FCBGA Package Warpage Definition Stage Project

Slides:



Advertisements
Similar presentations
FCBGA Package Warpage Definition Stage Project
Advertisements

SPACE PRODUCT ASSURANCE
Extrusion-Based Processes
Chapter 30 Brazing, Soldering, Adhesive, Bonding
SUPERIOR FLUX & MFG. ELECTRONICS PRODUCTS
Experiments on Solder Column Interposer: cryogenic cleaning and local laser reflow Irving HAMON, Electronic Materials and Assembly Processes for Space.
Loctite PSX-D and PSX-P Thermal Interface Materials
Thermoforming Process
Ragan Technologies, Inc. Presents - Zero Shrink Technology - ZST™ Process for Embedding Fired Multi-Layer Capacitors in LTCC Packages.
Boundary Layer Flow Describes the transport phenomena near the surface for the case of fluid flowing past a solid object.
SAC Aging “2” Project “Definition Stage” Ready to go to “Implementation Stage” Joe Smetana November 8, 2010.
JEDEC Standards -Nicole Okamoto and Widah Saied
FUNDAMENTALS OF METAL FORMING
Passive Components: Capacitors & Resistors
Micro-Usmd Rework These are very small BGA style components.
4 QFN Challenges that will Make you Scream!
Electro-Chemical Migration Definition Stage Project Wallace Ables - Dell HDP User Group Member Meeting Host: Oracle Santa Clara, CA. Feb Presented.
Electro-Chemical Migration Definition Stage Project Wallace Ables - Dell HDP User Group Member Meeting Host: Panasonic Bennington, Vermont September 25,
Lead-Free Electronics Thermal Management of Electronics San José State University Mechanical Engineering Department.
Overview Test Interface (TIU PCB‘s) are extremely expensive.
Surface Mount Technology Research and Presentation: Amy Hopp Sept. 4, 2003 CIM ~ Period 2 Automation/Programmable Processes in.
Chip Carrier Package as an Alternative for Known Good Die
Electro-Chemical Migration Definition Stage Project Wallace Ables - Dell HDP User Group Member Meeting Host: Shengyi Technology Co., Ltd. And NERCECBM.
Electro-Chemical Migration Idea Stage Project Wallace Ables - Dell HDP User Group Member Meeting Host: Multek Boeblingen, Germany May 22, 2012 Phone-in.
Lead-Free BGA Terminations with Tin/Lead Paste Bob Willis.
Electro-Chemical Migration Going to Implementation Stage Mike Bixenman HDP User Group Member Meeting Host: Flextronics Santa Clara, CA February 26, 2014.
Afternoon Agenda Deciding on your soldering equipment and important factors to consider on configuration for a robust process Reflow.
Deposition of Solder Paste into High Density Cavity Assemblies
RO400FC Forced convection hot air reflow oven. In a flexible production, what do you need for soldering of  Complex PCB’s  Soldering of fine pitch on.
Press Fit Rework Project Project Update HDPUG Meeting Kawasaki, Japan 10/12/14.
Copyright © 2009 Aristos Electronic Manufacturing Service Pvt Ltd. All rights reserved.
Modeling of a continous casting process. Introduction The purpose of this model is to describe the transition from melt to solid in the flow in the continous.
FCBGA Package Warpage ØII Definition Stage Project Kirk Van Dreel, Plexus HDP User Group Member Meeting Host: Engent Atlanta, Ga. September 9, 2015 © HDP.
FUNDAMENTALS OF METAL FORMING
Going to Implementation Stage
SAC Aging III Idea Stage Project Richard J. Coyle HDP User Group Member Meeting Host: Engent Atlanta Ga, USA Sept 9, 2015 © HDP User Group International,
IPC-SM Soldermask Issues Rework of Surface Mount Assemblies due to soldermask related defects is cited as a major cause of problems by assembly.
Welding Inspection and Metallurgy
Electro-Chemical Migration Definition Stage Project
Interconnection in IC Assembly
A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations Dr. Ning-Cheng Lee & Fen Chen Indium Corporation.
Future HDI Project – Definition Stage
Surface Mount Technology
BALL GRID ARRAYS by KRISHNA TEJA KARIDI
ERMSAR 2012, Cologne March 21 – 23, 2012 Experimental and computational studies of the coolability of heap-like and cylindrical debris beds E. Takasuo,
FCBGA Package Warpage Definition Stage Project
Mitglied der Helmholtz-Gemeinschaft Jörg Wolters, Michael Butzek Focused Cross Flow LBE Target for ESS 4th HPTW, Malmö, 3 May 2011.
18.1 Introduction Powder metallurgy is a process by which fine powdered materials are blended, pressed into a desired shape, and then heated to bond.
UV Product Range. Current UV Curable Range UV40 Performance and Benefits Technical information Comparisons Silicones and solvent based.
Electro-Chemical Migration Definition Stage Project Wallace Ables - Dell HDP User Group Member Meeting Host: IBM/DELL Austin, Texas Sept. 26, 2012 © HDP.
IPC Standard Surface Mount Requirements Automatic assembly considerations for surface mounted components are driven by pick-and- place machines.
High Frequency Flex Project Definition Phase Project Lead: TBD Project Facilitator: John Davignon, HDPUG HDP User Group Member Meeting Santa Clara, CA.
Volumize3d Volumize3d Training Lesson 10 – Slicing Printing.
Extrusion Blow Molding
PWB Back Drilling Phase 2 March 10, 2016 Project Proposal - Idea Stage Project Leader: PC Wong Project Facilitator: John Davignon © 2016 HDP User Group.
Definition Stage Project
Effects of Component Rework on Reliability rev01 Khaw Mei Ming - Keysight HDP User Group Project Meeting 4 th May 2016 © HDP User Group International,
Effects of Component Rework on Reliability rev02 Khaw Mei Ming - Keysight HDP User Group Project Meeting 2 nd June 2016 © HDP User Group International,
版權所有 翻印必究 日 期: 指導老師:林克默 博士 學 生:陳冠廷. 版權所有 翻印必究 Outline 1.Introduction 2.Materials and methodology 3.Results and discussion 4. Conclusions 2016/6/242.
La Termoformatura. Thermoforming Process used to shape thermoplastic sheet into discrete parts Basic principles –Heat a thermoplastic sheet until it softens.
Thermoforming Process
Different from welding: 1-no diffusion takes place 2-filler metal is used to produce a strong bond 3- require lower temperatures than fusion welding.
Electronics Interconnection at NPL
(Rhymes with Doddering)
THERMAL PROPERTIES OF MATTER
IT 318: M13 PWB Assembly IT M13.
Warpage, Adhesion, and Reliability
Codification of Flip Chip Knowledge
Step by Step Process of BGA Reballing
The Effects of Surface Finish on Solder Paste Performance -
Presentation transcript:

