2. 1 5 Packaging Intro Ken Gilleo PhD ET-Trends LLC 44%

3. 2 the Package DEVICE JOINING WIRING PROTECTION Standardization Performance Enhancement Thermal Management Easy Testability Automated Handling Easy Assembly Enable repair Reworkability PROTECTION Chip to PCB Compatibility Rerouting Selective Access to Environment Enable Mechanical Movement Low Stress MEMS

4. 3 Packaging Change Drivers 1.Miniaturization  Area  Height  Weight 2.Performance  High lead count  High frequency; processors, RF 3.MEMS/MOEMS/Nano; a new technology cluster

5. 4 Devices TIME PERFORMANCE Solid State MEMS MOEMS Nano ~50 Years Vacuum

6. 5 Base; platform; chip carrier 1 st Level Interconnect (to chip) Routing (can be optional) 2 nd Level Interconnect (to substrate/PCB) Enclosure; encapsulant Special features TThermal management PPorts, windows, other Basic Package Elements

7. 6 Packages Element – cont. Substrate/Platform/Enclosure  Rigid organic; BT, etc.  Flexible organic; polyimide  Ceramic/glass  Metal with insulation  Protection; enclosure, encapsulation, passivation Chip Connections (1st level)  Wire bond  TAB  Integrated TAB  DCA; Flip Chip PCB Assembly (2nd level)  Fusible: solder spheres/balls/bumps  Non-fusible: leads, pins, pads DIE DIELECTRICS CONDUCTORS

8. 7 Lead Frames Metal – free standing or pre-inserted into dielectric Framing structure removed later Ceramic hermetic; used for MEMS Plastic Near-hermetic; limited use for MEMS Finishes for die attach/bonding  Ag  Pd  Au  Ni  Multiple

9. 8 Chip Carriers Chip Carrier: a packaging system for electronic chips (IC’s) that provides protection and a practical means of connecting to circuitry. Fan Out: 2 nd Level interconnect fans outward from 1 st level Fan In: Conductor and Dielectric First - 1964 A flex-based package

10. 9 Area Array Packages Flip Chip LGA (Land Grid Array); leadless chip carrier, QFN PGA (Pin Grid Array) BGA (Ball Grid Array) Micro-BGA (CSP)

11. 10 Advanced Packaging Types Advanced BGAs Flex-Based MultiChip CSP Array Molded Wafer-Level CSP and FC PRODUCTIVITY

12. 11 Flip Chip Perimeter for small I/O count Area Array is much more effective MEMS potential Selective underfill MEMS

13. 12 Cofired Cast Molded Open (non-hermetic); chip carrier Ceramic Packages Used for MEMS Hermetic moderately expensive

14. 13 Organic Substrate Rigid; mostly epoxies (resin-glass)  FR4 conventional  FR4 type non-halogenated  BT (Bismaleimide-triazine)  New non-epoxy halogen-free products Flexible  Polyimide  LCP Limited use for MEMS Non-hermetic Lowest cost

15. 14 MultiChip Packages Traditional Stacked Single-Plane Cavity type used MEMS + ASIC, other Infineon MEMS mic + ASIC chip

16. 15 Bond die (chip) to base; die attach) 1 st Level connect chip; wire bonding Enclosure; encapsulant Packaging Steps

17. 16 Wire Bonding (WB) Most common connection Gold ball bonding dominants (~ 93%) Features PProgrammable; handles die and package change VVery versatile UUniversal method FFast, automatic, equipment makers keeping pace FFully mechanical process CClean; no pollution, waste, hazardous materials WWell-suited for MEMS/MOEMS

18. 17 Package Protection Fabricated cavity enclosure; metal, plastic, ceramic Transfer Molding Compounds (solids) Glob Top; free flow encapsulant Dam & Fill encapsulants Cavity fill encapsulants Underfill; 4 basic classes Underfill + encapsulant Injection molded cavity packages; near-hermetic Most can’t be used for MEMS

19. 18 BGA DIE encapsulants: for protection & handling Only suitable for capped MEMS CAP MEMS

20. 19 Session Summary Packaging is very dynamic today The package is all about metal & dielectrics Challenges are greater than ever Chip advances push performance WLP is finally gathering momentum MEMS is opening up a new packaging industry