1. M. Szelezniak1PXL Sensor and RDO review – 06/23/2010 STAR Hardware Prototyping Status

2. M. Szelezniak2PXL Sensor and RDO review – 06/23/2010 STAR Talk Outline Development plan LVDS data path at 160 MHz Mass Termination Board RDO Motherboard Flex Cable Development Preliminary Design Alternative Approach Infrastructure Test Board Interfaces to STAR Prototype Telescope System in STAR Probe tests Summary

3. M. Szelezniak3PXL Sensor and RDO review – 06/23/2010 STAR Development Plan PXL RDO Basic Unit 2 m (42 AWG TP) 6 m (24 AWG TP) 100 m (fiber optic) 4 ladders per sector 1 Mass Termination Board (MTB) per sector 1 sector per RDO board 10 RDO boards in the PIXEL system RDO motherboard + Xilinx Virtex-5 Dev Board RDO PC with DDL link to RDO board Mass termination board + latch up protected power daughtercard ← Front Back ↓

4. M. Szelezniak4PXL Sensor and RDO review – 06/23/2010 STAR LVDS Data Path at 160 MHz 2 ns eye pattern opening for 1 m 42 AWG cables at 200 MHz Ladder mock-up with 1-to-4 LVDS fanout buffers Mass termination board + LU monitoring 42 AWG wires 24 AWG wires Virtex-5 based RDO system with DDL link to PC Status Data Path Architecture Validated Measured BER (bit error rate) of < 10 -14

5. M. Szelezniak5PXL Sensor and RDO review – 06/23/2010 STAR Mass Termination Board Status Prototype in hand. Testing in progress. LU protection LU protected power supply VDA,VDD PLL ADC Mass Termination Board LU protected power regulation board I 2 C ADC for sensor temperature monitoring PLL for CLK distribution with 50% duty cycle JTAG buffers LVDS  LVCMOS LVDS buffers JTAG buffers

6. M. Szelezniak6PXL Sensor and RDO review – 06/23/2010 STAR Readout Board Status 3 Prototypes in hand. Firmware, hardware and software are working for individual sensor testing. Xilinx VIRTEX-5 development board USB interface DDL LVDS buffers 50 MHz ADC Custom readout board. fast ADC for sensor testing DDL for data acquisition USB for data acquisition / system monitoring SRAM

7. M. Szelezniak7PXL Sensor and RDO review – 06/23/2010 STAR 7 http://rnc.lbl.gov/hft/hardware/docs/Phase1/cable_power_gnd_trace_optimization.doc Signal# of tracestype Width (0.005 ” t&s) Sensor output10 x 4 x 2 = 80LVDS 0.800 ” (20.32 mm) CLK2LVDS 0.020 ” (0.51 mm) CLK_RETURN2LVDS 0.020 ” (0.51 mm) Marker1CMOS 0.010 ” (0.25 mm) START1CMOS 0.010 ” (0.25 mm) SPEAK1CMOS 0.010 ” (0.25 mm) JTAG + RSTB5CMOS 0.050 ” (1.27 mm) TEMP2analog 0.020 ” (0.51 mm) Total94 0.940 ” (23.88 mm) Number of traces and required width to route (without vias) using industry standard 0.005” (125 µm) traces and spaces and with 17.5 µm Cu trace equivalent thickness. Signal 7 Flex Cable Development Power traceWidth at thickest part Analog power 0.220 ” (5.588 mm) Digital power 0.098 ” (2.489 mm) Ground 0.318 ” (8.077 mm) Total 0.636 ” (16.154 mm) Power W = 23.08 mm

8. M. Szelezniak8PXL Sensor and RDO review – 06/23/2010 STAR Flex Cable – Preliminary Design Hybrid Copper / Aluminum conductor flex cable Side view (exaggerated vertical scale) Top View 2 layer Al conductor cable in low mass region 0.004” (100 µm) traces and 0.004” (100 µm) spaces 70% fill factor Conductor thickness in low mass region is 21 µm (Cu) or 32 µm (Al) Minimum required conductor trace width 1.325” (33.65 mm) of 46.16 mm available. Bond wire connection between Al and Cu cable sections. Low mass region calculated X/X 0 for Cu conductor = 0.232 % Low mass region calculated X/X 0 for Al conductor = 0.073 %

9. M. Szelezniak9PXL Sensor and RDO review – 06/23/2010 STAR Flex Cable – Preliminary Design (cont.) Compared to the standard 4 layer Al conductor cable construction; Advantages One 2-layer Al conductor cable – less reliance on Al conductor flex PCB fabrication process and less complex Al structure. Lower radiation length than previous (not as well justified) estimate. More layers and thus more complex structures in the driver region are possible (this may be needed). Disadvantages Wire bonding (or other high density connection technique) required for inter cable connection. Cable will not be the same thickness everywhere – may complicate fixturing. Non homogeneous CTE in cable.

