Multi-IO board and FE-I4 emulator F. Hügging Review of FE-I4 CERN, 04-11-2009 University of Bonn.

Slides:



Advertisements
Similar presentations
Controller Tests Stephen Kaye Controller Test Motivation Testing the controller before the next generation helps to shake out any remaining.
Advertisements

Ancillary firmware for the NSW Trigger Processor Lorne Levinson, Weizmann Institute for the NSW Trigger Processor Working Group NSW Electronics Design.
Digital RF Stabilization System Based on MicroTCA Technology - Libera LLRF Robert Černe May 2010, RT10, Lisboa
PXL RDO System Requirements And meeting goals 11/12/2009BNL_CD-1_SENSOR_RDO - LG1.
V. Filimonov, T. Hemperek, F. Hügging, H. Krüger, N. Wermes
Using the EUDET pixel telescope for resolution studies on silicon strip sensors with fine pitch Thomas Bergauer for the SiLC R&D collaboration 21. May.
Aztec PC Oscilloscope Michael Mason Jed Brown Josh Price Andrew Youngs.
David Nelson STAVE Test Electronics July 1, ATLAS STAVE Test Electronics Preliminary V3 Presented by David Nelson.
RCU Status 1.RCU hardware 2.Firmware/Software 3.Test setups HiB, UiB, UiO.
Team Members Jordan Bennett Kyle Schultz Min Jae Lee Kevin Yeh.
Time Division Multiplexing School of Physics and Astronomy Department of Particle Physics Elissavet Papadima 29/5/2014.
Institute of Experimental and Applied Physics Czech Technical University in Prague 11th December 2007 Michal Platkevič RUIN Rapid Universal INterface for.
Mathieu Goffe EUDET JRA1 meeting, DESY Wednesday 30 January 2008 IPHC, 23 rue du Loess BP 28, 67037, Strasbourg Cedex 02, France.
Tobias Haas DESY 7 November 2006 A Pixel Telescope for Detector R&D for an ILC Introduction: EUDET Introduction: EUDET Pixel Telescope Pixel Telescope.
5 March DCS Final Design Review: RPC detector The DCS system of the Atlas RPC detector V.Bocci, G.Chiodi, E. Petrolo, R.Vari, S.Veneziano INFN Roma.
Electronics for PS and LHC transformers Grzegorz Kasprowicz Supervisor: David Belohrad AB-BDI-PI Technical student report.
Schutzvermerk nach DIN 34 beachten XC200 Hardware Overview.
Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.
Pinewood Derby Timing System Using a Line-Scan Camera Rob Ostrye Class of 2006 Prof. Rudko.
FPGA IRRADIATION and TESTING PLANS (Update) Ray Mountain, Marina Artuso, Bin Gui Syracuse University OUTLINE: 1.Core 2.Peripheral 3.Testing Procedures.
DLS Digital Controller Tony Dobbing Head of Power Supplies Group.
U N C L A S S I F I E D FVTX Detector Readout Concept S. Butsyk For LANL P-25 group.
Understanding Data Acquisition System for N- XYTER.
Leo Greiner IPHC meeting HFT PIXEL DAQ Prototype Testing.
J. Christiansen, CERN - EP/MIC
C.Schrader; Oct 2008, CBM Collaboration Meeting, Dubna, Russia R/O concept of the MVD demonstrator C.Schrader, S. Amar-Youcef, A. Büdenbender, M. Deveaux,
RCU Status 1.RCU design 2.RCU prototypes 3.RCU-SIU-RORC integration 4.RCU system for TPC test 2002 HiB, UiB, UiO.
Parallel Data Acquisition Systems for a Compton Camera
Leo Greiner PIXEL Hardware meeting HFT PIXEL detector LVDS Data Path Testing.
Xiangming Sun1PXL Sensor and RDO review – 06/23/2010 STAR XIANGMING SUN LAWRENCE BERKELEY NATIONAL LAB Firmware and Software Architecture for PIXEL L.
Development of Programmable Architecture for Base-Band Processing S. Leung, A. Postula, Univ. of Queensland, Australia A. Hemani, Royal Institute of Tech.,
Fast Fault Finder A Machine Protection Component.
FE-I4 Test Setup Hardware Needs: Boards & Interfaces March 1 st 2010, Marlon Barbero.
Test Setup for FE-I3 single chips / modules, FE-I4_proto1 and for full scale FE-I4 Marlon Barbero, Bonn.
