RO400FC Forced convection hot air reflow oven
In a flexible production, what do you need for soldering of Complex PCB’s Soldering of fine pitch on BGA components Lead free soldering High quality soldering results Efficient heat transfer technology Low delta T values Even temperature distribution Short and easy setup and change over Precise temperature profiles Controlled and repeatable process conditions
Requirements In a flexible production, what do you need for soldering of Complex PCB’s Soldering of fine pitch on BGA components Lead free soldering High quality soldering results Requirments: Efficient heat transfer technology Low delta T values Even temperature distribution Short and easy setup and change over Precise temperature profiles Controlled and repeatable process conditions
RO400FC hot air full convection reflow oven Real convection reflow technology For standard or lead free soldering Efficient heat transfer Low thermal stress Microprocessor control Integrated temperature profiling Windows profiling software SMEMA interface Small footprint Easy profile selection and programming Mesh belt, chain or double chain conveyor
Real convection reflow technology No visual contact between heat Emitter and substrate Even temperature distribution Maximum temperature is Air temperature No hot spots, no heat shadows Heating independent of component color Suitable also for complex boards
Vertical laminar flow Efficient heat transfer allows standard or lead free soldering High volume / low temperature technology Unique hole pattern ensures even air flow Low thermal stress on components No component shifting even for smallest components High throughput on small footprint 0,4-0,6m/min
5 zone reflow profile 4 top zones, 1 additional bottom convection module in the reflow zone Each module individually controlled Each module with high volume blower Bottom heat module can be turned off for 2nd side soldering Heated length 1680mm Double fan cooling zone Cooling length 640mm
Integrated microprocessor control 20 preset profiles for soldering, lead free soldering and curing 8 free programmable profiles for special applications Easy profile selection for fast setup and change over Easy programming Precise temperature regulation Closed loop controlled DC motor drive for conveyor Actual and set process parameters displayed on LCD
Temperature regulation on substrate level Temperature of each zone measured at PCB level Control of PCB heat load Repeatable soldering conditions No risk of burned PCB’s Tight temperature regulation within +/- 3°C
Mesh belt conveyor Universal mesh belt conveyor for highest flexibility Sinus type support rails for low wear on mesh belt Self tensioning system for belt PCB width up to 400mm
Chain conveyor Small-radius chain conveyor for inline applications Ideal for single and double sided PCB’s Motorized width adjustment with scale Adjustable middle support rail Support rail can be lowered if not required Chain oilers for long life time Double chain system available for parallel production of 2 PCB’s (e.g. prototype on the second line) SMEMA interface available for inline connection
Security system Emergency stop on both ends of the oven Security switch within hood turns off heaters if cover is open Overheat security switches in all heating zones
Other features All electronics accessible from the front Gas spring supported hood Two integrated exhaust connections Slide out unit for soldered PCBs
Flying thermocouples Temperature recording without additional measuring device Monitoring of measured temperatures directly on LCD display Temperatures together wit zone temperatures can be monitored with ROSOFT profiling software
Ro-soft profiling software RS-232 connection Online temperature profiling Storage of measured temperatures Documentation of process conditions Profile comparison
Additional options Three color signal tower for status indication Monitor and keyboard stand Counting sensor Entry and exit sensor for SMEMA connections Slide out plate for finished boards
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