Presentation on theme: "Assembly and Packaging TWG"— Presentation transcript:
1 Assembly and Packaging TWG What has changed in the last 12 months?
2 What Has Changed In The Last 12 Months? With the continuous shrinking of device features and the emergence of new device types everything is changing. A few key changes in the last 12 months are the focus of this presentation.Change dictated by Moore’s Law scalingCopper wire bonding moving toward volume leadershipHeterogeneous integration for SiP2.5D moves the interposer into volume manufacturing3D integrationThinningPhotonics getting closer to the transistorsRequirements for packaging MEMS devices
3 Single Chip Package Technology Requirement Challenges still remain for conventional single chip packagingThe continuous drive to reduce cost remains one of the most challenging requirements
4 Copper Wire Bonding Is Taking Over Driven by:Strong mechanical propertiesBetter heat dissipationIncreases power ratingsThinner wire diametersIt is cheaper than goldImproved process control in now deliveringNo reliability issuesNo yield issuesSome vendors don’t yet have this process control
5 Evolution Of Heterogeneous Integration: 2.5D a bridge to 3D TimeWLCSPFO-WLPFO-WLP SiPHeterogeneous IntegrationIC + AssemblyMEMs & WirelessWirebond BGAFC BGA3D ICdie stackStacked DiePoPEPS2.5D IC (Si Interposer)Heterogeneous IntegrationAssembly + Substrate
6 The Vision Of Complex Sip Is Finally Entering The Market Sony’s CXD5315GG Package in PlayStation Vita5 Layers in the stackProcessorWide IO SDRAM2 mobile DRAMSilicon spacer between the 2 mobile DRAM
7 Packaging is the enabling tool for “More than Moore” Packaging is the enabling tool for “More than Moore”. It allows consumer products that are ever smaller, more powerful, cheaper, require less power and reliability ensuring a useful life that meets the expectation of the customer.
8 Why Has 3D TSV Taken So Long? The typical response is:CostCompetition from existing technologyTechnical inertiaSupply chain maturity“Truth is” it has not been slow.flip chip 30 yearscopper wire bond 30 years3D-TSV 6 years assuming 2013 for volume production
9 Why Has 3D TSV Been So Fast? It has been driven by:CMOS shrinking can no longer keep up the pace of progressEnabling packaging technologies are availableInterposersTSVPerformance advantages are compellingReduced powerReduced latencyIncreased bandwidthReduced size
10 Silicon Interposerdeals with a wide IO interface between devices e.g logic, memory, Fan-out interface from device to package/board high re-routing capability and TSV interconnectsSnAg bumps for FC Interconnects and Cu pillar bumps for board assembly
11 Interposers Are Now In Production Interposer substrate has more than 10,000 routing connectionsCompared with standard I/O connections it provides:> 100X die-to-die bandwidth per wattone-fifth the latencyUses no high-speed serial or parallel I/O resources.This is only 2.5DFull 3D is even better
13 3D Products Are Sampling Today Four layer stacks are sampling today.The industry is getting ready for high volume with the next generation.Greater densityLower latencyHigher bandwidth
14 We Are Thinning Everything What is driving this change?Thinning is delivering what the consumer wantsThinner devices and productsFlexible devices and productsIncreases functional densityStacking needs itIt is the key to low cost TSVHigh yield cost effective thinning processes are availablePackaging challenges remain for cost effective handling of thinned die and wafers
15 We Are Thinning Everything What is being thinned?Wafers and dieDie attach layersLead framesUnderfillPackage substratesMold capsExample: Total package height for BGA counting solder balls is 400um down from 500um a year ago.
16 Optical IO In-to And Out-of Package There is a drive to move photonics as close to the transistors as possible to increase bandwidth and reduce power requirementThe challenges increase with each node due to large size of E to O and O to E conversion
17 MEMS Are Now Shipping For Diverse Applications These products have unique packaging challenges and new solutions are being developed.Package cost is often greater than 50% of product cost and cost remains a factor restraining broader adoption of MEMS solutionsCurrent state of the art productionMEMS oscillatorsSensors with ten degrees of freedom3-axis gyro3-axis magnetometer3-axis accelerometerPressure sensor