Electronics Miniaturization using Fine-Feature Nanosilver conductors Fine feature (<10 microns) trace/space capability Maximum component density Fully encapsulated silver conductors Quick, inexpensive prototyping Encapsulated component blocks Rugged/robust Minimize dead volume Easy test of subsystems Low Capital Equipment Costs

Nano-silver conductor fabrication Pulsed UV laser 1. 1st Squeegee Fill Laser ablate channels 2. Low T bake 5. Full oven cure 4. Residue removal 3. 2nd Squeegee Fill Conductor resistivity ~ 3X bulk Ag Finished circuit 2

Embedded nanoparticle silver conductors Embedded conductor Conventional conductor Nanoparticle conductor advantages: Eliminate photolithography Conductor width limited only by laser focal spot size. <10 micron trace/space demonstrated Controllable aspect ratio Additive, green process

Substrates: Polyimide ABF LCP MicroLam Mylar Alumina 15 micron traces Two sides with via

Stretchable conductors Embedded conductor Polyimide

Quasi-conformal circuitry Stretchable circuits connect miniature modules Wearable sensors Conform to irregular shapes MCU Sensor Embedding in elastic polymer 6

Fine pitch coil on 1 mm tube

High packing density 0201 resistors > 1000 components/cm3 8

Narrow traces reduce layer count and cost Nanosilver 2 layers 15 to 30 micron traces $1000 for first 10 substrates 1 day turnaround Conventional copper 4 layers 75 micron traces $7800 for first 10 substrates 12 day turnaround 8 mm 12 mm

Miniature systems using readily available SMT components Low cost ASIC equivalent Adaptable to prototyping/low volume production Simple manufacturing scale-up

Miniature module fabrication Encapsulate components Fabricate fine feature interconnects on thin substrates Nanoparticale silver conductors Laser direct-write processes Connect components using conductive adhesives

Component Encapsulation SMD Carrier film Mold Encapsulant Flat surface Exposed pads

-50C to +150C Testing of 50-component Daisy Chains Thermal cycling tests -50C to +150C Testing of 50-component Daisy Chains Conductive epoxy Silver traces and pads 0 ohm surface mount resistor -50 C to 150 C 10 minute cycles Microvia Underfill Chain resistance vs time 500 cycles/no failure

Using the modules 3D stand alone assemblies Miniature subsystems connecting to PCB’s or cables Solder connection FR4 or Flex

Body orientation sensor Accelerometer/magnetometer Wireless transceiver Modular construction Mount on helmet 20mm x 25mm footprint Powered by coin cell Radio Programming cable (temporary) MCU/Sensor module

Miniature wireless sensors 9-axis wireless motion sensor Miniature wireless sensors Radio Sensor module Sensor module Radio Microcontroller Microcontroller Battery Battery

Smart cable

Capital Equipment Required Paste fill & clean station Encapsulation mold Integrated Laser/PnP/Dispense

Capital Equipment NOT required Resist exposure system Etching/Plating tanks Lamination Press Resist stripper

Scaling to higher volume Encapsulation mold Epoxy Dispenser UV laser system Pick and Place Paste fill & clean station

Summary Highly miniaturized circuits using nanosilver conductors Simplified design and fabrication Modular construction Quick/inexpensive prototyping Green processes Minimal capital equipment