FCBGA Package Warpage Definition Stage Project Raiyo Aspandiar – INTEL HDP User Group Member Meeting Host: Shengyi Technology Co., Ltd. And NERCECBM Guangdong, China December 5, 2012 Presented by Brian Smith © HDP User Group International, Inc.

© HDP User Group International, Inc. Purpose © HDP User Group International, Inc.

© HDP User Group International, Inc. Background Package/board Warpage increasing trends Driven by thinner package substrates and thinner die   Package/Board contacts getting smaller and closer thereby reducing ability to overcome increased Warpage. Solder Joint Quality Impact of increasing Package and Warpage. With advent of lead free soldering, the assembly temperatures have increased and the warpage impact has been exacerbated. © HDP User Group International, Inc.

Examples of Warpage Induced Defects for Area Array Solder Joints Package Substrate Die Board Head-on-Pillow Open Non –Wet Open Stretched joint Head on pillow Various Solder Joint Defects can occur during SMT Reflow Soldering due to Excessive BGA component and/or Board Warpage © HDP User Group International, Inc.

© HDP User Group International, Inc. Real Time Video of FCBGA Solder Joint Mechanism in Assembly Line Reflow Oven © HDP User Group International, Inc.

© HDP User Group International, Inc. Project Scope - What is IN the Scope FCBGA Package just as its entering the SMT Reflow Oven Die FC BGA Package Substrate Package Substrate Project Focus Area Printed Circuit Board Reflow Process Temperature –Time Profile Oven Atmosphere Solder Paste Rheology Wetting Metallurgy Activator chemistry Volume printed on land Surface Finish OSP/ENIG/ImAg/ENEPIG/ etc Package Termination Geometry (ball, pillar, column, etc) Metallurgy (SAC, low Ag SAC, BiSnAg, other) © HDP User Group International, Inc.

© HDP User Group International, Inc. Project Scope - What is OUT of the Scope Package Warpage Mitigation Laminate Type Stack-up Die Thickness Die Size Package Warpage Measurement Metrologies Specifications Die FC BGA Package Substrate Package Substrate Printed Circuit Board Board Warpage Mitigation Laminate Type Stack-up Board Warpage Measurement Metrologies Specifications © HDP User Group International, Inc.

© HDP User Group International, Inc. Objective Establish a limit for dynamic package warpage that can be mitigated during board assembly without impacting solder joint quality Need to set a baseline for today, and set what the limit is for all gaps. It will be non-package or non-PCB related © HDP User Group International, Inc.