1 07/10/07 Forward Vertex Detector Technical Design – Electronics DAQ Readout electronics split into two parts – Near the detector (ROC) – Compresses and.
Bart Hommels (for Matthew Wing) EUDET ext. steering board JRA3 DAQ System DAQ System Availability updates: – DIF: Detector Interface – LDA:
IPHC - DRS Gilles CLAUS 04/04/20061/20 EUDET JRA1 Meeting, April 2006 MAPS Test & DAQ Strasbourg OUTLINE Summary of MimoStar 2 Workshop CCMOS DAQ Status.
DEPARTEMENT DE PHYSIQUE NUCLEAIRE ET CORPUSCULAIRE JRA1 - Data Acquisition Status Report Daniel Haas DPNC Genève Extended SC Meeting 1 Sep 2008.
ZPD Project Overview B A B AR L1 DCT Upgrade FDR Masahiro Morii Harvard University Design Overview Progress and Changes since CDR Current Status Plans.
Sensor testing and validation plans for Phase-1 and Ultimate IPHC_HFT 06/15/ LG1.
1 Calorimeter electronics Upgrade Outcome of the meeting that took place at LAL on March 9th, 2009 Calorimeter Upgrade Meeting Barcelona March 10th-11st,
USBPix software status and plans Dr. Jens Weingarten.
JRA-1 Meeting, Jan 25th 2007 A. Cotta Ramusino, INFN Ferrara 1 EUDRB: A VME-64x based DAQ card for MAPS sensors. STATUS REPORT.
1 Test Setups for the FE-I4 Integrated Circuit Stewart Koppell 8/1/2010.
STAR Pixel Detector readout prototyping status. LBNL-IPHC-06/ LG22 Talk Outline Quick review of requirements and system design Status at last meeting.
Guirao - Frascati 2002Read-out of high-speed S-LINK data via a buffered PCI card 1 Read-out of High Speed S-LINK Data Via a Buffered PCI Card A. Guirao.
1 Level 1 Pre Processor and Interface L1PPI Guido Haefeli L1 Review 14. June 2002.
A commercially available digitization system Fotiou Andreas Andreas Fotiou.
ALIBAVA system upgrade Ricardo Marco-Hernández IFIC(CSIC-Universidad de Valencia) 1 ALIBAVA system upgrade 16th RD50 Workshop, 31 May-2 June 2010, Barcelona.
Plans and Progress on the FPGA+ADC Card Pack Chris Tully Princeton University Upgrade Workshop, Fermilab October 28, 2009.
Scott Mandry, EUDET JRA1 Meeting, DESY 30 th January ISIS1 Testbeam EUDET JRA1 Meeting, DESY 30 th January 2008 Scott Mandry LCFI Collaboration.
DEPARTEMENT DE PHYSIQUE NUCLEAIRE ET CORPUSCULAIRE FACULTÉ DES SCIENCES UNIVERSITÉ DE GENÈVE EUDET JRA1 Meeting Munich October 2006 DAQ Status Emlyn Corrin.
AHCAL Electronics. Status of Integration Mathias Reinecke for the DESY AHCAL developers AHCAL main and analysis meeting Hamburg, July 16th and 17th, 2009.
Vladimir Zhulanov for BelleII ECL group Budker INP, Novosibirsk INSTR2014, Novosibirsk 2014/02/28 1.
DHH Status Igor Konorov TUM, Physics Department, E18 PXD DAQ workshop Münzenberg –June 9-10, 2011.
Bart Hommels for the DIF WG Electronics/DAQ for EUDET, DESY DIF status AHCAL, DHCAL, ECAL DIF prototypes Ongoing developments & plans.
1 of 24 The new way for FPGA & ASIC development © GE-Research.
29/05/09A. Salamon – TDAQ WG - CERN1 LKr calorimeter L0 trigger V. Bonaiuto, L. Cesaroni, A. Fucci, A. Salamon, G. Salina, F. Sargeni.
Eric Hazen1 Ethernet Readout With: E. Kearns, J. Raaf, S.X. Wu, others... Eric Hazen Boston University.
FEI4B simulation model for IBL and DBM DAQ development CERN, 29. November 2013 Aleš Svetek J. Stefan Institute, CERN.
Stave Emulator for sLHC Prototyping L. Gonella, A. Eyring, F. Hügging, H. Krüger Physikalisches Institut, Uni Bonn.
The Jülich Digital Readout System for PANDA Developments
LHC1 & COOP September 1995 Report
CALICE DAQ Developments
AHCAL Beam Interface (BIF)
PyBAR Firmware Structure and Operation Experience
ETD meeting Electronic design for the barrel : Front end chip and TDC
USB Pixel 3D System Update I-Beam Simulation
Silicon Lab Bonn Physikalisches Institut Universität Bonn
Table 1: The specification of the PSICM and the ePSICM Prototypes
Presentation transcript:

