DAQ for 4-th DC S.Popescu. Introduction We have to define DAQ chapter of the DOD for the following detectors –Vertex detector –TPC –Calorimeter –Muon.

Slides:



Advertisements
Similar presentations
1 ALICE EMCal Electronics Outline: PHOS Electronics review Design Specifications –Why PHOS readout is suitable –Necessary differences from PHOS Shaping.
Advertisements

6 Mar 2002Readout electronics1 Back to the drawing board Paul Dauncey Imperial College Outline: Real system New VFE chip A simple system Some questions.
EXL/R3B Calorimeters- Readout from ASIC to DAQ Ian Lazarus STFC Daresbury Laboratory.
A scalable DAQ system using the DRS4 sampling chip H.Friederich 1, G.Davatz 1, U.Hartmann 2, A.Howard 1, H.Meyer 1, D.Murer 1, S.Ritt 2, N.Schlumpf 2 1.
Ultrafast 16-channel ADC for NICA-MPD Forward Detectors A.V. Shchipunov Join Institute for Nuclear Research Dubna, Russia
CHL -2 Level 1 Trigger System Fully Pipelined Custom ElectronicsDigitization Drift Chamber Pre-amp The GlueX experiment will utilize fully pipelined front.
Front-end electronics for Time Projection Chamber I.Konorov Outlook:  TPC requirements  TPC readout options  Options for TPC FE chips  Prototype TPC.
TileCal Electronics A Status Report J. Pilcher 17-Sept-1998.
HEP2005, Lisboa July 05 Roberto Campagnolo - CERN 1 HEP2005 International Europhysics Conference on High Energy Physics ( Lisboa-Portugal,
20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.
DSP online algorithms for the ATLAS TileCal Read Out Drivers Cristobal Cuenca Almenar IFIC (University of Valencia-CSIC)
28 June 2002Santa Cruz LC Retreat M. Breidenbach1 SD – Silicon Detector EM Calorimetry.
October-November 2003China - ALICE meeting1 PHOS in ALICE A PHOton Spectrometer with unique capabilities for the detection/identification of photons and.
Preliminary Design of Calorimeter Electronics Shudi Gu June 2002.
K. Honscheid RT-2003 The BTeV Data Acquisition System RT-2003 May 22, 2002 Klaus Honscheid, OSU  The BTeV Challenge  The Project  Readout and Controls.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
MR (7/7/05) T2K electronics Beam structure ~ 8 (9?) bunches / spill bunch width ~ 60 nsec bunch separation ~ 600 nsec spill duration ~ 5  sec Time between.
S.Vereschagin, Yu.Zanevsky, F.Levchanovskiy S.Chernenko, G.Cheremukhina, S.Zaporozhets, A.Averyanov R&D FOR TPC MPD/NICA READOUT ELECTRONICS Varna, 2013.
The CMS Electromagnetic Calorimeter Roger Rusack The University of Minnesota On behalf of the CMS ECAL collaboration.
21-Aug-06DoE Site Review / Harvard(1) Front End Electronics for the NOvA Neutrino Detector John Oliver Long baseline neutrino experiment Fermilab (Chicago)
Montpellier, November 15, 2003 J. Cvach, TileHCAL and APD readout1 TileHCAL- fibre readout by APD APDs and preamplifiers Energy scan with DESY beam –Energy.
The ALICE Forward Multiplicity Detector Kristján Gulbrandsen Niels Bohr Institute for the ALICE Collaboration.
Fine Pixel CCD for ILC Vertex Detector ‘08 7/31 Y. Takubo (Tohoku U.) for ILC-FPCCD vertex group ILC vertex detector Fine Pixel CCD (FPCCD) Test-sample.
Dec.11, 2008 ECL parallel session, Super B1 Results of the run with the new electronics A.Kuzmin, Yu.Usov, V.Shebalin, B.Shwartz 1.New electronics configuration.
SiD R&D tasks for the LOI - Subsystem R&D tasks - Summary of SiD R&D - Prioritization of R&D tasks -> Document for DoE/NSF ~Feb 2009 (Mainly based on Marty’s.
Joel Goldstein, RAL 4th ECFA/DESY LC Workshop, 1/4/ Vertex Readout Joel Goldstein PPd, RAL 4 th ECFA/DESY LC Workshop DAQ Session 1 st April 2003.