© HDP User Group International, Inc. Project Goals Identify mitigation paths for solder joint yield loss caused during the SMT reflow soldering process specifically due to the excessive warpage of package and/or boards Evaluate these mitigation paths for their effectiveness in increasing solder joint yield despite high levels of package and/or board warpage © HDP User Group International, Inc.

Technical Discussion Potential Mitigation Paths Alternate solder paste and package solder ball metallurgies, i.e., low temperature solders Alternate solder temp profiles (steep ramp, soak, spike reflow profile, for instance) Alternate package termination geometries (instead of balls) Optimized solder paste printing geometries  New solder paste formulations Tacky Fluxes, applied by dipping   Each mitigation path can comprise a separate project proposal or all can be combined into one project © HDP User Group International, Inc.

What has been Done to Date Project Scope Identified Key Variables Identified to Control and Monitor during SMT Reflow Soldering Gap between Ball and Paste Researched various methods developed in the Industry to Simulate Major Solder Joint Defects such as HoP and NWO Three methods selected for further Evaluation and Development Modified Plexus’ Method of Adhesive and Solder Pre-form under Package Cisco’s Rework Equipment Use Method Real Time observation of Solder Joint Formation within in-line reflow oven 15 -17 18-25 © HDP User Group International, Inc.

What is Planned For the Future Develop Metrology: Explore the feasibility of using Cisco Rework Method and Modified Plexus Adhesive Method for use with a full array package instead of a single solder ball at a time Develop Real Time Monitoring: Explore possibility of using real time monitoring of solder joint formation within reflow oven with high dynamic warpage components, and subsequently characterize the dynamic warpage of problematic packages already in use today Brainstorm Mitigation paths: for excessive warpage of package and/or boards induced SMT solder joint yield loss and select potential candidates for assessment Select Mitigation Path: Obtain Components and Design and Procure Boards for Evaluation of Mitigation Paths Assess Effectiveness of Mitigation Path: Design and Run Experiments to evaluate present capability of materials and processes and feasibility of the Warpage-induced Defects’ Mitigation Paths © HDP User Group International, Inc.

© HDP User Group International, Inc. Proposed Project Flow Project Team is working on breaking down this project into 3 Phases © HDP User Group International, Inc.

© HDP User Group International, Inc. Team Members –to date Akrometrix Alcatel-Lucent Arlon ASE Celestica Ciena Cisco Curtiss-Wright Ericsson Flextronics Fujitsu Hitachi Hitachi-Chemical IBM Intel IST Group Juniper Multek Nihon-Superior Panasonic Phillips Plexus Rockwell Shengyi TTM Tech Ventec © HDP User Group International, Inc.

© HDP User Group International, Inc. Back-up © HDP User Group International, Inc.

Effect of Typical Dynamic Warpage Characteristics of FCBGA packages on Solder Joint Formation Post Solder Ball Collapse Point Maximum Ball-Board Separation Point Temp Start of Significant Pull Way of Ball from Board reflow Cool down soak `Flat Package` Point Ramp up Post Solidification Point Room Temperature Head-on-Pillow Open Time The typical Dynamic Warpage of a FCBGA package entails For a corner solder joint…….contact first, then separation between the solder ball and the solder paste For a center solder joint……separation first, then contact between the solder ball and the solder paste This contact + separation or vice versa sequence creates solder joint defects © HDP User Group International, Inc.

Gap in Center joint of Package Gap in Corner Joint of Package Variation of Gap between Bottom of Solder Ball and Top of Solder Paste (when solid or molten) `Flat Package` Point Start of Significant Pull Away of Ball from Board Temp Maximum Ball-Board Separation Point Post Solder Ball Collapse Point Post Solidification Point Gap in Center joint of Package Gap in Corner Joint of Package Gap Sharp Decrease in Gap due to collapse of central solder joints Room Temperature Time Besides first contact , then separation for the corner ball, there is a sharp decrease in the gap as the solder balls melt and collapse in the reflow zone within the reflow soldering oven This sharp drop and gap can facilitate coalescence of the molten solder ball and molten solder paste if paste flux is still active © HDP User Group International, Inc.

© HDP User Group International, Inc. Key Points Any method of simulating BGA package warpage during reflow soldering needs to address the following to simulate the conditions for corner solder joints Initial Contact of the BGA solder ball with the solder paste and subsequent separation before or during the soak zone or ramp region Sharp drop in the gap between the molten solder ball and molten paste when the solder balls melt and collapse in the reflow zone region Any method of simulating BGA package warpage during reflow soldering needs to address the following to simulate the conditions for central solder joints No contact between the BGA solder ball and solder paste before or during the ramp zone or soak zone until the flat package point is reached Contact developed between the solder ball and solder paste later in the soak zone © HDP User Group International, Inc.

