1. TK Upgrade report

2. Sensors R&D Sensors R&D based on HPK samples continuing efficiently
A lot of data being collected, plan to converge on specs in Q1 2013, then move onto Market Survey
Prototypes qualified with new vendor Infineon Austria: excellent quality
Encouraging option to pursue, very good news in view of procurement, next steps planned
R&D for pixel phase II continuing (planar silicon from HPK, 3d silicon, diamond)
Needs to be boosted/structured in the coming future

3. FE Electronics and modules - I
Good progress in the development of strip pT modules (“2S modules”)
New version of readout chip (CBC2) submitted this summer
Layout adapted to C4 bump-bonding onto high-density substrate
Reads out 2x127 channels, for an assembly of two silicon sensors
Implements a preliminary version of correlation logic
Layout of a 2-CBC hybrid finalized, awaiting a quote from the provider
Will be used to assemble “mini” 2S modules early next year, together with Infineon sensors (available)
DAQ development also started, in view of coming beam tests
Making progress in defining the overall electronics architecture in all details
Including powering and controls
Aim at finalizing specifications for CBC3 in Q1 2013
Will include all required functionalities
Mechanical design of the module refined
Prototyping of full-scale assemblies with dummy parts to start before the end of the year
Purpose: optimize design of supporting mechanics and cooling, develop assembly procedures

4. FE Electronics and modules - II
Development of pixellated pT module continuing, in both versions
With horizontal interconnections (“PS modules”):
Work in progress in the analogue front-end for the pixellated sensor, in 65 nm technology
Exploring option to optimize correlation logic
Module design refined
With vertical interconnections (“VPS modules”)
Electronics design progressing
Launched new R&D line on edgeless sensors, to address concerns on yield for large-area modules

5. Track-trigger and back-end electronics
Evolving organization following definition of the new Upgrade WGs
Already established good communication with the Trigger Performance and Strategy Working Group
Re-opened discussion on scope of Tracker Upgrade, Track Trigger, and related boundary conditions
Positive and fruitful discussion
A solid, well-understood and shared definition of the scope (with possibly some retuning), is highly desirable, but a big change of scope is not affordable
Need to boost and structure the work on the track-trigger and back-end electronics, in cooperation with the TPSWG

6. Pixel phase II
Starting to form a collaboration to design the ultimate CMS pixel chip
65 nm technology identified as the preferred option
Several groups interested, exploring possible synergies with ATLAS
Will now extend the discussion to more general system aspects

7. Comments and outlook
R&D on sensors, FE electronics and modules progressing well
Will now increase the focus on back-end processing of trigger info
Overall, need a significant change of pace within the next 1-2 years, to deliver a working tracker by LS3
Freeze the concept
Narrow down open options
Structure pixel phase 2 upgrade
Attract more people/groups to participate in the developments
Plan to hold a series of topical mini-workshops in Q1-Q2 2013
Will serve as reviews of all the ongoing activities
Will help to converge towards a fully defined project, and prepare for writing a TP in 2014