1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

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Presentation transcript:

1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder mm mm Pixel chip Michel Morel EP/ED 09/ x 425µ 256 x 50µ Decoupling capacitors mm mm Power supplies connector 13.92mm 1000mm Flexible Extender Bonding wires MCM - pilot - GOL - Serializer - Laser drivers - Analogue part Pilot & link drivers Data Controls Clk Note: the drawing is not to scale 50 mm 12mm copperAluminium Pull up network resistors

2 CARRIER BUS LAYOUT (b) ± 193 mm ladder1ladder mm Power supplies connector 1000mm Flexible Extender Bonding wires MCM - pilot - GOL - Serializer - Laser drivers - Analogue part Data Controls Clk 50 mm 12 mm Michel Morel EP/ED 09/2000 Note: the drawing is not to scale copperAluminium Pilot & link drivers RC 12.8

READOUT CHIP PIXEL DETECTOR 200µ 600µ 13.92mm Aluminium Polyimide 6 ANALOG_GND 25µ 5 ANALOG_POWER 25µ 4 VERTICAL LINES 5µ 3 HORIZONTAL LINES 10µ 2 DIGITAL_POWER 25µ 1 DIGITAL_GND 25µ Via between horizontal and vertical lines Michel Morel EP/ED 05/00Michel Morel EP/E CARRIER BUS + DETECTOR AND READOUT CHIP CROSS SECTION (solution A) BONDIND WIRES 15.86mm CARBON FIBER SUPPORT COOLING TUBE 1mm Note: the drawing is not to scale

READOUT CHIP PIXEL DETECTOR Aluminium Polyimide CARBON FIBER SUPPORT PIXEL BUS + DETECTOR AND READOUT CHIP CROSS SECTION (solution B) 1 ANALOG_GND 25µ 2 ANALOG_ POWER 25µ 3 HORIZONTAL LINES 10µ 4 VERTICAL LINES 5µ 5 DIGITAL_POWER 25µ 6 DIGITAL_GND 25µ Glue COOLING TUBE 11.92mm2mm ? Michel Morel EP/ED 09/2000 PIXEL_BUS

5 200µ Aluminium Polyimide Michel Morel EP/ED 09/2000 CARRIER BUS + EXTENDER & MCM CROSS SECTION Note: the drawing is not to scale Copper Glue 12mm 1.15mm Carrier bus MCM Pilot & GOL 400µ MCM Carrier 250µ extender Opt. Link Opt. Link Opt. Link

6 CARRIER BUS CROSS SECTION (solution A) Glue 5µ Polyimide 15µ Aluminium 25µ Liquid Polyimide 5µ 200µ Aluminium 10µ Aluminium 5µ Michel Morel EP/ED 09/00Michel Morel EP/ED 0 1) Digital ground 2) Digital power supply 3) Horizontal lines 4) vertical lines 5) Analogue power 6) Analogue ground

7 CARRIER BUS CROSS SECTION (solution B) Glue 5µ Polyimide 15µ Aluminium 25µ Liquid Polyimide 5µ 200µ Aluminium 10µ Aluminium 5µ 6) Digital ground 5) Digital power supply 4) Horizontal lines 3) vertical lines 2) Analogue power 1) Analogue ground

8 Copper Kapton EXTENDER CROSS SECTION 1 - Analogue GND 2 - Analogue Power (3A) 3 - Digital GND 4 - Digital Power (3A) 5 - MCM power Michel Morel EP/ED 09/ Detector power 150µ 250µ 12mm Note: the drawing is not to scale 2mm

9 Bonding wire Vertical lines Analogue power Analogue ground Pixel_chip EXAMPLES OF BONDING CONNECTIONS (solution A) Michel Morel EP/ED 09/00 400µ

10 Vertical lines Analogue power Analogue ground EXAMPLES OF BONDING CONNECTIONS (solution B) 400µ digital power Digital ground Pixel readout chip Pixel detector Michel Morel EP/ED 09/00

11 CARRIER BUS PROTOTYPE MADE AT CERN 200mm x 17mm 4 aluminium layers bus = 81 lines 100µ Aluminium: 15µ Kapton: 50µ Glue: 10µ Total thickness:300µ Michel Morel EP/ED 09/00

12 ladder Pixel_chip Pilot & Optical link Extender carrier bus Michel Morel EP/ED 09/00 TOP VIEW OF ALICE PIXEL DETECTOR ONE SECTOR REPRESENTED (SOLUTION A)