CMOS Inverter Layout P-well mask (dark field) Active (clear field)

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Presentation transcript:

CMOS Inverter Layout P-well mask (dark field) Active (clear field) DD Active (clear field) PMOS W/L=9l/2l Gate (clear field) Note body contacts: p-well to GND n-substrate to VDD Select mask (dark field & clear field) NMOS W/L=3l/2l Contact (dark field) GND Metal (clear field)

Visualizing Layouts and Cross-Sections with SIMPLer SIMPL is a CAD tool created by Prof. Neureuther’s group allows IC designers to visualize device cross-sections corresponding to a fabrication process and physical layout. A Berkeley undergraduate student, Harlan Hile, created a mini-version of SIMPL (called SIMPLer) for EE40. It’s a JAVA program -> can be run on any computer, as well as on a web server. A 3D version SIMPL-GL can be accessed at http://cuervo2.eecs.berkeley.edu/Volcano/simpl_gl/main.htm

Twin Well + STI CMOS Process Define active areas; etch Si trenches Fill trenches (deposit SiO2 then CMP) Form wells (implantation + thermal anneal) Grow gate oxide Deposit poly-Si and pattern gate electrodes Implant source/drain and body-contact regions Activate dopants (thermal anneal) Deposit insulating layer (SiO2); planarize (CMP) Open contact holes; deposit & pattern metal layer

3D view of a CMOS inverter after contact etch. 9

Well Engineering P-tub N-tub Twin Tub 10

Twin Well CMOS Process Flow 11

Retrograde Well - formed by high energy (>200keV) implantation C(x) Conventional well (depth and profile controlled by diffusion drive-in) Retrograde well (depth and profile controlled by implantation energy and dose) x 12

Conventional vs Retrograde Well Very low thermal budget for well formation (no need for diffusion drive-in) 2) Retrograde Well is formed AFTER field oxidation  small lateral diffusion and localized high conc under FOX 13

Example: Formation of Channel Stop and Retrograde Well in a single step Retrograde well Channel stop 14

Multiple Implants for Well Engineering 15

Channel Engineering Shallow Oxide Trench Isolation N Cheung EE243 Sp2010 Lec 1

Generic Silicon-on-Insulator (SOI) CMOS Process Flow 17

SOI Process Flow (continued) 18

Self-Aligned Channel V-gate by Optical Lithography (SALVO) Process Smallest feature printable by lithography Normal S/D implant Oxide spacer poly-Si gate CVD oxide CVD oxide n+ n+ n+ n+ SiO2 Thermal gate oxide Angled Implant n+ pocket TiSi2 * Sub-50nm channels 19

SALVO Process Flow or See Homework Problem Chang et al, IEDM 2000 20

SUMMARY OF IC PROCESS INTEGRATION MODULE Self aligned techniques: channel stop, Source/Drain, LDD, SALICIDE How to read process flow descriptions and cross-sections Generic NMOS Process with LOCOS Generic CMOS Process with LOCOS and single well Modified Processes: Shallow Trench Isolation (STI), Twin Wells, Retrograde Well, SOI CMOS 21