Electronics Preparatory Group 6 June 2013

Events which happened  Meeting of all the conveners of working groups   Specific meeting with the tracker group   To define the boundary between us and the tracker session  Proposal for their session  1. introduction talk  2. sensor talk  3. electronics talk  4. light weight mechanics/cooling  Electronics details on next slide 2

Electronics in tracker session  Front-end electronics  detailed discussion how to distinguish cleanly between tracker specific electronics to be covered by this group and more generic electronics to be covered by the electronics group  => agreement that the tracking group will cover ongoing tracker-specific developments in 130 nm, the qualification of 65 nm technology for extreme radiation environment required by the ATLAS and CMS pixel upgrade, and the development of common blocks for the pixel chips (new RD Collaboration proposed to the LHCC).  track trigger electronics: to avoid overlap with trigger group, we agreed that the tracker domain extends up to the reconstruction of tracks, while the combination of tracks with other subdetector primitives belongs to the trigger domain hence the tracking group should cover: development of custom ASICs and dedicated boards for fast pattern recognition and track reconstruction  the more common electronic topics such as optical links, powering concepts, power supplies, TCA etc. will be covered by the electronics group  short discussion on GBT: different needs for GBT from the different applications; there will be different flavors of GBTs, but this topic will be covered by the electronics group  as the preparatory group is open to further people, members of the electronics group who would like to be included in the tracking discussion are welcomed to join this group  b) Modern Interconnection Technologies  chips-to-sensors bump bonding for small and large pixels, including difference between Indium and solder bump bonding, and issues for large-scale productions  low mass high density substrates for hybrids, and related interconnection issues (wirebonding, bump-bonding of chips)  Through-Silicon Vias and 3D electronics -> not decided if this topic will be covered and to which extent; weleave it on the menu for the time being 3

Meeting next Monday  All the preparatory groups invited   We have 30 minutes to present  our agenda proposal  (sort of) detailed talks outlines  Availability of material (if relevant) 4

Proposed Presentations  (1) Making new IC technologies available to the community and supporting it (including radiation hardness evaluation). Emphasis to be put on necessary manpower and expertise to be maintained, implications of outsourcing,... Specific (common) developments for detectors to be covered in the relevant detector sessions (e.g. ATLAS/CMS common developments in 65-nm for pixel applications to be covered in the tracker working group)  (2) High speed links (electrical and optical) developments including desirable R&D in photonics, testing methods and equipment, and the very likely necessity to have different flavours of links (e.g. low power/high speed GBT variants)  (3) Power distribution in the detectors, including overall schemes (e.g. high voltage/low current bulk, intermediate DC-DC to deliver let say 12V, POL DC-DC; serial power), necessary R&D for the different parts, etc.  (4) Evolution of modular electronics standards. Why do we need to consider the replacement of VME, what are the options,...  (5) Longevity and reliability of electronics (passed and future systems)  We have 1h45 total i.e. 105 mn  5 talks  21 minutes per talk including discussion...  Should we reduce to 4 talks? 5

IC design  Development of ASICs has been a key enabler for new detectors  No reason this will change  Limited resources in the community and a bit sparse  Need for new technologies  Availability  Power and speed  Higher density for some applications (pixel)  Radiation hardness  Cost and complexity of tools  More and more digital design   Concentrate on a limited amount of different technos  Without closing the door to new ones  Collaborative tools needed  Use of IP (either internally or from companies)  Can we subcontract some part of the process  Assembly, P&R, ??? 6

High Speed Links  Electrical  Pixel to exit high radiation zones  Low power and radiation hard  Calorimeters and muon FE boards  Data gathering  Optical  High speed, low power, low mass, small volumes, radiation hard  GBT, LpGBT,... How to adapt to singularities  E.g. ATLAS and CMS trackers stave/module  Opto devices still too bulky  Photonics  Very high speed (large amount of data for calorimeters)  Parallel links  Can we use COTS 7

Power distribution  New technologies: lower V, Higher I  Cable section to be reduced as much as possible  Two main roads  DC-DC  Serial Power  Needed developments  Constant current sources  IP blocks for shunt regulation  Control  DC-DC  POL  Radiation hard to Radiation Tolerant  Magnetic field  Three stages architecture  48 – 300 V AC-DC, high power low current. Can be in counting rooms  1 st level of DC-DC to go down to ~12 V  Muons and calorimeters  Trackers  outside tracker volume  Common specifications in terms of radiation, magnetic fields, control  POL DC-DC  On the FE boards  Magnetic field and radiation level for the trackers  Several power versions  In the FE ICs  Switched C 8

Modular Electronics  Why do we need new standard  Validation of current routes  xTCA  What if the industrial support is not as expected 9

Reliability and Longevity  Longevity of current electronics  Designed for 10 years of LHC  HL-LHC  production date + 30 – 40 years  How can we make sure it will survive  New electronics  Are very deep SM technologies as reliable as previous ones  Lifetime studies to be defined 10