PWB Back Drilling Phase 2 March 10, 2016 Project Proposal - Idea Stage Project Leader: PC Wong Project Facilitator: John Davignon © 2016 HDP User Group.

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Presentation transcript:

PWB Back Drilling Phase 2 March 10, 2016 Project Proposal - Idea Stage Project Leader: PC Wong Project Facilitator: John Davignon © 2016 HDP User Group International, Inc. All rights reserved1

Project Background Back drilling or controlled depth drilling of plated through holes (PTH) is increasingly being used in High Speed Designs. While back drilling of PWBs helps to remove signal distortion by removing via related stubs, reliability issues attributed to this practice appear to be on the rise. We learned in Phase 1 of the project that the shallow back-drill fails earlier relative to the medium and deep back-drill. Phase 2 will focus on the shallow back-drill but on a much thicker 30 layer (compared to the phase layer). © 2016 HDP User Group International, Inc. All rights reserved2

Problem Statement Problem Statement: Both the number of back drilled vias and the variation of depths (any & all layers) are increasing on each board. Reliability issues with back drilling is often related to an unique family of products (Design/Material/Process). Many family of products have thicker backplanes that are needed to interconnect signals between thinner PCBAs’. Phase 2 explores the relative reliability of the thicker backplane-like PCBs’. © 2016 HDP User Group International, Inc. All rights reserved 3

Project Scope This project aims to explore the reason for back drilling related PWB failures and to identify potential solutions and design/process guidelines to prevent future problems associated with this process. Some Potential areas of investigation are: Quantifying Back Drill reliability on thicker PCBAs. © 2016 HDP User Group International, Inc. All rights reserved4

Project Proposal: From the learning of Phase 1: Evaluate only the shallow backdrills Same basic coupon designs – but with the layer modifications below and eliminate the medium and deep backdrills Thicker boards –4mm thick nominal –make the resin content more reflective to a 30 layer board. Add a backdrill coupon with a “sacrificial” pad à specifically add a pad on the layer right above the MNC layer. © 2016 HDP User Group International, Inc. All rights reserved 5

Project Proposal: cont Only have 4 coupon designs (0.8mm, 1mm and 2mm pitch – with the sacrificial pad version only at 1mm). 6X reflow preconditioning –on the IST machines followed by C testing to fail (minimum 6 sample, but target 12 – in other words test 6, evaluate, and maybe test 6 more if it makes sense) and test to fail. 6 more coupons of each type tested from 25 to 260C (on the IST machine) until fail. © 2016 HDP User Group International, Inc. All rights reserved 6

Project Proposal: cont Construction proposed: © 2016 HDP User Group International, Inc. All rights reserved 7

TV design © 2016 HDP User Group International, Inc. All rights reserved 8

Team Members Team Members: PWB Interconnect Solutions Nokia, US Isu Petasys Ciena Curtiss-Wright © 2016 HDP User Group International, Inc. All rights reserved 9

Resources Needed Resources needed List the major benchmarks on at least a quarterly basis over the life of the project. Resources needed to complete the project, together with source of the resource. If something is needed that no participant can contribute,list a suggested outside source and estimated cost. © 2016 HDP User Group International, Inc. All rights reserved 10

Goals © 2016 HDP User Group International, Inc. All rights reserved 11 Summary of what you are trying to accomplish. How will you solve or address the problem stated in the driver-purpose section.

Schedule/Plans Flow chart -Graphical representation of a process, such as a manufacturing operation or a computer operation, indicating the various steps taken as the product moves along the production line or the problem moves through the computer. - Should have decision points (Go/no go) Gantt chart schedule (Timescales) - a type of bar chart that illustrates a project schedule. Has a Start / End/ Duration (Including Original and Actual timelines) Project Task List Schedule - most common type in HDP, used in HDP Presentation Template - End time. © 2016 HDP User Group International, Inc. All rights reserved 12

Benefits/Impact List the Impact/Benefits to the shareholder/members that the deliverables will have and why the membership cares about the deliverables. This is a major point in any HDP funding request. Who / What - Denote exactly which shareholder, group of HDP members or industry sector will benefit by these project deliverables; PCB fabricators, CMS/EMS, OEM etc. What exact benefit will they receive, examples; a more reliable product, quicker TTM, less development cost, etc. © 2016 HDP User Group International, Inc. All rights reserved13 Benefits/Impact

Purpose/Drivers © 2016 HDP User Group International, Inc. All rights reserved 14 Why are you doing the project? What is the issue or problem you are trying to fix? What companies or industry sectors would be impacted by this project?

Objective © 2016 HDP User Group International, Inc. All rights reserved 15 Objectives state how each of the specific goals will be achieved. These are measurable performance activities. They are specific and measurable.

Deliverables © 2016 HDP User Group International, Inc. All rights reserved 16 List Tangible deliverables (good or services that will be provided at end of project) with due date List who will receive these deliverables. Dissemination Plan for information. Papers, Conferences, Magazine articles etc.

Template Resources Key issue: List resources RecourseContributor WhatName HDP User Group funding © 2016 HDP User Group International, Inc. All rights reserved 17