3D interconnection in the DevDET FP7 proposal 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop Scope of Proposal 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop Scope of the Proposal 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop Workpackages 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop WP3 objectives 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop Task Description 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop Budget Total Budget: 1.25 MEuro EU contribution: 450 kEuro (request!) Probably not sufficient for the ambitious program Partners have to increase their contribution However: It’s a coordination project Main emphasis on creation of common activities: - shared design of test ASIC - common MPW - common processing of test/prototype interconnection 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop Timeline Proposal filed: 29. February 2008 Expect Decision: Early July 2008 Negotiation Phase, Consortium Agreement Official Start: January 2009 However: get started now: N. Hessey: Recfa will back a start on the common project aspects of DevDet, until DevDet starts -> get organized 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop Scope of the workshop One of the goals of this workshop is the formation of a common platform for the R&D on vertically integrated pixel detector systems which then would give the opportunity to share the experience and open new possibilities for the organization of common projects How to form a common platform? ASIC/sensor design ASIC/sensor production 3D interconnection processing IZM IMEC MIT Tazzaron ……… Ideal: MPW projects 3D Integration workshop Ringberg Castle April 6-9, 2009

3D Integration workshop MPW with wafer access Main obstacle: many process steps need complete wafers postprocessing of ASICs barrier layers, metal layers even chip-to-wafer needs such processing single chips form MPW cannot be used! Proposal: Organize common MPW runs of 3D-community with agreed access to Complete wafers Possible if organized by CERN (has happened before) Costs of an extra wafer: ~3000 $ Costs of an MPW: ~300 k$ (130nm, IBM) Need some kind of NDA (don’t use chips on the wafer not belonging to you) This is possible if the entire wafer is for the community What is needed: Sufficient participants to fill a wafer (however, not all needs to be for 3D!) Agree on a common technology 3D Integration workshop Ringberg Castle April 6-9, 2009