More than Moore ITRS Summer Meeting 2008 July 14, 2008 San Francisco, CA

Source: 2005 ITRS Document online at: Scaling (More Moore) Functional Diversification (More than Moore) Continuing SoC and SIP: Higher Value Systems

2007 ITRS Moores Law and More Definition Graphic Proposal Computing & Data Storage Heterogeneous Integration System on Chip (SOC) and System In Package (SIP) Sense, interact, Empower Baseline CMOS Memory RF HV Power Passives Sensors, Actuators Bio-chips, Fluidics More Moore More than Moore Source: ITRS, European Nanoelectronics Initiative Advisory Council (ENIAC)

More Moore: Scaling Continued shrinking of physical feature sizes of the digital functionalities (logic and memory storage) in order to improve density (cost per function reduction) and performance (speed, power). More than Moore: Functional Diversification I ncorporation into devices of functionalities that do not necessarily scale according to "Moore's Law, but provide additional value in different ways. The "More-than-Moore" approach allows for the non-digital functionalities to migrate from the system board-level into the package (SiP) or onto the chip (SoC). The Challenge: Integration of MM with MtM Creation of intelligent compact systems. More Moore and More than Moore

Following Moores Law is one approach: Monolithic CMOS logic System-on-Chip Power Sensor Actuator Storage Processor Radio Advantage: -Smallest footprint Disadvantage: -Limited functionality More Moore

Adding More-than-Moore is another: System-on-Chip and System-in-Package Power Sensor Actuator Storage Processor Radio Advantage: -Full functionality Disadvantage: -Complex supply chain More than Moore More Moore

Proposal for MtM Study Group Objective: Define and quantify value-adding parameters for functional diversification –Identify/elaborate Technical Parameters –Added Value to the target application –Usual ITRS goals: Grand Challenges, Potential Solutions, narrowing over time –Pitfall (Design): line item doesnt fit May need to tweak to fit the MtM taxonomy –Key parameters for MtM examples in marketplace Involve IRC/ITWGs –A&P, Design, RF/AMS, Test, Interconnect, but open to other TWGs –Key Categories to address: Sensors, Actuators (MEMS, Optical) Key Issue differentiating MtM: Integration Next Meeting will be called by Mart Graef –TWGs notify Mart of their participant at the April ITRS meeting

MtM WG Basic Questions What are the key parameters? –Quantitative –Development over time What are the key drivers? –Functionality –Applications, business carriers