Multi-IO board and FE-I4 emulator F. Hügging Review of FE-I4 CERN, University of Bonn

Introduction Work on test systems was initiated one year ago because maintenance and rebuilding of the TPLL/TPCC system turned out to be difficult. Proposed a “Lightweight”/low-cost replacement/addition for the TPLL/TPCC system. –based on “S3 Multi-IOBoard“ used as well for several other applications in Bonn. –limited FPGA/memory resources: no DSP, no dedicated programmable delay lines. Build & commisioned the S3 Multi-IOBoard as test system for FE-I3 single chips during the last year  USBPix. Decided to use this test system as a basis for the system for the FE-I4 chip and (small) module testing. –TPLL/TPC and TurboDAQ will not be developed for supporting FE-I4. FE-I4 ReviewFabian Hügging, University of Bonn2

USBPix Hardware FE-I4 ReviewFabian Hügging, University of Bonn3

USBpix – Some Specs USB/FPGA Board (S3MultiIOBoard) –15 Mbyte/sec FPGA  PC data transfer speed –2 Mbyte SRAM –Xilinx XC3S1000 FPGA –LVDS and TTL IOs (for ext. trigger, TDC etc.) –8051 USB microcontroller –Drivers for Windows XP and Linux Adapter Card –support of FE-I3 single chip cards or modules –LVDS RX/TX –on board ADC for current, voltage and temperature measurement (NTC ) FE-I4 ReviewFabian Hügging, University of Bonn4

Firmware Structure 8051 µC USB configuration state machine strobe & LV1 state machine data receiver state machine reset/sync state machine read data buffer & event builder write data buffer (par  ser) data memory LD DI CCK SYNC RST LV1 DO1 DO2 histogramming state machine scan routines full chip scan data: 2880px  256 steps  8bit data clock XCK USB controller FPGA external STRB external trigger master state machine FE-I4 ReviewFabian Hügging, University of Bonn5

USBPix – Status Hardware: ~20 boards already delivered FPGA firmware ready Microcontroller firmware enhancements for hardware controlled scans under development two readout-modes implemented: –run mode: full hit information storage in SRAM (tested - works) –calibration mode: histograms for all pixels stored in SRAM for parameter scan (tested - works) Software (Qt based WinXP & Linux): USBPixDll – communicates with HW, handles configuration data and hit information, provides access to data to GUIs (authors: Malte Backhaus, Hans Krüger) two GUIs available: small, simple Test application (USBPixTest) for testing the communication to HW and testing FE-I3, incl. Th-scans and plotting/fitting data (no external libraries needed), author: Malte Backhaus Fully featured application (STControl) using PixLib and ROOT, authors: Jens Weingarten, Jörn Grosse-Knetter FE-I4 ReviewFabian Hügging, University of Bonn6

Firmware Development Status FPGA USB Microcontroller FE-I4 ReviewFabian Hügging, University of Bonn7

STControl USBPixTest FE-I4 ReviewFabian Hügging, University of Bonn 8 Application software More details by Jens Weingarten

“software” controlled scan: pixel mask and scan values controlled via USBpixTest. 40 sec. for threshold scan of all pixels (256 scan steps, 100 inject pulses each), slightly faster than TurboPLL/PCC. scan routine is implemented in “software” or in “hardware” controlled by microcontroller. (basically no change in speed  limited by strobe, trigger timing). same noise performance as with TurboPLL/PCC setup. FE-I4 ReviewFabian Hügging, University of Bonn9 System performance

Commissioning Status 19 systems have been ordered –CERN –DESY –University of Dortmund –University of Göttingen –University of Hamburg –IFAE Barcelona –Iowa State University –KEK –MPI Munich –LBNL –University of New Mexico –University of California Santa Cruz –SLAC –Stony Brook University shipping of the hardware finished software will be distributed from SVN repository at bonn.de/twiki/bin/view/Systems/UsbPixhttp://icwiki.physik.uni- bonn.de/twiki/bin/view/Systems/UsbPix Still some debugging of the code ongoing FE-I4 ReviewFabian Hügging, University of Bonn10

