Memory Aid “a hairpin is lighter than a frying pan” light m* (larger d2E/dK2) heavy m* (smaller d2E/dK2)

Slides:



Advertisements
Similar presentations
Lecture Metal-Oxide-Semiconductor (MOS) Field-Effect Transistors (FET) MOSFET Introduction 1.
Advertisements

MICROWAVE FET Microwave FET : operates in the microwave frequencies
Homogeneous Semiconductors
GOAL: The density of electrons (n o ) can be found precisely if we know 1. the number of allowed energy states in a small energy range, dE: S(E)dE “the.
Semiconductor basics 1. Vacuum tubes  Diode  Triode 2. Semiconductors  Diode  Transistors Bipolar Bipolar Field Effect Field Effect 3. What’s next?
Introduction to Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) Chapter 7, Anderson and Anderson.
Introduction to FinFet
Lecture 1b - Review Kishore C Acharya. 2 Building Semiconductor Devices To build semiconductor devices # of carriers present in the semiconductor must.
Junction Capacitances The n + regions forms a number of planar pn-junctions with the surrounding p-type substrate numbered 1-5 on the diagram. Planar junctions.
Memory Aid “a hairpin is lighter than a frying pan” light m * (larger d 2 E/dK 2 ) heavy m * (smaller d 2 E/dK 2 )
HO #3: ELEN Review MOS TransistorsPage 1S. Saha Long Channel MOS Transistors The theory developed for MOS capacitor (HO #2) can be directly extended.
Introduction to semiconductor technology. Outline –6 Junctions Metal-semiconductor junctions –6 Field effect transistors JFET and MOS transistors Ideal.
Spencer/Ghausi, Introduction to Electronic Circuit Design, 1e, ©2003, Pearson Education, Inc. Chapter 2, slide 1 Introduction to Electronic Circuit Design.
MOS Transistor Theory The MOS transistor is a majority carrier device having the current in the conducting channel being controlled by the voltage applied.
The Devices: MOS Transistor
UNIT II : BASIC ELECTRICAL PROPERTIES
L ECE 4243/6243 Fall 2016 UConn F. Jain Notes Chapter L11 (page ). FET Operation slides Scaling Laws of FETs (slides 9-22)
Chapter 6 The Field Effect Transistor
Lecture 12 OUTLINE pn Junction Diodes (cont’d) Junction breakdown
Recall-Lecture 3 Atomic structure of Group IV materials particularly on Silicon Intrinsic carrier concentration, ni.
Day 9: September 27, 2010 MOS Transistor Basics
Chapter 2 MOS Transistors.
Lecture 15 OUTLINE The MOS Capacitor Energy band diagrams
MOS Field-Effect Transistors (MOSFETs)
Floating-Gate Devices / Circuits
Conductivity Charge carriers follow a random path unless an external field is applied. Then, they acquire a drift velocity that is dependent upon their.
Recall Last Lecture Common collector Voltage gain and Current gain
DMT 241 – Introduction to IC Layout
Revision CHAPTER 6.
VLSI design Short channel Effects in Deep Submicron CMOS
by Alexander Glavtchev
Introduction to Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) Chapter 7, Anderson and Anderson.
Lecture 22 OUTLINE The MOSFET (cont’d) MOSFET scaling
Intro to Semiconductors and p-n junction devices
Long Channel MOSFETs.
A p-n junction is not a device
Recall-Lecture 3 Atomic structure of Group IV materials particularly on Silicon Intrinsic carrier concentration, ni.
6.3.3 Short Channel Effects When the channel length is small (less than 1m), high field effect must be considered. For Si, a better approximation of field-dependent.
Other FET’s and Optoelectronic Devices
INTRODUCTION: MD. SHAFIQUL ISLAM ROLL: REGI:
EE141 Chapter 3 VLSI Design The Devices March 28, 2003.
ECE574 – Lecture 3 Page 1 MA/JT 1/14/03 MOS structure MOS: Metal-oxide-semiconductor –Gate: metal (or polysilicon) –Oxide: silicon dioxide, grown on substrate.
Lecture #30 OUTLINE The MOS Capacitor Electrostatics
MOSFET Scaling ECE G201.
Long Channel MOS Transistors
Lecture 16 ANNOUNCEMENTS OUTLINE MOS capacitor (cont’d)
Lecture 19 OUTLINE The MOSFET: Structure and operation
Lecture 13: Part I: MOS Small-Signal Models
(definition) Effect of recombination currents. High injection effects also shown. Note: recombination does not contribute.
Day 10: September 26, 2012 MOS Transistor Basics
MOSFET Scaling ECE G201.
Long Channel MOS Transistors
FIELD EFFECT TRANSISTOR
EE130/230A Discussion 5 Peng Zheng.
(definition) HBT Heterojunction Bipolar Transistor.
Lecture 16 OUTLINE The MOS Capacitor (cont’d) Electrostatics
EXAMPLE 7.1 BJECTIVE Determine the total bias current on an IC due to subthreshold current. Assume there are 107 n-channel transistors on a single chip,
Lecture 22 OUTLINE The MOSFET (cont’d) MOSFET scaling
6.1 Transistor Operation 6.2 The Junction FET
Lecture #15 OUTLINE Diode analysis and applications continued
Lecture 15 OUTLINE The MOS Capacitor Energy band diagrams
Lecture 12 OUTLINE pn Junction Diodes (cont’d) Junction breakdown
Lecture 4: Nonideal Transistor Theory
Lecture 16 OUTLINE The MOS Capacitor (cont’d) Electrostatics
Modern Semiconductor Devices for Integrated Circuits (C. Hu)
Sung June Kim Chapter 18. NONIDEAL MOS Sung June Kim
Lecture 4: Nonideal Transistor Theory
ECE 340 Lecture 23 Current Flow in P-N diode
Beyond Si MOSFETs Part IV.
Beyond Si MOSFETs Part 1.
Presentation transcript:

