2 nd Annual Babcock/Eno River Capital Elevator Competition March 31, 2001 Michael McCorquodale, Chief Executive Officer Mobius Integrated Systems Corporation 1001 E. Jefferson Ave. Suite 105 Detroit, MI

Presentation Agenda The Purpose of Mobius Problems with Existing Implementations The Mobius’ Solution Management Team Market Strengths and Challenges Funding Sought Why Invest? AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy?

The Purpose of Mobius Mobius Integrated Systems Utilizes Emerging and Available Technology to Deliver True System-On-A-Chip (TSoC) Solutions to the Embedded Systems Market The Engine Control Module (ECM) is an example of an embedded system: Inside the engine a sensor detects the fuel-to-air ratio and transmits the signal to the ECM so the fuel injection can be adjusted accordingly What is an embedded system? AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy?

Problems with Implementation So what’s the problem?  Packaging costs high  Power too high  Size too large  Engineering resources spent designing board  Functionality low  Applications limited Antenna Microprocessor Frequency Reference Sensor/Actuator Interface Sensor Actuator Quartz Crystal Resonator (Frequency Reference) Sensor/Actuator Interface Wireless Interface Board Level Implementation Microprocessor Sensors/Actuators Wireless Interface AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy?

The Mobius Solution True System-on-a-Chip Implementation (TSoC) Mobius Antenna Microprocessor Wireless Interface Frequency Reference Sensor/Actuator Interface Sensor Actuator Quartz Crystal Resonator (Frequency Reference) Sensor/Actuator Interface Wireless Interface Board Level Implementation Microprocessor Sensors/Actuators AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy?

Realizing The Mobius’ Solution TSoC Implementation Packaging costs reduced: Fewer Circuits Power reduced: Less Input/Output Size Reduced: Fewer Circuits, Fewer Pins Fewer Engineering Resources: Simpler System Increased Reliability: Longer Operating Life Possibilities for increased functionality Possibilities for new applications The MS-8 prototype developed at The University of Michigan AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy?

Realizing The Mobius’ Solution How is it Done? Utilizing emerging technology: MEMS Integrating existing technology: RF + Analog + Digital New application in existing technology: Si Wireless Support Emerging Standards: Bluetooth Vision: SoC solutions require competency in all technologies No Intel of Microsystems Exists: Si RF, SOI, MEMS, etc. Who will integrate these technologies? Recognizing MEMS as an enabling technology: Prototype MEMS resonators developed at The University of Michigan AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy?

The Mobius Team: Founders Michael McCorquodale –Chief Executive Officer –Ph.D. Candidate: Wireless Integrated Circuit and MEMS Research –Embedded Circuit Development with Hughes Space and Communications Keith Kraver –Chief Technical Officer –Ph.D. Candidate: Low-Power, Low-Voltage, Mixed-Signal IC Research –Embedded Analog Circuit Development with National Semiconductor Matt Guthaus –Chief Operations Officer –Ph.D. Candidate: Low-Power Microarchitecture Research –Automotive Microcontroller Development with National Semiconductor AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy?

The Mobius Team: Advisory Board AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy? Dr. Richard Brown –Chairman of Advisory Board –Founder, Sensicore Corporation: A Chemical Sensor Company –Associate Chair Electrical Engineering Division, University of Michigan Joe Giachino –Member, Automotive Microsystems Specialist –Technical Chairman, Michigan Microsystems Consortium –Over 30 Years Experience in Automotive Microsystems, Ford/Visteon Dr. Dennis Grimmard –Member, Semiconductor Manufacturing Specialist –Manager, Solid-State Electronics Laboratory, University of Michigan

Market System-on-a-Chip (SoC) Market: –Total Available Market: Currently $5 Billion –Projected to be $17 Billion by 2002 –Currently SoC 30% of Integrated Circuit (IC) Market –Projected to be 70% of IC Market by 2003 Additional Markets –Scaling in Additional Markets: biomedical, environmental monitoring, industrial, manufacturing, communications, wireless, instrumentation, and testing AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy? Automotive ECM Market: –Total Accessible Market: 15 Million Units per Year –Target Market: 100k – 200k ECMs

Mobius’ Strengths AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy? Strengths –Strong Technical Foundation –Top Ph.D. Students, Top Faculty, Top Institutions, Top Research –Interdisciplinary Group and Innovative Approach to TSoC Development –Vision: Recognizing Emerging Technology, Leveraging Knowledge of Existing Technology –Hustle: Young, Motivated, Experienced Team, Well Recognized

Mobius’ Challenges AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy? Challenges –Formal Business Experience Solution: Recruited 6 Top Michigan MBA Students for Business Plan Development This Term –Strong Competitors: Established Semiconductor Companies Solution: Competitors Must Retool, Competitors Must Combine Disparate Resources, New Org Structure for TSoC Development

Funding Sought AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy? Capital Sought –$3MM First Round to Initial Product Delivery Expenditures –Development, Management, and Sales Teams –Office Space, Computer Hardware, CAD Tools –Design, Manufacturing, and Testing of Initial Product

Why Invest in Mobius? Reasons to Invest in Mobius Strong, Scalable, Needed Technology with Significant Added Value Motivated, Experienced, Talented Team Tremendously Expanding Market Applications in Broad Spectrum of Markets Opportunity to Capitalize on Emerging Applications AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy?

AgendaPurposeProblemsSolutionTeamMarketS & CFundingWhy? Why Invest in Mobius? Current Strategy Full Business Plan just Completed Prototypes Developed, Manufactured, and Tested Seeking Start-Up Capital From Angel Investors and Venture Capitalists Looking to Fill Gaps: Management and Partnerships Developing Specification for Initial Product Offerings R&D underway for Bluetooth Enabled ECM