Hardware-in-the-Loop Testbed Team 186

Project Collaborators Team Members: o Aaron Eaddy – EE o Ken Gobin – EE/COMPE o Douglas Pence – ENGR PHYS/EE Team Advisor/Sponsor: o Sung Yeul Park – Assistant Professor

Outline Background Components: o Microcontroller o Interface circuit o Sensor circuits Design Updates Circuitry Timeline Budget

Background Hardware-in-the-Loop: o A simulation technique that is used in the development and testing of complex real-time embedded system designs. o Benefits: Function tests are able to be done at an early stage of development. Laboratory tests are cheaper, more flexible and highly controllable. No potential major risk of physically damaging test failures. Tests are easy to reproduce and provide highly consistent results. Improve battery operation and monitoring State of Health State of Charge Remaining useful life Voltage, current, and temperature

Components

Design Updates Initial Design: TI ezDSP® F28335 o 6 data/address lines, 59 GPIO, ADC o MATLAB® Simulink, Code Composer Studio® Updated Design – Rev 1: dSPACE® RTI-1104 o ADC ports, PWM CP-18 connector, embedded microcontroller o MATLAB® Simulink software for digital signal processing and ease-of-use display o Removed CCS as an “extra” middle software process. Less complicated and more robust. Updated Design – Rev 2: o Changed from ‘8’-channel design to hybrid ‘4+2’-channel design o Changed from 1 to 2 PCB design – isolate analog from digital and provide safety barrier o Simplified GPIO requirements with PWM MUX select o Added scaling, filtering and digital isolator

dSPACE® Microcontroller dSPACE® RTI-1104 dSPACE® ControlDesk

dSPACE® Limitations Maximum 8 ADC channels Maximum of 10-Volt ADC processing signal limit Maximum of 5-Volt system hardware limit Main reason for switching from ‘8’-channel design to ‘4+2’- channel design was related to these limitations, specifically the 8 ADC channel hardware limitation.

Sensors and Circuits Voltage Sensor Current Sensor o Internal Impedance of each Cell. Temperature Sensor o Ambient o Battery Surface Amplification o Integration with ADC Scaling for Multiple Cells Requirements o 30V o 4 Cells Integration

Voltage Sensing Circuit

Current Sensor

Current Sensing Circuit

Temperature Sensing Circuit

Interface Circuit

Printed Circuit Board Design

Timeline Research Item JanFebMar Apr Design Schematics + Part List xx x PCB Layout x x xxxxxx Parts Order xxx PCB Order xx Board Assembly xx Board Testing Hardware xx DSP x x Power Test xx

Budget Total Budget $1,000 Current Expenditure Estimate: o Temperature Sensors and Initial Parts - $156 o PCB Order - $198 o Additional Parts and Expandable Testing Components - $492 Budget Surplus Estimate$154

Questions ?