Memory Aid “a hairpin is lighter than a frying pan” light m* (larger d2E/dK2) heavy m* (smaller d2E/dK2)

f(E) = 1/{1+exp[(E-EF)/kT]} EF E T=0 oK T1>0 T2>T1 0.5 All energy levels are filled with e-’s below the Fermi Energy at 0 oK

Putting the pieces together: for electrons, n(E) f(E) 1 EF E T=0 oK T1>0 T2>T1 0.5 EV EC S(E) E n(E)=S(E)f(E)

Putting the pieces together: for holes, p(E) fp(E) T=0 oK 1 T1>0 T2>T1 0.5 S(E) E EV EF EC p(E)=S(E)f(E) hole energy

Finding no and po the effective density of states in the conduction band

NA -> NA-ND = NA’ = ppo ND -> ND-NA = ND’ = nno

w=(2εV/qNB)1/2

Lasers

p n+ n++ L W (x) Ec(y) with VDS=0

Increasing VGS decreases EB EF ~ EC y L

Band diagram of triode and saturation

Threshold Voltage Definition VGS = VT when the carrier concentration in the channel is equal to the carrier concentration in the bulk silicon. Mathematically, this occurs when fs=2ff , where fs is called the surface potential

Quantum Effects on Threshold Voltage

(Maybe not so good for GaAs!) This is very confusing, because this effective mobility is being used to describe the velocity of carriers when the concept of mobility is not applicable!

Most Simple Model: Constant Field Scaling E = VDD/L after scaling becomes E = (VDD/a)/(L/a) …where a>1 next

Subthreshold Current (revisited) VDD scaling  VT scaling

High-K gate insulator reduces tunneling current by allowing a thicker insulator 0.8 nm

Junction Leakage Current Tunneling current due to highly doped Drain-Body junctions EV W D IJE Recall: tunneling T = Kexp(-2kW)

Total Stand-by Power Poff = VDD(Ig + IJE + Ioff)

Scaling Directions (I) SOI (DST, depleted substrate transistor) Very thin body region (Tsi = L/3) makes the source and drain spreading resistance (RS) large. Raised S/D improves ID (next) Improves subthreshold slope, S and decreases Ioff Also decreases CjE …and IJE

Scaling Directions (II) The “FinFET” moves from a single gate to double and triple gate structures and also multiple channels.

(Equation 2.111)

Effect of recombination currents. High injection effects also shown. Note: recombination does not contribute to Ic!

General behavior of β (hFE) as a function of collector current (from Sze). Low currents: Recombination currents dominate (just as in diode). High currents: High injection effects (increases effective base doping) and series resistance effects increase.