A. Ranieri / RPC-CMS Pre-loaded profile Synchronization & Control Board (SCB) The RPC electronics will consist of the FE board plus the Synchronization.

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Presentation transcript:

A. Ranieri / RPC-CMS Pre-loaded profile Synchronization & Control Board (SCB) The RPC electronics will consist of the FE board plus the Synchronization & Control Board Front-end power consumption considering analog plus digital is 130 mW per channel (25 W for the whole chamber) The RPC electronics will consist of the FE board plus the Synchronization & Control Board Front-end power consumption considering analog plus digital is 130 mW per channel (25 W for the whole chamber) FE board “L” shaped profile to support FE board strip

“L” shaped profile to support FE board FE board SCB Synchronization & Control Board (1 or 2/layer) Optical link LB 12 flat cables per station from FEB to SCB 12 flat cables per station from FEB to SCB Clock line DCS line Data Line

A. Ranieri / RPC-CMS DAC 8 8 FEC LVDS-R Voltage Regul FEC+DAC test point LVDS-R FEC DCS from SCB 44 Voltage Regul 4 FEC+DAC test point 16 LVDS output FE Board Layout

A. Ranieri / RPC-CMS Synchro&FIFO Synchro&FIFO Synchro&FIFO LVDS-R (x 24) LVDS-D (x 12) LVDS-D (x 6) 96 Signal In from FEC 48 Test Out from FIFO 24 DCS out for DAC CDC 509 CDC 509 CDC 509 DLL Channel Link (x6) Twin Coax To LB Synchronization & Control Board (SCB) MCK from LB DCS chip set DCS Bus Ck1 Ck2 TS

RPC_CMS HV & LV Distribution A. Ranieri / RPC-CMS HV System requirements Maximum number of HV channels ~ 4000 Max value = V I max =.5 mA/channel Magnetic field inside iron B = 1.8 Tesla Possibility to switch off one sub-channel only Single rate counting for each sub-channel: (desirable) Rad-hard devices necessary ? (not necessary for RPC) Fault tolerant system (redundancy): (desirable) HV & LV system crates on the balcony around the detector Maximum number of HV channels ~ 4000 Max value = V I max =.5 mA/channel Magnetic field inside iron B = 1.8 Tesla Possibility to switch off one sub-channel only Single rate counting for each sub-channel: (desirable) Rad-hard devices necessary ? (not necessary for RPC) Fault tolerant system (redundancy): (desirable) HV & LV system crates on the balcony around the detector

RPC_CMS HV & LV Distribution A. Ranieri RPC sector in the Barrel 96 channels 96 channels + 96 channels 96 channels MB4 MB3 MB2 MB1 8 HV Ch. Current absorption :.5 mA / HV Channel 4 LV Ch. LV Channel HV Channel 12 groups of 96 channels to be powered to LV, grouped into 16 LV channels LV analog LV digital

SY Crate/4 RPC sectors Ch. 1 (2 slot) Ch. 8 Ch. 2  In the ipothesys of 12KV/sub-channel Ch. 3 Ch. 4 Ch. 7 Ch. 6 Ch. 5 HV SY1527 possible segmentation 8 Ch (HV) (HV) RDB 1 RDB 2 RDB=Remote Distribution Board

RPC_CMS HV Distribution A. Ranieri HV SY1527 possible segmentation for HV & LV (Barrel case) Considering: –16 sub-channels (2 RDB - 8 ) / 2 HV slot 16 sub-channels x 0.5 mA = 8 mA  8 x 8 mA x 12 KV = 768 W/crate/ 4 sectors  60 sectors : 4 = total of 15 SY1527 for HV only 25 W x 12 = 300 W/ sector 300 W x 60 = W : 2000 W = 9 SY1527 for LV only

RPC_CMS Calibration & Monitoring Number of parameters to be controlled  2000 digital words to be monitored as threshold values for a total of FE Boards for the entire detector (assuming to have only one threshold value for a group of 6 boards) pulse width coming from the discriminator, fixed at 100 ns number of temperature sensor = 1 / SCB (1/RPC layer) Dead Channels: implementation of a digital mask on the synchronizer, to switch off dead channels

RPC FE Milestones RPC FE Electronics milestones New FE chip prototype:end of March 99 chip test on new FE board(LAB):end of March 99 chip pre-production:May 99 test of chip pre-production:June 99 new FE board pre-production & mounting:June-July 99 test at CERN:July-September 99 final production of FE:June 2000 SCB prototype development:October 99