1. www.i-tech.si Digital RF Stabilization System Based on MicroTCA Technology - Libera LLRF Robert Černe May 2010, RT10, Lisboa robert.cerne@i-tech.si

2. www.i-tech.si Outline ●Introduction ●Hardware overview ●Digital signal processing ●Software architecture ●LLRF application

3. www.i-tech.si Introduction 1/2: Instrumentation Technologies and the Libera brand ●Provider of state-of-the-art Libera family instrumentation systems. ●Instrumentation systems are used for diagnostics and beam stabilization at particle accelerators. ●All-in-one instruments cover analog and real-time digital signal processing and high level software.

4. ●LLRF application: ●Low Level RF (LLRF) systems are responsible for precise control of RF fields in the accelerating structures and use feed-back or/and feed-forward techniques to achieve this. ●Key requirements: ●36 RF input channels. ●Low amplitude and phase noise of the LLRF receiver and LLRF transmitter. ●Distributed digital signal processing. ●Low latency data transfer between FPGAs (< 100 ns). ●High data throughput between FPGA and CPU. ●Small form factor. ●Generic design to support reuse of developed hardware for development of new instruments. www.i-tech.si Introduction 2/2: LLRF application and key requirements

5. www.i-tech.si Hardware Overview 1/7: Technologies ●Based on MicroTCA / AMC standards. ●Based on IPMI board management. ●Intel dual core COM Express computing module. ●PCIe over backplane and cable. ●Gigabit ethernet. ●Low latency LVDS links. ●Distributed processing on Xilinx Virtex 5 FPGAs. ●Distributed acquisition circular buffers (DDR2RAMs).

6. www.i-tech.si Hardware Overview 2/7: Architecture ●Chassis is designed to fit into 19 inch rack and has 2U height. ●Integrated power supply module that produces 12 V payload power. ●Chassis and backplane can accept up to eight AMC modules (4x double width and 4x single width; all mid-size). ●ICB board in non AMC slot at the top on the left. ●Cooling is performed by two replaceable fan modules, which produce horizontal air flow.

7. www.i-tech.si Hardware Overview 3/7: Interconnection Board (ICB) ●Implements MCH functions and acts as a COM Express carrier board. ●Power distribution. ●High throughput PCIe switch fabric. ●Distribution of switch fabric clock. ●IPMI management of AMC modules. ●Integrated COM Express module with powerful CPU. ●FPGA for configuration and control of ICB hardware. ●Interfaces: JTAG, RS232, host USB, management Ethernet, 2x PCIe, 2x LXI, DVI, USB and 2x GbE.

8. www.i-tech.si Hardware Overview 4/7: LLRF receiver AMC module ●Consists of digital and RF PCBs. ●9 RF input channels, LO (Local Oscilator) input and calibration input. ●Down conversion technique used. ●9 x 16 bit ADCs (up to 130 MS/s), raw acquisitions (DDR RAM up to 8 Gbits) ●Virtex 5 FPGA. ●ARM processor with IPMI support. ●DMA implemented in FPGA. ●PCIe endpoint implemented in FPGA. ●8x PCIe link to the card edge connector. ●SerDes transmitters implemented in FPGA. ●Dedicated low latency LVDS links to the card edge connector.

9. www.i-tech.si Hardware Overview 5/7: LLRF transmitter AMC module ●Consists of digital and RF PCBs. ●2 RF output channels, 2 RF input channels abd LO input. ●Up/Down conversion technique used. ●2 x 14 bit double DACs (up to 260 MS/s), 2x 16 bit ADCs raw acquisitions (DDR RAM up to 8 Gbits) ●Virtex 5 FPGA. ●ARM processor with IPMI support. ●DMA implemented in FPGA. ●PCIe endpoint implemented in FPGA. ●4x PCIe link to the card edge connector. ●SerDes receivers implemented in FPGA. ●Dedicated low latency LVDS links to the card edge connector.

10. www.i-tech.si Hardware Overview 6/7: Timing AMC module ●Consists of digital and RF PCBs. ●MO (Master Oscillator) input. ●LO (Local Oscillator) generation and output. ●Sampling clock generation and distribution to AMC modules. ●Interlock input and output. ●2x trigger input and distribution to AMC modules. ●ARM processor with IPMI support. ●Lattice FPGA. ●PCIe endpoint implemented in FPGA. ●1x PCIe link to the card edge connector.

11. ●3.3 V and 12 V payload power connections from ICB to all AMC modules. ●Digital lines for JTAG communication between ICB and each AMC module. ●Digital lines for I2C communication between ICB and each AMC module. ●Differential lines between ICB and each AMC module for USB communication. ●Differential lines between ICB and each AMC module used for PCIe lanes and PCIe clock. ●Differential lines between Timing AMC module and each AMC module used for sampling clock distribution. ●Two digital lines between Timing AMC module and each AMC module for interlock information transfer. ●Differential lines between LLRF transmitter and each LLRF receiver. www.i-tech.si Hardware Overview 7/7: Backplane

12. www.i-tech.si Signal Processing Overview 1/2: Control loops ● Low latency cavity field control loop ● Scaling and phase rotation of probe signals ● Partial / global vector sum calculation ● Set-point signal generation ● Feed forward signal generation ● Pulse shaping (during fill time, flat top ) ● Feed-back / feed-forward control algorithms ● Drive signal generation ● Interlock triggering based on signal power threshold

13. www.i-tech.si Signal Processing Overview 2/2: Signal acquisition

14. www.i-tech.si Software Overview: Software architecture

15. www.i-tech.si LLRF Application Overview 1/3: Functions ● Libera LLRF system operation (state transitions, parameter setting, interlock control). ● Signal monitoring. ● Different RF diagnostics, calibration and compensation algorithms.

16. www.i-tech.si LLRF Application Overview 2/3: Freq. response

17. www.i-tech.si LLRF Application Overview 3/3: Signal monitoring

18. www.i-tech.si Thank you. Questions by e-mail: robert.cerne@i-tech.si More information at: www.i-tech.si