Simulation for the Corner and Outer Row Solder Joints of the BGA Requirements Initial Contact of the BGA solder ball with the solder paste and subsequent separation before or during the soak zone or ramp region Sharp drop in the gap between the molten solder ball and molten paste when the solder balls melt and collapse in the reflow zone region SAC Solder Pre-form and Solder Paste or Flux Package Room Temp ~20C Adhesive Gap < 0 Initial set up entails amount (thickness) of adhesive adjusted to ensure negative gap between the solder balls and the paste; Board Soak Zone Temp ~160C Gap > 0 Expansion of the adhesive in its thickness direction raised the balls from the paste and creates a positive gap Board Melting of solder preforms in the reflow zone and the subsequent flow of the molten solder into PTH will dramatically drop the stand-off height of the package and eliminate the gap Reflow Zone Temp ~240C Gap < 0 Board The amount of gap and rate at which it is created in the ramp zone of the profile is controlled by the expansion coefficient of the adhesive in its thickness direction © HDP User Group International, Inc.

© HDP User Group International, Inc. One Proposal to Simulate Gap Variation between the BGA Solder Ball and the Solder Paste on the PCB Land BGA Package BGA Solder Balls Adhesive Solder Paste Gap > 0 Board Solder Preform Function of Adhesive: To simulate the increase in the gap by changing its length with increasing temperature due to its coefficient of thermal expansion Function of Solder Preform: To melt at reflow temperature and flow into the PTH it is placed over and simulate the sudden decrease in the gap that occurs when the balls collapse after becoming molten © HDP User Group International, Inc.

Balls and solder paste melt while in contact 4/23/2017 Simulation for the Central Solder Joints of the BGA Requirements No contact between the BGA solder ball and solder paste before or during the ramp zone or soak zone until the flat package point is reached Contact developed between the solder ball and solder paste later in the soak zone Low Temp Solder Pre-form and Solder Paste or Flux Package Adhesive Initial set up entails a gap between the solder balls and the paste; gap amount controlled by amount (thickness) of adhesive Room Temp ~20C Gap at RT > 0 Soak Zone Temp ~160C When the low temp solder pre-form melts balls lowered and touch SAC solder paste Gap < 0 Reflow Zone Temp ~240C Gap < 0 Balls and solder paste melt while in contact The temperature at which the solder ball and paste make contact can be varied by using different solders with different melting points in the SAC profile soak zone Intel Confidential

Requirements for Adhesive Under Component to Simulate the Gap between the Ball and the Paste during SMT Reflow Soldering Adhesive Gap > 0 Expansion of the adhesive in its thickness direction raises the balls from the paste and creates a positive gap Minimum Gap to simulate problematic warpage is 150 microns Board High Coefficient of Linear Expansion after Cure; Sufficient Hardness/Modulus/Rigidity to push the package up as the adhesive expands Survive temperatures up to 250C after cure Dispensable or screen printable Key question: What is the range of Linear Expansion that is needed for the adhesive? © HDP User Group International, Inc.

Cisco’s SRT Rework Equipment Method for Head-on-Pillow Testing BGA rework equipment was also used to reflow the solder ball and the solder paste, while controlling the movement of the solder ball with respect to the solder paste on the pad. The purpose of controlling the movement is to mimic the movement of the corner balls of a BGA as they warp during the reflow process. © HDP User Group International, Inc.

Conditions for Cisco’s Method C1: Initially there is no initial contact between the solder ball and the paste. Then at 200 ° C during the cooling down phase, the solder ball is pulled down slowly (1 mil/second) so that it makes contact with the solder paste. C2: Initially there is no initial contact between the solder ball and paste. Then at 190 °C during the cooling down phase, the solder ball is pulled down slowly so that it makes contact with the solder paste. This condition is similar to C1 but there is less contact time before solidification. C2 Note: When initial contact is made between ball and paste, no H-o-P defects were formed © HDP User Group International, Inc.

Photo’s of Cisco’s Method for Evaluating H-o-P defects Before Solder Paste Reflow After Solder Paste Reflow Aspects of Actual Reflow Soldering of high warpage BGAs NOT Simulated in this Test Lifting up of the solder ball from the solder paste during initial temperature ramp (though this can be done with the equipment) Un-constrained Ball Collapse when the solder melts Temperature Profile simulated with hot air rework machine instead of a reflow oven © HDP User Group International, Inc.

Malcom RCA-1 Observation Monitor Observes and Records the components on a PCB as it goes through the Reflow Oven © HDP User Group International, Inc.