1. Electronics Miniaturization using Fine-Feature Nanosilver conductors
Fine feature (<10 microns) trace/space capability
Maximum component density
Fully encapsulated silver conductors
Quick, inexpensive prototyping
Encapsulated component blocks
Rugged/robust
Minimize dead volume
Easy test of subsystems
Low Capital Equipment Costs

2. Nano-silver conductor fabrication
Pulsed
UV laser
1. 1st Squeegee Fill
Laser ablate channels
2. Low T bake
5. Full oven cure
4. Residue removal
3. 2nd Squeegee Fill
Conductor resistivity ~ 3X bulk Ag
Finished circuit 2

3. Embedded nanoparticle silver conductors
Embedded conductor
Conventional conductor
Nanoparticle conductor advantages:
Eliminate photolithography
Conductor width limited only by laser focal spot size.
<10 micron trace/space demonstrated
Controllable aspect ratio
Additive, green process

4. Substrates: Polyimide ABF LCP MicroLam Mylar Alumina 15 micron traces
Two sides with via

5. Stretchable conductors
Embedded conductor
Polyimide

6. Quasi-conformal circuitry
Stretchable circuits connect miniature modules
Wearable sensors
Conform to irregular shapes
MCU
Sensor
Embedding in elastic polymer 6

7. Fine pitch coil on 1 mm tube

8. High packing density
0201 resistors
> 1000 components/cm3 8

9. Narrow traces reduce layer count and cost
Nanosilver
2 layers
15 to 30 micron traces
$1000 for first 10 substrates
1 day turnaround
Conventional copper
4 layers
75 micron traces
$7800 for first 10 substrates
12 day turnaround
8 mm
12 mm

10. Miniature systems using readily available SMT components
Low cost ASIC equivalent
Adaptable to prototyping/low volume production
Simple manufacturing scale-up

11. Miniature module fabrication
Encapsulate components
Fabricate fine feature interconnects on thin substrates
Nanoparticale silver conductors
Laser direct-write processes
Connect components using conductive adhesives

12. Component Encapsulation
SMD
Carrier film
Mold
Encapsulant
Flat surface
Exposed pads

13. -50C to +150C Testing of 50-component Daisy Chains
Thermal cycling tests
-50C to +150C Testing of 50-component Daisy Chains
Conductive epoxy
Silver traces and pads
0 ohm surface mount resistor
-50 C to 150 C
10 minute cycles
Microvia
Underfill
Chain resistance vs time
500 cycles/no failure

14. Using the modules 3D stand alone assemblies
Miniature subsystems connecting to PCB’s or cables
Solder connection
FR4 or Flex

15. Body orientation sensor
Accelerometer/magnetometer
Wireless transceiver
Modular construction
Mount on helmet
20mm x 25mm footprint
Powered by coin cell
Radio
Programming cable (temporary)
MCU/Sensor module

16. Miniature wireless sensors
9-axis wireless motion sensor
Miniature wireless sensors
Radio
Sensor module
Sensor module
Radio
Microcontroller
Microcontroller
Battery
Battery

17. Smart cable

18. Capital Equipment Required
Paste fill & clean station
Encapsulation mold
Integrated Laser/PnP/Dispense

19. Capital Equipment NOT required
Resist exposure system
Etching/Plating tanks
Lamination Press
Resist stripper

20. Scaling to higher volume
Encapsulation mold
Epoxy Dispenser
UV laser system
Pick and Place
Paste fill & clean station

21. Summary Highly miniaturized circuits using nanosilver conductors
Simplified design and fabrication
Modular construction
Quick/inexpensive prototyping
Green processes
Minimal capital equipment