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IT 318: M13 PWB Assembly IT 318 - M13.

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Presentation on theme: "IT 318: M13 PWB Assembly IT 318 - M13."— Presentation transcript:

1 IT 318: M13 PWB Assembly IT M13

2 PWB Assembly Industry $1 Trillion (2013)
(Printed Circuit Design & Fab/Circuits Assembly, Dec 2013, p. 26) (Compared to $280 Billion IC manufacturing industry) PWBs PWB Assemblies IT M13

3 Soldering Through-hole SMT (Surface-Mount Technology)
Place components, then wave solder Screen-print solder paste, then place components, then reflow SMT (Surface-Mount Technology) For 2-sided: Glue bottom side components, then wave solder Top side = screen print solder paste, place components, reflow And variations of the above Most common solder material today: SAC 305 3% Ag, .5% Cu, 96.5% Sn IT M13

4 IT M13

5 IT M13

6 IT M13

7 Intermetallics IT M13

8 Hand Soldering Essentials for good solder joints: 1. Clean (no oils, oxides, dirt); rosin 2. Mechanically stable Steps for good solder joints: 1. Clean tip of soldering iron 2. Make sure component is mechanically stable 3. Apply tip to joint; use a bit of solder for heat transfer 4. Apply solder to other side of joint 5. Continue adding solder until fillets full 6. Remove solder, then remove iron 7. Let cool naturally – do not blow 8. About 5 seconds/joint IT M13

9 PWB Assembly Challenges
Fine-pitch parts Screen-printing solder paste Lead-free solder Faster pick-&-place Lower cost ESD (Electro-Static Discharge) protection Higher quality IT M13


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