1. BASIC HAND SOLDERING
MULTICORE SOLDER
most common type for hand soldering has a composition of Tin (Sn60) and Lead (Pb40), with a diameter of 0.71 mm
contains internal core of non-corrosive Rosin Mildly Activated (RMA) flux
has a ‘plastic’ stage between the melting and solidifying stages

2. BASIC HAND SOLDERING ‘Dry joints’ are caused through:
movement of joint during ‘plastic’ stage
thermal stress
PCB contamination
oxidisation
BASIC HAND SOLDERING

3. TIPS BASIC HAND SOLDERING
appropriate size and width is determined by the size of the connection to be made
ideally 2/3 to equal the diameter of the pad
tips should be correctly 'tinned’ at all times, by adding a small amount of solder to the hot tip

4. BASIC HAND SOLDERING LEAD FORMING
minimum distance from the end of the component body to the start of the lead bend is usually 2 lead diameters or 1.5mm for hand bending methods
without undue pressure hold the component lead with the pliers and bend the lead protruding beyond the pliers with a finger until a 90 degree angle is formed.
if damaged discard component

5. BASIC HAND SOLDERING COMPONENT MOUNTING
Radial leaded loaded slightly off the PCB ( mm)
Axial-leaded loaded with the body of the component very close to the PCB ( mm)

6. BASIC HAND SOLDERING BENDING AND MOUNTING OF COMPONENTS
mounted centrally between the holes
resistors mounted so colour code orientated in the same direction
polarised components should be orientated so that polarity symbols (+ or - ) and component value are visible

7. BASIC HAND SOLDERING LEAD TERMINATIONS TYPE 1 FULLY CLINCHED –
bend the lead flat against the pad
trim the lead to a length of between 1-2 lead diameters
Used in High Quality/High Reliability military or life support applications
difficult to rework
TYPE 2 SEMI-CLINCHED –
bend the lead to an angle of approx. 45
Cut to a minimum of 0.5mm and a max. of 1.5mm, or between 1-2 lead diameters
Used for commercial applications
ease of de-soldering
TYPE 3 RIGID LEAD TERMINATION –
straight through termination
Cut to a length of min. 0.5mm and max. of 1.5mm, or between 1-2 lead diameters

8. BASIC HAND SOLDERING CONSTRUCTING A GOOD SOLDER JOINT
Figure a) the amount of solder applied is minimal and may result in a poor electrical connection over time.
Figure b) shows the optimal solder joint that has good wetting between component lead and PCB pad.
Figure c) indicates an excessive amount of solder has been applied to the connection.

9. BASIC HAND SOLDERING CLEANING
a process of removing contaminates before and after soldering
ensures good mechanical/electrical connection
Three different methods:
Mechanical - scourer or bristle brush
Chemical - solvents eg. Isopropyl Alcohol
Thermal - solder pot

10. BASIC HAND SOLDERING BASIC SOLDERING PROCEDURE
iron temperature is set at approx. 350
soldering iron tip size is suitable
solder sponge is damp
tip is clean and shiny (wipe & tin)
Apply flux (RMA) to help ‘wetting’ if necessary
soldering iron at a 45 angle

11. BASIC HAND SOLDERING BASIC SOLDERING PROCEDURE
heat the lead and the pad simultaneously
flowing solder around the joint forms a heat bridge
remove soldering iron and solder simultaneously (prevents ‘spiking’)
clean the PCB with Isopropyl Alcohol and a bristle brush
wipe or pat dry with a lint free tissue to remove traces of residue.

12. Use appropriate safety equipment fume extractors hand cleaners goggles
BASIC HAND SOLDERING
Use appropriate safety equipment
fume extractors
hand cleaners
goggles
READY TO SOLDER