Process map NVA VA VA VA VA NVA VA NVA NVA NVA NVA NVA VA NVA NVA NVA f Transportation DPU Cycle Time Paste Printing Component Placement Checking Reflow Soldering Visual inspection Repairing Cutting Testing 1 Testing 2 Testing 3 p p: passed the test f: failed the test NVA VA VA VA VA NVA VA NVA NVA NVA NVA NVA VA NVA NVA NVA

Details of process map (I.) Xs: C Conveyor Speed C Conveyor Width C Conveyor Height S PCB Side (0-1-2) N Operator S PCB Size Ys: PCB loading PCB Jamming PCB Fall Down PCB Break Transportation Cycle Time DPU

Details of process map (II.) C F Force C F Balance C F Speed C R Force C R Balance C R Speed C Detent C Snap Off C Knead On C Kn. Frequency C Wiper On C Wip. Frequency C In Speed C Solvent C Solv. Frequency C Wipe After Knead C Vacuum C Vac. Frequency C Vac. Speed C FP Mode C Stretch On C Max X C Max Y C Snuggers C Print Vac. C Slow Snap C Distance C Slow Snap Speed C Review Errors C Inspect 2D S Squeegee Shape C Sque. Angle S Sque. Matter C Sque. Pressure C Paste Temperature N P. Evaporation N P. Contamination N Flux Activity N P. Viscosity S Utilization Time C P. Storage State C P. Homogeneity N PCB Cleanness N PCB Dimension N Cleaning Material C Paste type N Operator C Stencil thickness Ys: Paste Amount (Height) Paste Sag Covering Alignment Printing “Cleanness” Paste Printing Cycle time DPU Xs:

Details of process map (III.) Xs: C Head Speed C Table Speed C Setting of Component Recognize C Lighting C Vacuum N PCB Marking Sign C Paste N Operator N Component Dimension C Component Value N Component Shape N Component Legs N Component Polarity N Component Side Component Placement Cycle Time DPU Ys: Component Alignment Mounted Components Damaged PCB Component Mech. Damage Missing Component Part on Backside Wrong Value Component Shift Damaged Component Wrong Polarity Twisted Placement Pin Bent C Pick Up Height C Placement Height C Mounting Tool C Maintenance C Feeder conditions C Nozzle conditions

Details of process map (IV.) Xs: C Zone temperatures C Conveyor Speed C Conveyor Location C Cooling C Wet C Printed & Mounted PCB N Operator C Paste type Reflow Soldering Cycle Time DPU Ys: Cold Soldering Solder Bridge Solder Balls Pin in Air PCB Fall Down Component Overheated Missing Soldering Component Damage Bad Wetting Missing Component Excess Solder Hole In Soldering Tombstoning Flux Residue Component Shift

Details of process map (V.) Xs: S Mounted, Soldered Boards S Magnifying S Microscope N Operator Ys: Cold Soldering Solder Bridge Solder Balls Pin in Air Dirty PCB Wrong Label PCB Damage Missing Soldering Component Damage Bad Wetting Missing Component Wrong Component Excess Solder Hole In Soldering Tombstoning Flux Residue Component Shift Missing Label Visual Inspection Cycle Time DPU

Details of process map (VI.) Xs: S Mounted, Soldered Boards N Operator C Soldering Bit S Failure Mode S Tin, Flux C Components Ys: Cold Soldering Solder Bridge Solder Balls Pin in Air Dirty PCB Wrong Label PCB Damage Missing Soldering Component Damage Bad Wetting Missing Component Wrong Component Excess Solder Hole In Soldering Solder Flag Flux Residue Component Shift Missing Label Wrong Polarity Repairing Cycle Time DPU

Pareto analysis for SMT failures

Pareto chart for SMT failures of D200