Apollo Go, NCU Taiwan BES III Luminosity Monitor Apollo Go National Central University, Taiwan September 16, 2002.
Guido Haefeli CHIPP Workshop on Detector R&D Geneva, June 2008 R&D at LPHE/EPFL: SiPM and DAQ electronics.
Status of TPC/HBD for PHENIX Craig Woody BNL DC Upgrades Meeting February 12, 2002.
SPIROC update Felix Sefkow Most slides from Ludovic Raux HCAL main meeting April 18, 2007.
Digitization in EMC simulation Dmytro Melnychuk, Soltan Institute for Nuclear Studies, Warsaw, Poland.
1 Electronics Status Trigger and DAQ run successfully in RUN2006 for the first time Trigger communication to DRS boards via trigger bus Trigger firmware.
11 October 2002Paul Dauncey - CDR Introduction1 CDR Introduction and Overview Paul Dauncey Imperial College London.
D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, R. Joannes, A. Le Coguie, S. Lhenoret, I. Mandjavidze, M. Riallot, E. Zonca TPC Electronics:
LKr readout and trigger R. Fantechi 3/2/2010. The CARE structure.
1 19 th January 2009 M. Mager - L. Musa Charge Readout Chip Development & System Level Considerations.
5 May 2006Paul Dauncey1 The ILC, CALICE and the ECAL Paul Dauncey Imperial College London.
Readout controller Block Diagram S. Hansen - CD-1 Lehman Review1 VXO Ø Det Links to 24 SiPM Front End Boards Clock Event Data USB ARM uC A D Rd Wrt 100Mbit.
FPGA based signal processing for the LHCb Vertex detector and Silicon Tracker Guido Haefeli EPFL, Lausanne Vertex 2005 November 7-11, 2005 Chuzenji Lake,
Vladimir Zhulanov for BelleII ECL group Budker INP, Novosibirsk INSTR2014, Novosibirsk 2014/02/28 1.
May 10-14, 2010CALOR2010, Beijing, China 1 Readout electronics of the ALICE photon spectrometer Zhongbao Yin *, Lijiao Liu, Hans Muller, Dieter Rohrich,
Overview of TPC Front-end electronics I.Konorov Outline:  TPC prototype development  Readout scheme of the final TPC detector and further developments.
The trigger-less readout for the Mu3e experiment Dirk Wiedner On behalf of the Mu3e collaboration 31 March 20161Dirk Wiedner.
3/06/06 CALOR 06Alexandre Zabi - Imperial College1 CMS ECAL Performance: Test Beam Results Alexandre Zabi on behalf of the CMS ECAL Group CMS ECAL.
Status of hardware activity in CNS Taku Gunji Center for Nuclear Study University of Tokyo 1.
 13 Readout Electronics A First Look 28-Jan-2004.
The ALICE Electromagnetic Calorimeter
DAQ ACQUISITION FOR THE dE/dX DETECTOR
DCH FEE STATUS Level 1 Triggered Data Flow FEE Implementation &
FEE for TPC MPD__NICA JINR
Journées VLSI-FPGA-PCB Juin 2010 Xiaochao Fang
Light mixer proposal Arjan Heering, Anton Karneyeu
A General Purpose Charge Readout Chip for TPC Applications
96-channel, 10-bit, 20 MSPS ADC board with Gb Ethernet optical output
The Silicon Drift Detector of the ALICE Experiment
TELL1 A common data acquisition board for LHCb
Large Area Endplate Prototype for the LC TPC
ALICE – First paper.
Commissioning of the ALICE HLT, TPC and PHOS systems
Power pulsing of AFTER in magnetic field
A First Look J. Pilcher 12-Mar-2004
VELO readout On detector electronics Off detector electronics to DAQ
LHCb calorimeter main features
Status of n-XYTER read-out chain at GSI
LHCb Trigger, Online and related Electronics
The LHCb Level 1 trigger LHC Symposium, October 27, 2001
The CMS Tracking Readout and Front End Driver Testing
SVT detector electronics
The LHCb Front-end Electronics System Status and Future Development
TELL1 A common data acquisition board for LHCb
Presentation transcript:

DAQ for 4-th DC S.Popescu

Introduction We have to define DAQ chapter of the DOD for the following detectors –Vertex detector –TPC –Calorimeter –Muon system

Vertex detector We will use most probably the CCD readout chips –They have good integration –low noise and capacitance  expected 60 e/pixel We have 5 inner layers of pixels Inner layer: –Assume is 20  * 20  pixels  inner radius 1.5  angular resolution radians –assume 10 Mpixels CCD being available  first inner layer requires 190 Mpixels 19 CCD chips Using a projective geometry we have the followings Second layer scales by factor of 4 with same pixel size  80 chips Third layer  scaling factor 7  140 chips ; Forth layer  scaling factor 10  200 CCD chips Fifth layer – factor is 13  260 CCD chips Total  700 CCD chips

Vertex detector For designing the readout strategy we have the following starting points: –data volume is 10 9 pixels (bits) –CCDs: Kodak KAF-6300 chip: 6Mpix, 9  pix size, chip size = 27.6 * 18 mm 2, 550 nm - Kodak KAF chip: 16 Mpix, 9  pixel size, 36.9 * 36.9 mm2 –Max CCD readout rate ~ 50 Hz ( Motion picture video 48 fps) –Bandwidth = f(Trigger rate). –Repetitive Auto-Trigger by clock downcounting (every 20 ms you can take the next event) –1 Hz =12.5 Mbyte/s … 48 Hz = 600 MBytes/s –20 Hz max fits with 1 Gbit ethernet links –48 Hz max fits with 10 Gbit ethernet links –Transmit zer0-suppressed pixel data as IP packets out of FPGA buffer to Gigabit MAC chip (LHCb) - Event building automatic due to packet routing to same IP address -controller collects next free CPU buffer -controller distributes IP addresses backwards to FPGA

Vertex CCD readout scheme Pix1ZsuppBuff Pix2ZsuppBuff Pix3ZsuppBuff PixnZsuppBuff FPGA Pix1ZsuppBuff Pix2ZsuppBuff Pix3ZsuppBuff PixnZsuppBuff FPGA ROUTERROUTER GBE fiber CPU farm Pix1ZsuppBuff Pix2ZsuppBuff Pix3ZsuppBuff PixnZsuppBuff FPGA GBE fiber Readout clock / trigger MAC GBE fiber Next Event memories GBE fiber or copper Eventbuilding by IP packet routing to event-memories ILC clock Clock distribution Readout trigger/Ev Nr. Make IP packet in FPGA 48 fps

TPC We will use the TPC from EURODET R&D The pad size for our case could be 2x6 mm  channels Technology not yet final we will have to think soon at this

Calorimeter (crystal + fiber) Main technology is the APD or Silicon PM pixels For crystals the baseline solution is the APD Based on recent PWO/APD readout electronics for the Alice PHOS + EMCal (fiber calorimeter), 14 bit dyn range + single ch. APD gain control. Altro –TPC readout backend. With China, plans for upgrade R&D for direct optical GBE readout and 16 bit dyn. range.

PHOS crystal mapping with FEE Double Strip Unit for 2*8 Crystals Left-Right orientation of 2 double Strip Units = 1 FEE card (plugged below) read 2 || row L R FEE card APD PWO

Calorimeter readout 1.) Crystals: 16 bit dyn. range (5MeV-325 GeV linear range per channel ) Large surface APD (5*5 mm2 like CMS) ?Operate at -25 C for 3* increased light yield (PWO) ?? Preamplifier: charge sensitive like Alice with 1V/pC APD readout: dual shapers/ gain ratio= 2**4 -> requires two 12 bit ADCs per channel => 24 bit data per ADC sample Shaping time 200ns – 1us for noise 1000 – 280 electrons Sampling frequency 10 MHz -2 MHz corresp. to above Assume 1us shaping/5 MHz sampling: -> 2 us peaking time ( 2 nd ordev shaper) -> 32 ADC samples + 8 pre-samples * 5 MHz -> 8 us semi-gaussian envelope recording to buffer ->1 kbyte stored data per APD (crystal) Self –triggered 1 kHz -> Bandwidth =1 Mbyte/s per APD Bandwidth ~ 80 Mbyte/s Offline fit with Gamma-2 yields time reference at y’=0 ( +- 1 ns) above 1 GeV 2.) Fibers: Si-PM readout px 1*1 mm2 ( ) No preamplifier. 10 bit dyn range enough -> use only 1 ADC = 12 bit /channel ignore 2 bits Assume 500 ns shaping time/ 10 MHz sampling -> 1 us peaking time -> 64 ADC samples + 8 pre-samples -> 7.2 us semi-gaussian envelope in buffer -> 0.5 kbyte stored data per SiPM (fiber) Self triggered 1 kHz -> Bandwidth = 0.5 Mbyte/s per Si-PM Bandwidth 20 Mbyte/s Timing resolution: order 1 ns

Calorimeter readout ROUTERROUTER GBE fiber CPU farm GBE fiber Readout clock / trigger GBE fiber Next Readout Controller Event memories GBE fiber or copper GBE Eventbuilding by IP packet routing to event-memories ILC clock Distribution of next event memory address via IP to FPGAs Clock distribution FPGA MAC Readout trigger APD Shaper/ADC Buff 24 HV-biasAPD APD Shaper/ADC Buff APD Shaper/ADC Buff FPGA MAC Readout trigger APD Shaper/ADC Buff 24 HV-biasAPD APD Shaper/ADC Buff APD Shaper/ADC Buff FPGA MAC Readout trigger SiPM Shaper/ADC Buff 12 HV-bias SiPM SiPM Shaper/ADC Buff SiPM Shaper/ADC Buff Pre-router Next

Muon system We will use the cluster counting drift chambers To maximasize resolution vs cell size (4cm*4cm) The read-out scheme will be based on fast flash ADC in range of Gsample/s

Conclusions We are in the designing phase of our DAQ This is a first estimation to define our read out strategy Soon will have to think on our software DAQ We are welcoming people if are interested in joining this subject