USBPix for FE-I4: Why? Can serve as chip and (small) module FE-I4 test system. Will be used together with dedicated probe card as a wafer probing system. Application software development is more or less decoupled from hardware and can be used for other hardware platforms as well. Main parts of the hardware are already in the field Hardware support for testbeam usage (EUDET) and irradaition is already integrated.  USBPix FE-I4 serves as chip and module test system at least for the prototype phase of the IBL 11FE-I4 ReviewFabian Hügging, University of Bonn

USBPix for FE-I4: What is needed? New adapter boards needed. –Bonn will do this. –Easy and fast to do. New firmware code for FE-I4 needed. –Bonn will do this. –most important and a major part of the work. –already started to program the Verilog code of the FE-I4 to a commercial USB board which can be used as test bench for firmware development of the USBPix. Hardware upgrade of USBPix board can be done. –more SRAM for accommodate bigger chip size could be helpful. –relatively easy. –but for a first step for FE-I4 testing the current hardware should be sufficient only with a firmware update. Application software development relies on the further development of PixLib/STControl software. –certainly one major part of the job  see J. Weingarten talk. 12FE-I4 ReviewFabian Hügging, University of Bonn

Limitations of the USBPix Limited data transfer rate (USB2.0). –higher parallelization of module/chip testing as may be needed for production is unlikely. Maximum timing accuray of the output of the FPGA is 1ns. –No dedicated programmable delay lines. –This limits the precision of timewalk and other time dependent measurements. Limitations in higher level data analysis function inside the FPGA. –Not clear whether fitting of histograms etc. is possible inside the FPGA. 13FE-I4 ReviewFabian Hügging, University of Bonn

Firmware development for FE-I4 One crucial point for adapting the USBPix system in time for FE-I4 is the firmware development. Need a FE-I4 emulator to allow realistic firmware development before FE-I4 arrives. Uses a spin-off of the stave emulator test bench (developed for SLHC upgrade purposes) –“Module units“ are perfect candidates for the FE-I4 emulator. FE-I4 ReviewFabian Hügging, University of Bonn14 add-on board FPGA card FPGA board Virtex 4 End of stave emulator unit (FPGA board + interface board + DCS card) Up to 8 module emulator units (FPGA card + add-on board)... DCS USB GBT interface card

FPGA Board for FE-I4 Emulator commercial FPGA board (Trenz TEO300B) with: –Spartan XC3S1600E. –64 Mbyte DDR RAM. –32 Mbit Flash. –USB interface. Approx. size of a 2x2 FE-I4 chip module. Uses dedicated adapter board for interconnection to several systems: –As module unit for stave emulator test bench. –As single FE-I4 chip to connect to the USBPix system. Status of module unit as FE-I4 emulator: –Some part of the FE-I4 data output protocol already implemented in the FPGA (including 8/10 bit encoding) –Implementatiopn of the FE-I4 code to the FPGA started. –Interconnection board design started mm 47.5 mm (Trenz TEO300B) Module emulator unit FE-I4 ReviewFabian Hügging, University of Bonn15

Further Aspects Up to now firmware development concentrates on operating the FE-I4 chip: –Write/read register. –Digital & analog scanning, etc. Scan Chain support as needed for structural testing can be implemented as well into the USBPix FPGA: –requires a new branch of the FPGA firmware. –must be supported from the application software. Hardware upgrade possibilities: –More on-board memory might be needed since the pixel number is now 10 times higher as for FE-I3 ( vs. 2880). –A more powerful FPGA could help with higher level analysis functions. –Can either upgrade the existing S3Multi-IOBoard or use an already existing development (Virtex 4 Board) which uses the same USB interface and offers many more features. FE-I4 ReviewFabian Hügging, University of Bonn16

Virtex 4 board – some technical specs. 32 MB DDR2 memory Connector for USB interface high speed add-on board connectors 32 LVDS pairs + 26 CMOS I/O Virtex 4LX40 FPGA RJ-45 connector to TLU (trigger logic unit) FE-I4 ReviewFabian Hügging, University of Bonn17

Summary USBPix successfully commissioned for testing FE-I3 single chips. The modular design of USBPix in terms of hardware, firmware and software makes it easy to develop it further as a test system for FE-I4. –Basically no hardware change is needed. –Work has already started to implement FE-I4 support to the firmware using a FE-I4 emulator. –Further functionality like wafer testing and scan chain support can be implemented. FE-I4 ReviewFabian Hügging, University of Bonn18