of Employees Years in business Capabilities Capacity Approvals Shenzhen, Guangdong, PRC 800 22 Double-sided to Multi-layer up to 42 Large format backplanes up to 0.300 FR1, FR2, CEM1, CEM3, FR4, RCC Mixed Materials, high frequency, Aluminum backed PCBs HAL, Ni/Au plating, OSP Immersion Gold Plating HDI microvia blind and buried Controlled Impedance One of first IPC members in China Peelable mask Single-sided PTH 750,000 SqFt. per month ISO 9001, 14001, TS 16949, TL 9000
http://www.TheECMG.com 18 Tat Chun PCB Co., Ltd.
http://www.TheECMG.com 19 Tat Chun PCB Co., Ltd. Location No. of Employees Years in business Capabilities Capacity Approvals Zhongshan, Guangdong, PRC 2500 18 Single-sided & Double-sided, Multi-layer up to 6 XPC, FR1, FR2, CEM1, CEM3, FR4 HAL, Ni/Au plating, OSP Immersion Gold Plating Carbon paste surface print Silver through hole Peelable mask Single-sided PTH 3,000,000 SqFt. per month ISO 9001, 14001, TS 16949
http://www.TheECMG.com 21 H-D Flex Technology Co., LTD. Location No. of Employees Years in business Capabilities Capacity Approvals Doumen, Guangdong, PRC 400 3 Single Sided, double sided, multi layer flexible circuits and multi layer rigid flex PCBs Number Of Layer Flexible 1~8 Rigid-Flex 2~10 MaterialPI PET FR-4 BT Copper Thickness 1/3oz 1/2oz 1oz max 2oz Min Board thickness2mil Max. Board Thickness 126mil Max Panel Size18 X 24inch (460mm x 616mm) Min. Trace line width and spacing Single Sided 2mil / 2mil Double Sided 3mil / 3mil 4 Layers3mil / 3mil 6 Layers3mil / 3mil 8 Layers3mil / 3mil Min. Hole Diameter 0.05mm(2mil) Punching0.30mm(12mil) 240,000 SqFt. per month ISO 9001-2000, ISO 14000
http://www.TheECMG.com 22 H-D Flex Technology Co., LTD. Location No. of Employees Years in business Capabilities Capacity Approvals Doumen, Guangdong, PRC 400 3 Single Sided, double sided, multi layer flexible circuits and multi layer rigid flex PCBs Number Of Layer Flexible 1~8 Rigid-Flex 2~10 MaterialPI PET FR-4 BT Copper Thickness 1/3oz 1/2oz 1oz max 2oz Min Board thickness2mil Max. Board Thickness 126mil Max Panel Size18 X 24inch (460mm x 616mm) Min. Trace line width and spacing Single Sided 2mil / 2mil Double Sided 3mil / 3mil 4 Layers3mil / 3mil 6 Layers3mil / 3mil 8 Layers3mil / 3mil Min. Hole Diameter 0.05mm(2mil) Punching0.30mm(12mil) 240,000 SqFt. per month ISO 9001-2000, ISO 14000
http://www.TheECMG.com 23 BoardTek Electronic Corporation Multilayer PCB - BoardTek's main product. To differentiate with most of the PCB shop in Taiwan or Asia, BoardTek take a lot of effort in R&D to fulfill our customer's needs! BoardTek provide higher layer count, blind/buried vias, high performance material, heavy copper foil, impedance control, edge plating, multi-tier, castellation… into traditional multilayer PCB.Multilayer PCB High performance laminate material BoardTek can process various material for different application. It includes High Tg, low Dk, low loss, low water absorption like GETEK, Polyimide, Cyanate ester, BT, PPE, and many others. We also specialize in mix-dielectric (or hybrid dielectric) multilayer (Please refer to RF/microwave PCB)RF/microwave PCB High speed circuits or impedance control PCB BoardTek worked for high