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Global Expert Technologies. Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities.

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Presentation on theme: "Global Expert Technologies. Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities."— Presentation transcript:

1 Global Expert Technologies

2 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

3 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

4 Global Expert Technologies HK-based company with manufacturing in Huizhou Focus on PCB manufacturing Low to Mid volume production Specialised on technically-challenging processes / products Diversified customer base and business segments Relentless commitments to Quality Stringent management in environmental control Passion in social responsibilities

5 Company Milestone 2002 Trading Drilling & Film Plotting Obtained UL 2012 Phase 4 Expansion (Inner Layer) Completed 2007 Phase 2 Expansion Completed 2003 Huizhou Plant Phase 1 Completed 2004 Accredited ISO9001 and TL9000 Obtained ISO Obtained ISO Phase 3 Expansion Completed Roll out Quick Turn Services

6 Corporate Culture Our Philosophy Having Quality People and Providing Quality Products Our Mission To satisfy our customers needs, provide highly professional service and deliver product excellence Our Environmental Commitments To produce environmental friendly products and apply comprehensive environmental protection strategies throughout the manufacturing process

7 Account Management – One-Stop Solution Order Placement Technical communication Contract Review Enquiry/Quotation Quality Improvement Follow-up Services Delivery Production Customer Account Manager You may always escalate issue to our director, Terence Khoo

8 Buyers Engagement Process RFQ Quotation Order Placement Engrg Query Advise Delivery Schedule Production Technical Clarification Y N Ship Buyer GET Action GET response within 24 hrs 1-3 days production lead times same day

9 Lead Time & MOV Layer Standard Lead Time (Weeks) MOV (USD) Quick Turn Lead Time (Days) MOV (USD) 22-3$ $ $ 1,0007-8$ $ 1, $ 2, $ 4,000 Note: Lead time is calculated after confirmation of orders and all engineering queries.

10 Global Business ….. Customers from more than 50 countries West Europe China East Europe Asia America South Africa Argentina Turkey Ukraine IRAN Malaysia

11 Product Breakdown Data : End 2011 Layer Count Product Segment

12 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

13 Quality Certificates Accredited

14 Environmental Commitment GET is a Green PCB Enterprise A Model Enterprise awarded by Huizhou government in Tons Waste Treatment FacilityRecycle Water System

15 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

16 Huizhou – A Green City with Rich History Huizhou lies strategically next to Guangzhou, Dongguan, Shenzhen and Hong Kong, with easy access to major air and sea ports in the fastest-growing region in the world. Huizhous two state-level development zones, Daya Bay Economic Development Zone and Zhongkai Hi-tech Industrial Park, Huizhou are home to manufacturing base of many MNCs like LG, Samsung, Lenovo, TCL/Thomson and etc. Huizhou was founded in 214 BC after Qin unified China and Emperor Qinshihuang set up the Boluo County. With permanent residents at 3.77 million. Huizhou has won numerous awards in China as a city, including China Top Tourism City, China Clean City, China Forestation City, Example City in Environment Protection, China Top 10 Gardening City, Best Residence Award, and China Leading City in Civilization etc. Hong Kong Macau

17 Huizhou Manufacturing Facility Total Floor Area : Total Floor Area : 16,600 m 2 Work Force: Work Force:400 Annual Capacity: Annual Capacity: 500,000 m 2

18 1. Engineering (CAD/CAM) 4. CNC Drilling 5. Automatic Panel Plating Line 7. Automatic ENIG Plating Line 6. Stripping, Etching and Tin Stripping 8. Dry Film Imaging 10. Flying-probe Test 9. Dry Film Development 11. E-Test 12. Final QC 2. Mass Lamination 3. Automatic Optical Inspection

19 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

20 Process and Product Capabilities PRODUCTFINISHINGLAMINATESBOARD THICKNESS Rigid PCB Multi-layer 26 layers Double Sided Heavy Copper PCB (6oz finished) Hot Air Leveling /HASL (lead free) Immersion Gold,Immersion Silver Gold Fingers Carbon Ink, OSP FR-4, Roger, High TG FR-4, Halogen Free FR-4, 0.2~5.0mm (8 – 200 mil) MIN FINISHED HOLE SIZE SOLDER MASK INKOUTLINE PROFILE MAX. PANEL SIZE Laser Drill:0.10mm(4mil) Tolerance:0.01mm Mechanical Drilling: MIN:0.15mm Tolerance: ± 0.05mm (PTH) ±0.03mm (NPTH) Aspect rate: 1:8 LPI Soldermask Peelable Soldermask Punching, Routing, Punch And Push Back 476mm X 620mm (18.7X24)

21 Technology Advancements GET has a dedicated team focus on Research and Development Blind via Buried via Back panel Half-moon hole Immersion gold Chemical tin HAL (lead free) Lead Free Products Immersion Silver Gold Finger Rogers+FR4 HDI Micro-Vias Al Base PCB Trace Space /Width: 0.075mm Min. Finished Hole Size: 0.15mm 4/L : 0.40mm Board thickness Plugged via- holes with resin NPG TG150 PCB 2010 Aspect ratio 1:10 Quick Turn Service


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