Presentation is loading. Please wait.

Presentation is loading. Please wait.

Ragan Technologies, Inc. Presents - Zero Shrink Technology - ZST™ Process for Embedding Fired Multi-Layer Capacitors in LTCC Packages.

Similar presentations

Presentation on theme: "Ragan Technologies, Inc. Presents - Zero Shrink Technology - ZST™ Process for Embedding Fired Multi-Layer Capacitors in LTCC Packages."— Presentation transcript:

1 Ragan Technologies, Inc. Presents - Zero Shrink Technology - ZST™ Process for Embedding Fired Multi-Layer Capacitors in LTCC Packages

2 2 Ragan Technologies ZST™ Overview  Who is RTI?  What is ZST™?  What is passive integration?  What are the benefits of passive integration?  What are the benefits of ZST™ for capacitor integration?  Process used to embed fired capacitors in ZST™  Summary

3 3 Who is RTI?  Ragan Technologies, Inc. is a privately held technology transfer company based in San Diego, CA.  RTI offers turn-key technology development services specializing in tape forming and electronic ceramics.  The founders of RTI have over 190 years of cumulative experience in the technical ceramics industry.

4 4 What is ZST™?  ZST™ is a unique low temperature co- fire tape CAPABILITY for MCM production.  ZST™ is not a new material, but a process.  With this new patented process, sheets can be produced that do not shrink when fired.

5 5 What is ZST™?  By controlling the particle size distribution of the frit, the resulting shrinkage can controlled.  The process has been tested with thousands of combinations of refractory oxides and frits.

6 6 What is ZST™?  By adjusting the raw materials, tapes can be made with:  High K or low K  High CTE or low CTE  Thermal conductor or insulator  Electrical conductor or insulator  Porous or hermetic  AND all sheets can be co-fired because they will not shrink when fired!

7 7 What is ZST™?  With this new process, RTI has created new engineering degrees of freedom.  Because the ceramic does not shrink when fired, it is possible to embed solid articles in the green tape such as...

8 8 What is ZST™?  Solid metal wires or ribbons for high power leads or lead frames  Fired BeO thermal spreaders  Fired alumina die to form a non-reactive resistor printing pad  Resistive or Inductive components

9 9 What is ZST™?  Eliminate costly yield problems associated with shrinkage variation.  Shrinkage tolerances of 0.03% typical.  Precise feature location for closer pitch vias and lines.

10 10 What is ZST™?  Create high strength composites by building up the circuit on fired alumina.  ZST™ forms strong oxide bond.  Resultant composite flexural strength approaches that of alumina. (>250MPa)

11 11 What is passive integration?  Passive integration is the process of incorporating passive components (specifically capacitors, resistors, and inductors) into the MCM substrate or integrated circuit package.

12 12 Benefits of passive integration  Increased circuit density  Decreased circuit size  Reduced weight  Shorter leads  Fewer interconnects  Improved electrical performance  Lower costs in volume production

13 13 Capacitor integration with ZST™  Current technology is to print the conductor plates on subsequent layers of the LTCC tape and form the capacitors as the circuit is stacked.  This process is limited by the K of the LTCC, the thickness of the tape, and the resolution and precision of the printer.

14 14 Capacitor integration with ZST™  Embedding pre-tested multi-layer ceramic capacitors in ZST™…  “Known good die” concept  Broad range of dielectric types  Fewer interconnects = improved signal integrity

15 15 Capacitor integration with ZST™  Facilitates automation - single pick and place operation replaces multiple printing operations and solder re-flow yield problems.  Facilitates miniaturization - increased volumetric efficiency = smaller circuit  Improved reliability - eliminate yield losses due to shorts and opens associated with screen printed capacitors in LTCC.

16 16 Process for embedding fired capacitors in ZST™ Process sequence:  Print conductors  Punch sheets  Stack sheets  Insert capacitors  Laminate  External metalization  Fire

17 17 Design substrate  For demonstration purposes a simple two inch square substrate was designed with five buried capacitors.  Two dielectrics tested:  1206 X7R 0.1µF  1206 NPO 33pF

18 18 Print conductors  The conductor traces were printed on the base layer with Heraeus C4740L Ag conductor paste and dried.

19 19 Punch cavities  Subsequent two layers were punched to form the cavity for the 1206 case size.

20 20 Insert capacitors  The capacitors were inserted into the cavity, with their terminations aligned over the printed pads.

21 21 Lamination  The cover sheet was then placed and the stack was iso-statically pressed in a die.  2500psi - 10 min. - 50ºC

22 22 Co-Fire  The substrate was then metalized with the Ag conductor paste and fired. –875ºC/30 min.

23 23 Capacitance measurement  The capacitance and DF of the embedded chips was verified after firing.

24 24 Thermal Cycling  Preliminary thermal cycling tests were positive…  0ºC to 100ºC to 0ºC - 20 cycles  0ºC soak 1 minute (ice water)  Transfer into boiling water 10 seconds  100ºC soak 1 minute  Transfer into ice water 10 seconds  Repeat

25 25 Summary  ZST™ offers unique solutions to design problems:  Absolute shrinkage control - eliminate variation  Control electrical properties - K etc.  Control mechanical properties - CTE etc.  Embed solid objects - metal & ceramic  These properties can be co-fired together, because the shrinkage is CONTROLLED

Download ppt "Ragan Technologies, Inc. Presents - Zero Shrink Technology - ZST™ Process for Embedding Fired Multi-Layer Capacitors in LTCC Packages."

Similar presentations

Ads by Google