10. M. Szelezniak10PXL Sensor and RDO review – 06/23/2010 STAR Flex Cable – Alternative Approach Multi-layer single sided with aluminum conductor with cable on top of sensor addresses aluminum via manufacturing issue minimizes the cable X width cable located on the top of the sensors partially obstructs the sensors for both view and touch probe location measurements X = 3.67 mm – exceeds the existing envelope by 0.77 mm X = 2.88 mm if Clock return and RSTB are neglected (production runs) – within the current mechanical envelope VDD, VAA, GND, clock, temp, SPEAK (bonded to power) - ΔX not relevant Sensor 120 µm + no stiffener signal outputs, Clock return, marker, start, JTAG, RSTB – ΔX = 0.105” (2.67 mm)

11. M. Szelezniak11PXL Sensor and RDO review – 06/23/2010 STAR Aluminum Flex Cable A single sided test cable design has been produced for fabrication at Datex to assess capability and quality. Some delay due to material issues. It is difficult to find anyone willing to fabricate kapton/Al. We have located some 1 mil Al on 1 mil mylar and shipped it to Datex. They are evaluating the suitability. Datex is about to start first attempt at fabrication. Other vendors (SE SRTIIE, Kharkov,Ukraine and CERN?) will be contacted. A detailed description of the challenge is available here http://rnc.lbl.gov/hft/hardware/docs/PXL_RDO_cable_options_1.doc http://rnc.lbl.gov/hft/hardware/docs/PXL_RDO_cable_options_1.doc

12. M. Szelezniak12PXL Sensor and RDO review – 06/23/2010 STAR Flex Cable Status PIXEL Cable development stages: 1.Infrastructure testing board 2.Prototype detector cable FR-4 with Cu traces 3.Prototype detector cable Kapton with Cu traces 4.Prototype detector cable Kapton with Al traces Status Preliminary FR-4 test version in hand Testing in progress Infrastructure testing board with extended sensor testing capabilities

13. M. Szelezniak13PXL Sensor and RDO review – 06/23/2010 STAR Infrastructure Test Board Coupling mechanism is under investigation. Next board with 50 μm Phase-2 prototypes is being assembled. The first test of the complete RDO chain: 10-sensor ladder MTB RDO long cables Ladder-like layout except for Power and GND Very preliminary results with full thickness Phase-1 prototypes: Status Multidrop clock working JTAG daisy chain working (with caveats) Testing in progress Noise One sensor at a time100 % All sensors on (high discriminator threshold → low switching/output activity) – expected running configuration Up to 125 % (122 % on average) All sensors on (low discriminator threshold → high switching/output activity) Up to 145 % (138 % on average)

14. M. Szelezniak14PXL Sensor and RDO review – 06/23/2010 STAR Prototype Telescope System in STAR Status 3 Sensor (MimoSTAR2) telescope used at STAR in 2007 RHIC run. Clean noise environment at STAR Successful tracking No latch-up events were observed during the run Interfaces to Trigger and slow controls worked well

15. M. Szelezniak15PXL Sensor and RDO review – 06/23/2010 STAR Probe Tests Initial testing with ~75 μm travel past touchdown 30 μm additional lowering of probe pins Phase-1 discriminator transfer functions ƒ(threshold voltage) observed on two of the probed sensors : Sensors designed with dedicated probe pads in the sensor pad ring. 13 full-thickness, diced sensors probe tested. Up to 3 probe tests on a sensor. We will begin testing thinned sensors within the next few days Status Automated and scripted system for sensor testing is in place. Vacuum chuck for handling up to twenty 50 μm thick sensors is being tested Ongoing sensor testing

16. M. Szelezniak16PXL Sensor and RDO review – 06/23/2010 STAR Summary RDO basic unit has been prototyped and successfully tested Development of the low mass flex cable has started The first FR4 ladder prototype is under test Interface to the STAR trigger and slow control systems successfully tested Automated probe test setup ready for testing thinned sensors