Presentation on theme: "BTEC First Engineering"— Presentation transcript:
1BTEC First Engineering Learning aim A Know about engineering processes used to produce modern engineered products
2Surface mountSurface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.
3Printed circuit boardElectronic circuits in schools and industry are normally manufactured through the use of PCBs (Printed Circuit Boards). The boards are made from glass reinforced plastic with copper tracks in the place of wires Components are fixed in position by drilling holes through the board, locating the components and then soldering them in place. The copper tracks link the components together forming a circuit.
4Process of manufacturing a PCB and SMT Printed circuit board (PCB) manufactureThe Surface Mount Technology (SMT) process184.108.40.206.220.127.116.11.5.5.6.
5Process of manufacturing a PCB and SMT Printed circuit board (PCB) manufactureThe Surface Mount Technology (SMT) processComponents are soldered to the surface of the boardProducing the artworkThe finished board is then inspected for imperfectionsDesigning the layoutConveyor belts are used to transport the boards to the reflow soldering ovenPCB etchingPopulating the board and solderingThe board is heated to a temperature that melts the solder plateDrilling the boardPlace components using pick and place robotApply solder paste to copper pads