1. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics Definition of Microelectronics. Microelectronic Devices, IC Packaging, Purposes of IC Packaging, Semiconductor Roadmap, IC Packaging Challenges,

2. M.Nuzaihan DMT 243 – Chapter 2 Definition of Microelectronics Microelectronics is a subfield of electronics. It is related to the study and manufacture of electronic components/devices which are very small (sub-micron dimensions) These electronic components/devices are made from semiconductors. Microelectronics is based on transistors (dominant device) fabricated at sub-micron dimensions as “integrated circuits” or IC and measured in micrometer (µm) scale. The Role of Packaging in Microelectronics

3. M.Nuzaihan DMT 243 – Chapter 2 IC technologies: Small, medium and large scale integration (SSI,MSI,LSI) - tens, hundreds, thousands of transistors on a single IC Very large or ultra scale integration (VLSI or ULSI) - up to a million transistor on an IC gigascale integration (GSI) and terascale -many billions and trillions of transistor integrated on a single semiconductor chip. System-on-chip -where not only transistors, but other crucial components are integrated on a chip. The Role of Packaging in Microelectronics

4. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics Evolution of Microelectronics

5. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics Evolution of Microelectronics

6. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics

7. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics All materials are classified into three categories: Conductor - Have 1 or 2 valence electrons - Easily conduct electrical current - Copper, silver, gold and aluminum Insulator - Have a maximum of 8 electrons in their valence -That does not conduct electrical current under normal conditions. -SiO 2 : Eg = 8.1eV Semiconductor -Have 4 valence electrons -Between conductors and insulators in its ability to conduct electrical current - Si :Eg = 1.1eV

8. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics Microelectronic Devices Semiconductor materials can be engineered and designed to build devices whose characteristics under controlled conditions can be used to construct microelectronics product. - PN Junction Diode - Bipolar Junction Transistor (BJTs) - Metal Oxide Semiconductor Field Effect Transistor (MOSFET) - CMOS Circuit

9. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics PN Junction Diode FB Carries large current + voltage is applied to the P and – voltage is applied to the N RB Device blocks the current flow + voltage is applied to the N and – voltage is applied to the P PN

10. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics BJTs NPN PNP Bipolar device Both the electron and the holes are involved in charge transfer. There are three regions of operations: Cut-off, linear and saturation Cut-off and saturation regions are used in digital system to represent binary “1” and “0” Linear region is used for amplifier applications Linear Region Saturation Cut-off (I B =0)

11. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics MOSFET Unipolar devices The current flow only involves one carrier type, either holes or electrons. The current in the MOSFET is controlled by an input voltage rather than a current. There are three regions of operations: Cut-off, triode and saturation Cutt-off = Vgs is less than Vt = no current flow in device. Triode =amplification region = initial Vds increase so Id increase. Saturation = reached Vds increase, Id constant

12. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics CMOS Combines NMOS and PMOS devices. Inverter (basic element) -This represents perfect switching behavior CMOS technology is used in microprocessors, microcontrollers, and other digital logic circuits inputoutput 01 10

13. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics INTEGRATED CIRCUITS (ICs) An integration of many such circuit blocks (discrete components such as transistors, diodes, capacitors, resistors were mounted on the PWB) or components on a single chip Resulting in miniaturized product became low in cost and high in reliability. Can be as small as 1mm to 30 mm There is no limit to integrating multiple function on a single chip ( rise to concept SOC) SOC – electrical, optical, mechanical, chemical and biological devices will be integrated together on single chip.

14. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics CONTD…(NEXT WEEK) IC Packaging, Purposes of IC Packaging, Semiconductor Roadmap, IC Packaging Challenges,

15. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics

16. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics

17. M.Nuzaihan DMT 243 – Chapter 2 The Role of Packaging in Microelectronics LABORATORY MANUAL FORMAT LAB1 LAB2 LAB3