1. New EU FP7 I3 call Identifier: FP7-INFRASTRUCTURES-2010-2
Publication Date: 30 July 2009
Budget: € 
Deadline: 24 November 2009 at 17:00:00 (Brussels local time)
OJ Reference: OJ C177 of 30 July 2009
Specific Programme(s):  Capacities 
Theme: Research Infrastructures
The Integrating activity call is targeted towards topics, one being
Detectors for future accelerators. A project under this topic should aim at integrating the key research infrastructures in Europe for the development of advanced detector technologies.
A not successful application was made in 2008 (DevDet), so this application will be improved/adjusted, but with similar scope.
VIPS
LP09, Hamburg
August 18, 2009

2. Steinar Stapnes, Cracow:
VIPS
LP09, Hamburg
August 18, 2009

3. 3D interconnection in the DevDET FP7 proposal
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LP09, Hamburg
August 18, 2009

4. Scope of Proposal
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LP09, Hamburg
August 18, 2009

5. Scope of the Proposal
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LP09, Hamburg
August 18, 2009

6. Workpackages
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LP09, Hamburg
August 18, 2009

7. WP3 objectives
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LP09, Hamburg
August 18, 2009

8. Task Description
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LP09, Hamburg
August 18, 2009

9. Budget of WP3.3 Total Budget: 1.25 MEuro EU contribution: 450 kEuro
(request!)
Probably not sufficient for the ambitious program
Partners have to increase their contribution
However: It’s a coordination project
Main emphasis on creation of common activities:
- shared design of test ASIC
- common MPW
- common processing of test/prototype interconnection
VIPS
LP09, Hamburg
August 18, 2009

10. Improvements – Changes to DEVDET (general)
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LP09, Hamburg
August 18, 2009
Actually, the WP on 3D integration was mentioned explicitly and very positively in the referee’s report.
This should encourage us to have such an WP again, even extended

11. Changes since February 2008 concerning WP3.3
The interest in 3D integration pixel detectors keeps on growing
VIPS facilitation group
Fermilab’s 3DIC collaboration has been established since then and is setting the path (MPW with Tezzaron and Chartered)
Similar project planned at KEK (SOI with OKI)
These developments need to be taken into account!
In principle: more institutions should be interested to join
However, many of them (actually some of the main players of DEVDET joined 3DIC. Good move, but maybe resources for DEVDET2 are now limited
VIPS
LP09, Hamburg
August 18, 2009

12. Possibilities DEVDET2 could be complementary to 3DIC
=> option of post-processing (vias last) and interconnection of different technologies
- high quality sensors / CMOS
- different CMOS technologies for tiers 1 and 2
MPW with wafer access is still mandatory
CMOS on high resistivity epi? (MAPS as tier 1)
b) Try to link to 3DIC (and KEK) activities
How could this be done within the EU framework?
Offer access to 3DIC to a network of European groups
organization of MPW (e.g. DRC) as ‘service infrastructure’
c) A combination of a) and b)
=> Your choice! Need input and ideas!
VIPS
LP09, Hamburg
August 18, 2009

13. Next steps Outline the proposal
Need to circulate this proposal and find interested institutions
Decide on strategy
Negotiate budget (should be more than for DEVDET)
Draft WP (Task description)
and phone (EVO) meetings
Proposal: VIPS to help organizing this
VIPS
LP09, Hamburg
August 18, 2009