EE503 Integrated Circuit Fabrication & Packaging Technology TOPIC 1 INTRODUCTION TO INTEGRATED CIRCUIT By: Noorfozila Binti Bahari Pensyarah Utama JKE POLISAS

TOPICS in EE503 Introduction To Integrated Circuits (IC) Silicon And Wafer Preparation Integrated Circuit Fabrication Process MOS Transistor Fabrication Integrated Circuit Packaging Technology Integrated Circuit Testing, Yield And Reliability Micro-Electromechanical System (MEMS)

TOPICS in EE503 Introduction To Integrated Circuits (IC) IC technology evolution Classification of IC

TOPICS in EE503 Silicon And Wafer Preparation

TOPICS in EE503 Integrated Circuit Fabrication Process

TOPICS in EE503 MOS Transistor Fabrication NMOS transistor PMOS transistor

TOPICS in EE503 Integrated Circuit Packaging Technology

TOPICS in EE503 Integrated Circuit Testing, Yield And Reliability IC testing Defects and Yield Analysis Reliability and Degradation

TOPICS in EE503 Micro-Electromechanical System (MEMS)

Learning Outcomes Understand Integrated Circuit (IC) Technology At the end of this session, students should be able to: Understand Integrated Circuit (IC) Technology Know the classification of IC

INTRODUCTION TO IC Definition of Integrated circuit A complex set of tiny components and their interconnections that are imprinted onto a tiny slice of semiconductor material (e.g silicon). Integrated circuits are usually called ICs or chips.

History of Semiconductor Industry

History of Semiconductor Industry

History of Semiconductor Industry

Main Applications of IC Most electronic equipment today use integrated circuit, for example: Computer / Server / workstation TV / Radio / Video Cell Phones Digital Clock Robotic Systems Telecommunication System Automotive Medical Equipment Aerospace Children's Toys Military Field Missile System etc.

Advantages of IC i. Small ii. Low Cost iii. Light Weight iv. Low power consumption v. Easy replacement vi. High reliability - the ability of a system or component to perform its required functions under stated conditions for a specified period of time.

IC Integration Scales 12 In 1975, he updated his prediction to once every 18-24 months.

Factors that contribute to the accuracy of Moore’s Law Miniaturization size of transistor from 10µm (micron) to submicron. Nowadays, the smallest transistor is 45nm (0.045µm). Evolution of transistor design rule micron submicron deep submicron nano technology 10µm 1µm 0.18µm 45nm (Pentium Dual Core) 5µm 0.5µm 0.01µm 20nm (in research) 3µm 0.35µm 0.25µm

Factors that contribute to the accuracy of Moore’s Law The law is still disputed because the linear growth starts to decline; the number of transistors should increase linearly, but it starts to decrease after 1970.

Microelectronics Evolution Year Technology No. of transistors Example 1947-1950 Transistor 1 - 1951 -1960 Discrete Component FET, Diode 1961 -1966 SSI - Small scale integration 10 Logic Gates, Flip-flop 1967-1971 MSI - Medium scale integration 100 – 1000 Counter, Multiplexer 1972-1980 LSI - Large scale integration 1000 – 20,000 RAM, Microprocessor 1981 -1990 VLSI - Very large scale integration 20,000 – 1,000,000 16 bits and 32 bits Microprocessor 1990-2000 ULSI - Ultra large scale integration 1,000,000 – 10,000,000 Graphic microprocessor 2000 - nowadays GSI - Giant scale integration > 10,000,000 Pentium Dual Core Microprocessor

Student Centred Activity - Group Discussion 1 Based on the given graphs, relate Moore’s Law to the following evolution of microelectronics memory devices. Based on the given graphs, relate Moore’s Law to the scaling down of transistor size and the trend in microprocessors.

Question # 1.

Question # 2

Classification of Integrated Circuit In general, IC can be classified into FOUR (4) categories : Classification based on circuits function Classification based on the fabrication method Classification based on transistor type Classification based on design methodology

Classification Based on Fabrication Method IC Classification based on fabrication method: a. Monolithic b. Film c. Hybrid

Classification Based on Fabrication Method a. Monolithic The word ‘monolithic’ is derived from the Greek word monos, meaning ’single’ and lithos, meaning ‘stone’. A monolithic IC is a miniaturized electronic circuit including both active and passive components and their interconnections are being manufactured in the surface of a thin substrate of semiconductor material.

Monolithic IC

Monolithic IC Criteria of monolithic IC: most popular because of low cost high reliability isolation weakness limited range of passive components circuit design is not flexible.

Classification Based on Fabrication Method b. Film Film components are made of either conductive or nonconductive material that is deposited in desired patterns on a ceramic or glass substrate. Film can only be used as passive circuit components, such as resistors and capacitors. Transistors and/or diodes are added to the substrate to complete the circuit.

Film IC Plastic thin film Image on thin film

Classification Based on Fabrication Method c. Hybrid IC Hybrid integrated circuit technology is the combination of monolithic circuits and film technology. The active components are monolithic transistors or diodes. The passive components may be group of monolithic resistors or capacitors on a single chip, or they may be thin-film components. Wiring or a metallized pattern provides connections between chips.