speed module like Rambus memory module (RIMM) for many years. We can control the circuit characteristics in single-ended as well as differential impedance control with very tight tolerance (see below). For some application like RIMM, we also control the delta impedance (ΔZ0), propagation delay (Tpd), and ΔTpd by monitor the laminate dielectric constant and thickness. Blind/buried via PCB For high density PCB application, BoardTek can build multilayer board by sequential lamination and laser via (please refer to Microvia PCB )Microvia PCB Heavy copper BoardTek can process multilayer PCB with very thick copper foil in inner or outer layer for high power PCB application. High layer count BoardTek keep working with our customer in high layer count multilayer PCB. To improve the layer-to-layer registration, we installed the pin lamination system for this purpose. BoardTek is also plan to setup a new wet process line to increase the board thickness up to 0.25" or even higher. Others: Laminate material: FR-4, high Tg FR-4, FR-5, GETEK, BT, Polyimide, PPE, PTFE(Teflon), Polyester (GIL), Cyanate ester, Green laminate (halogen free), Ohmega- ply, Resin coated copper foil (RCC), Thermal clad, T-clad Surface finishing: HASL, OSP, immersion Ni/Au, bondable Ni/Au, immersion Ag, immersion Sn Special offer: Castellation, multi-tier, pin insertion, selective plating, press-fit, edge plating… Charlotte Ku BoardTek Electronic Corporation TEL: 886-3-4839611 EXT,1411 FAX: 886-3-4839620 E-MAIL: email@example.com Click on picture for PDF brochure
http://www.TheECMG.com 24 BoardTek's Capability SpecificationStandardCritical Layer count2~2228~32 Minimum Line/space4/43/4 Minimum innerlayer core thickness0.004"0.003" Minimum finished hole size (Mechanical drilling)0.008"0.006" Minimum finished hole size (Laser drilling)0.004"0.003" Maximum aspect ratio (conventional)6:110:1 Maximum aspect ratio (laser via)0.5:10.7:1 Hole size dimension tolerance+/-0.003"+/-0.002" Minimum pad size (mechanical drilling)0.018"0.016" Minimum pad size (laser drilling)0.014"0.012" Maximum board thickness0.250"0.275" Minimum board thickness (2L)0.010"0.005" Minimum board thickness (4L)0.016"0.012" Minimum board thickness (6L)0.022"0.018" Minimum board thickness (8L)0.028"0.024" Maximum copper foil thickness (IL)4 oz5 oz Maximum copper foil thickness (OL)5 oz8 oz Impedance control tolerance+/-10%+/-6% Maximum panel size18" x 22"22" x 28" Contour routing dimension tolerance+/-0.005"+/-0.003" Depth control routing tolerance+/-0.004"+/-0.002"
http://www.TheECMG.com 25 ECMG Contact Information Name TitleEmployee First Name Middle Initial Employee Last Name Nick Name/AKACompany NameDivisionTitle Mr.KevinC.ArnsKCThe ECM Group, LLC.Electronics DivisionPresident/Principal Mr.PaulS.ArnsPaulThe ECM Group, LLC.Electronics DivisionDirector of Operations Mr.Oscar CabahugOscarThe ECM Group, LLC.Electronics DivisionInside Sales/Technical Service Ms.IVYMAEC.CONCHASIvyThe ECM Group, LLC.Electronics DivisionInside Sales/Customer Service Mr.DundeeAEspinaCocoyThe ECM Group, LLC.Electronics DivisionAsian Sales Manager Mr.Timothy EspositoTimThe ECM Group, LLC.Venture GroupVP of Business Development Ms.BrendaM.HamptonBrendaThe