1. Ladder QA Status

2. Ladder QA Summary Ladder8765432187654321Remarks 1XXXXXXXXOOOOOXOO left : short (via-GND) right chip3 : cannot mask 2OOOOOOOOOOOOOOO  right chip1 : defect of bump bond 3O  OOOOOOOOXOOO left chip5-7 : defect of bump bond (~30%) right chip4 : delamination of chip leakage current : 200  A at 20V 4XXXXOOOOOOOOOOXX left chip5-8 : short (via-GND) right chip 1-2 : delamination of chip 5OOOOOOOOOOOOOOOO to be repaired (connector of left bus) few % of left chip 1,2,5,7 and Right chip 2,4 : defect bump bond 6OOOOOOOOOOOOOOOO 7XX left chip1-2 : destroyed 8 wire bonding (going on) 9 completion of sensor gluing Left Right

3. Ladder 1 Noise pixel Cannot mask Cannot take data because of short between DATA B22 (via hole) and GND

4. Ladder 2

5. Ladder 3 Bonding wire popped up

6. 6 Wires of only chip4 of right BUS popped up. Delamination for Ladder3 delaminated from stave chip6 chip5 chip4 chip3 Side view (Ladder3) Top view (Ladder3) Sensor module 8 7 6 5 4 3 2 1 BUS popped up Stave Sensor module BUS

7. Ladder 4 Cannot take data because of short between via hole and GND Bonding wire popped up

8. 8 8 7 6 5 4 3 2 1 Wires of chip1 and 2 of right BUS were damaged. Delamination for Ladder4 Wires of chip8 of left BUS (some analog line and JTAG line) were damaged. Side view (Ladder3) Top view (Ladder4) Sensor module BUS half area doesn’t respond Stave

9. Ladder 5 To be repaired (connector of left bus)

10. Ladder 6

11. Ladder 7 Top view (Ladder7) Wire side