Hybrid IC Hybrids ICs are widely used for high power audio amplifier applications from 5 W to more than 50 W.

Hybrid IC Hybrid ICs usually have better performance than monolithic ICs. However, the process is too expensive for mass production. Thus, multi-chip techniques are quite economical for small quantity production and are more often used as prototypes for monolithic ICs.

Fabrication Method Comparison Characteristics Monolithic Technology Film Technology Hybrid Technology Type of components Active and passive Passive (Resistor & Capacitor) Substrate material Silicon (Si) Germanium(Ge) Gallium Arsenide (GaAs) Conduction layer on insulator (glass, ceramic) Silicon and insulator Interconnection method On substrate surface Metal (Al or gold) Interconnection of two or more chips Technology method BJT, MOS,GaAs Thin film = 0.5m Thick film = 25m Combination of monolithic and film Size Medium Small Large

Student Centred Activity - Group Discussion 2 Identify the advantages and disadvantage of Monolithic, Film and Hybrid fabrication methods.

Classification Based on Circuits Function Integrated Circuits Linear / Analogue ICs Integrated circuits that operate with analogue signals at the input and output. Digital ICs Integrated circuits that operate with digital signals at the input and output. Examples: Op-Amp ii. Power Amplifier iii. Multiplier iv. Comparator v. Voltage Regulator Examples: i. Logic gates ii. Flip-flop iii. Counter iv. Calculator chips v. Memory vi. Microprocessor

Classification Based on Transistor Types

Bipolar Junction Transistor (BJT) NPN Cross section and Symbol PNP Cross section and Symbol

Advantage & Disadvantage of BJT ICs Transistor Type Advantage Disadvantage BJT i. High switching speed High durability High power handling capability i. High power dissipation ii. Large chip size iii. Temperature sensitive

MOS IC MOS transistor is known as MOSFET (Metal Oxide Semiconductor Field-Effect Transistor). MOSFET is widely used nowadays in electronic equipment, e.g. mobile phone, computer, medical electronic equipment, etc. Examples of MOS technologies are: i. PMOS ii. NMOS iii. CMOS iv. VMOS

PMOS & NMOS PMOS Cross Section PMOS Symbol NMOS Cross Section NMOS Symbol

Schematic diagram of 2-input NAND gate using CMOS CMOS Cross Section Schematic diagram of 2-input NAND gate using CMOS 2-input NAND gate symbol

VMOS One of the disadvantages of CMOS technology is the disability of handling high power. VMOS is invented to overcome the problem. VMOS has the capability to operate in high current and voltage.

VMOS VMOS is the acronym of Vertical Metal Oxide Semiconductor. VMOS has the V shape gate to conduct more carriers vertically from SOURCE to DRAIN. P + G S D

BiCMOS BiCMOS is the acronym of Bipolar complementary metal oxide semiconductor , the technology that combines BJT and CMOS on the same chip to generate high speed, low power dissipation and high concentration circuit.

Advantages & Disadvantages of MOS technology MOS Transistor Types Advantage Disadvantage PMOS i. Low fabrication cost. ii. Simple fabrication method. Low circuit performance (slow). This is because the hole current mobility is two times slower than electron. NMOS i. Smaller size compared to PMOS. ii. High circuit performance. i. Fabrication process is more difficult compare to PMOS. CMOS i. Low power dissipation. Larger size compared to PMOS and NMOS. BiCMOS i. High circuit performance (high speed). ii. Low power dissipation. i. Larger chip size. ii. Complex fabrication process. iii. High fabrication cost. VMOS i. Capable of operating in high current and voltage. ii. High circuit performance (high speed). i. Complex fabrication process. ii. High fabrication cost.

Student Centred Activity - Group Discussion 3 Distinguish Mixed-signal ICs from Analogue and Digital ICs. What do you think it is? Highlight the advantages and disadvantages of Mixed-Signal ICs. Reference: http://www.en.wikipedia.org/wiki/Mixed-Signal_Integrated_Circuit http://www.wikinvest.com/concept/Mixed-Signal_Integrated_Circuit http://www.silabs.com/Pages/mixed-signal-IC.aspx

Student Centred Learning - Group Discussion Based on the given graphs, relate Moore’s Law to the following evolution of microelectronics memory devices. Based on the given graphs, relate Moore’s Law to the scaling down of transistor size and the trend in microprocessors. Distinguish Mixed-signal ICs from Analogue and Digital ICs. What do you think it is? Highlight the advantages and disadvantages of Mixed-Signal ICs. Reference: http://www.en.wikipedia.org/wiki/Mixed-Signal_Integrated_Circuit http://www.wikinvest.com/concept/Mixed-Signal_Integrated_Circuit http://www.silabs.com/Pages/mixed-signal-IC.aspx Advantages and disadvantage of Monolithic, Film and Hybrid fabrication methods.

Review of Learning Outcomes At the end of this session, students should be able to: Understand Integrated Circuit (IC) Technology Know the classification of IC Have You Achieved the Outcomes?

Lets see whether you have achieved the learning outcomes Assessment Task QUIZ 1 (CLO1)