ECM Group, LLC.Electronics DivisionCorporate Controller Mrs.SusanE.HledinSueThe ECM Group, LLC.Electronics DivisionInside Sales Manger Mrs.Anne KeatingAnneThe ECM Group, LLC.Electronics DivisionCustomer Service Mr.Christopher KeatingChrisThe ECM Group, LLC.Electronics DivisionEuropean Sales Manager Mr.Michael KeatingMikeThe ECM Group, LLC.Electronics DivisionEuropean Account Manager Mr.ArturoH.LopezArtThe ECM Group, LLC.Electronics DivisionInside Sales/Customer Service Mrs.VanessaE.MartinezVanessaThe ECM Group, LLC.Electronics DivisionCustomer Service Mr.RobertJ.MillsBobThe ECM Group, LLC. President/Principal Mr.DanielR.PontisDanThe ECM Group, LLC.Electronics DivisionDirector of Sales - West USA Mr.BipinG.ShahBipinThe ECM Group, LLC.Electronics DivisionCustomer Service
http://www.TheECMG.com 26 ECMG Principal Contact Information Tat Chun: Dominic Leung Tat Chun Printed Circuit Board Co., Ltd. 31/F., Aitken Vanson Centre, No. 61 Hi Yuen Road, Kwun Tong, Kowloon, Hong Kong. Tel: +852 3579 6017 Fax: +852 2415 3158 Mobile: +852 9228 6593 / +86 136 5238 4229 Email: firstname.lastname@example.org@tatchunpcb.com.hk Ellington Mr David Ng Guangdong Ellington Electronics Technology Co. Ltd. 88 Gaoping Industrial Zone, Sanjiao town of Zhongshan City, Zhongshan Guangdong province China 528445 Tel. +86-760-540-9988 Email: email@example.com@ellingtonpcb.com Shennan: Jackie Sun Sales and Marketing Department Shenzhen Shennan Circuits Co., Ltd. The CATIC Shahe Industrial Zone, Shenzhen, 518053, China Tel: 86-755-8610 6462 86-755-8609 5314 Fax: 86-755-8609 5224 Cell Phone: 86-13480616906 Website: www.shennan.com.cnwww.shennan.com.cn E-mail: firstname.lastname@example.org@shennan.com.cn SFPC: Mrs. Tracy Leung Sales Engineer Shenzhen Fast-print Circuit Tech Co., Ltd is TEL: +86-755-26073471 FAX:+86-755-26074417 or +86-755-26074446 E-mail: email@example.com@chinafastprint.com HD FLEX: Ms Shouyan Xu (Megan) Sales Engineering HD-FLEX TECHNOLOGY CO., LTD Zhufeng Road, Qian Wu Town Doumen District Zhuhai City, Guangdong Province China firstname.lastname@example.org email@example.com MSN:firstname.lastname@example.org skype:email@example.com Phone: 86 756 3933780-227 Fax: 86 756 3933778 WWW.HD-FLEX.COM WWW.HD-FLEX.COM Email HD-FLEX@HD-FLEX.COMHD-FLEX@HD-FLEX.COM Sun & Lynn PCB Nancy Li SHENZHEN SUN & LYNN CIRCUIT CO., LTD Sun & Lynn industrial zone, Jin Xiu Heyi, shajing town Bao'an District,Shenzhen,Guangdong province, China 518128 Tel +86-755-27280399 Fax +86-755-27507268 E-mail: firstname.lastname@example.org@slpcb.net www.slpcb.com
http://www.TheECMG.com ECMG Secondary Offerings Information on all items below can be sent upon request: Other Items sourced in China –LCD/LCM –PCBA & Sub-Assembly –Cable Assemblies –Sheet metal & Stamping –Plastic Injection Modeling –CNC machines tooling –Full Box build assembly –Heat Sinks & RFI Shields –Antennas Cable Assemblies: –Semi-Rigid RF Cables and Flex RF Cables –Earphones –Medical Cables –Wire Harnesses –Wireless and Mobile Antennas –Fiber Optical Turnkey Solutions / System Integrations: –Electro-Mechanical Assemblies –Box Build and Sub-Systems –Engineering Services –Surface Mount and Through Hole Capability 27