Presentation on theme: "IBL Insertable B-Layer"— Presentation transcript:
1 IBL Insertable B-Layer ATLAS Italia / RefereeRoma, July 14th 2010G. Darbo – C. MeroniINFN / GE – MIOn behalf of INFN IBLAgenda:
2 Outline Status of the IBL project With focus on INFN related activitiesStatus of the Technical Design Report (TDR)ScheduleConsolidation of the Physics & Performance case for IBLInterim-Memorandum of UnderstandingCost, resources, sharingRichieste finanziarie e attività 2011
3 IBL Detector Material from Raphael/Neal IBL Specs / Params The present 7 m long section of the beam-pipe will be cut (flange too big to pass inside the existing pixel) and extracted in situ.The new beam-pipe with the IBL inserted at its place.PP1 CollarSealing service ringAlignment wirersIBL Specs / Params14 staves, <R> = mm.CO2 cooling, T < 0.2 W/cm2X/X0 < 1.5 % (B-layer is 2.7 %)50 µm x 250 µm pixels1.8º overlap in ϕ, <2% gaps in Z32/16 single/double FE-I4 modules per staveRadiation dose 5x1015 neq/cm2ISTIBL Support TubeIBL Staves
4 LHC Plans & IBL Milestones LHC plans (ATLAS “interpretation”)Have a phase I and IIPhase I when 30÷50 fb-1Accumulate 300÷400 fb-1 on phase IAgreed with CERN management to have phase I shutdown in 2016 (unofficial yet).IBL design specification (Lint, L)Life integrated of 500 fb-1R/O: peak LVL1=100kHZIBL MilestonesFEI4 submission : 6/2010.sensor choice 6/2011.FEI4 Version 2 eng. Run 9/2011.first prod module 11/2012last prod module 9/2013.Stave loading completed (incl. 3 months cont) 6/2014End of integration (incl. 3 months cont) 5/2015IBL installation 5/2015 – early 2015 Installation possible, but no contingency.LHCRef. M. Nessi
5 FE-I4 (GE) FE-I4 FINAL LAYOUT 87M TRANSISTORS! FE-I4 submitted on July 1st at 14:00 (GMT)More than 2 years of engineering work for a team of >15 Engineers/physicistLargest HEP chip ever! 20.2x19.0 mm2, 87 million transistors!IBM accepted all the waivers, tomorrow the WRB at IBM will discuss the waivers and tell us the risk.Fabrication time is weeks. An expected delivery date will be provided 1-2 weeks after submission. 60 Known Good Dies / wafer.Money contributions collected following interim-MoU share.Engineering run cost > 500kCH16 8-inch wafer expected60 KGD / Wafer16 Wafers20.2 mmFE-I4 FINAL LAYOUT87M TRANSISTORS!Engineering Team:At Bonn Tomasz Hemperek, Michael Karagounis, and Andre Kruth; at CPPM Denis Fougeron, Fabrice Gensolen, and Mohsine Menouni; at Genova Roberto Beccherle; at LBNL Julien Fleury (visiting from LAL), Dario Gnani, and Abderrezak Mekkaoui; and at NIKHEF Vladimir Gromov, Ruud Kluit, Jan David Schipper, and Vladimir Zivkovic.Students:David Arutinov (Bonn), Bob Zheng and Frank Jensen (LBNL)Physicists:Marlon Barbero, Maurice Garcia-Sciveres19.0 mm
6 Module Prototype Program & Test Beam (GE, PI, TN, UD) Sensors and IBL activities mergingTest beam coordination & analysis between IBL and Sensor R&DEUDET telescope used by Planar, 3D and Diamond sensors: 3 µm resolution!Common order and plans for FE-I4 prototype modules, bump-bonding at IZM.INFN contribution to the cost: 9k€GE, TN and UD focusing on 3D, PI part of the planar prototypingOnce sensor technology will be decided, INFN will contribute to production∞Test beam Coordination within IBL WG1Residual from EUDET extrapolation to 50µm pitch pixels (single hit clusters).FBK-Irradiated 3E sensors (*)Planar Sensors PIFlat top:High telescope resolutionATLAS Collaborations for sLHC R&DIBL3D SensorsGE, TN, UD50µmDiamond SensorsPreliminary
7 3D Sensor – Recent results(*) Lorentz B = 1.6 T)3D sensors from FBK irradiated to 1015 – 5 x 1015 neq/cm2Karlsruhe: 26 MeV protonsLjubljana: reactor neutronsLab & Test Beam measurements (*)Very good efficiency at neq/cm2 (preliminary)Not full 3D devices…Full 3D in development at FBKPlanar: ΘL = -7.4º ± 0.43D: ΘL = 0ºAngle = 0º Eff. = 99.0%p-irradiated devices (dose = 1015 neq/cm2)Angle = 15º Eff. = 99.9%(*) Credits: June 2010 beam and lab tests name listM. Borri, M. Boscardin, L. Bosisio, V. Cindro, G.F. Dalla Betta, G. Darbo, C. Da Via, B. DeWilde, Su Dong, C. Gallrapp, C. Gemme, H. Gjersdal, P. Grenier, S. Grinstein, P. Hansson F. Hugging, A. La Rosa, A. Micelli, C. Nellist, S. Parker, H. Pernegger, O. Rohne, A. Rovani, K. Sjobaek, K. Tsiskaidze, J. Janssen, J.W. Tsung, N. Wermes.
8 FBK – 3D Sensors for IBL IBL Design (slim and active edge): 3D sensor with slim edge (200µm) and full through columns. DRIE (Deep Reaction Ionizing Etching) is stopped by a 0.7µm membrane. In process 200 and 230 µm thick wafer batches. Expected wafers Oct.2010Active edge, with support wafer. Wafer end of the year.Wafer floorplan has 8xFE-I4, 9xFE-I3, CMS, ...Planar Sensor3D SensorFBK 3D wafer for IBL700nm DRIE stopping membraneFBK DRIE:200÷230 µm x 12µm
9 Indium Bump Bonding (MI, GE) Indium BB at Selex (technology option, SiAg at IZM baseline)Selex qualified for small FE-I3 need to change the process to FE-I4First attempt with dummy was partially succesfulsNeed to upgrade the flip-chip head and change pressure/temperature of the processTest with scan chains -> with FE-I4 if successful.X-ray of FE-I4 size dummy bumped to dummy sensor4 Pixels shorted6 Pixels shorted8 Pixels shorted164 Pixels shortedDummy sensorDummy FE
10 ROD (BO + GE)Redesign the ROD (Read-out Driver) architecture starting from the Pixel design:Reason: components obsolescence, bottle neck of the Architecture, complexity in debugging due to mixed DSP / FPGA environment.Smart Idea:Move the embedded processing used for calibration (4 DSP/Board) to standard PC: use GB-ethernetResponsibilities:BO the ROD board, FPGA, PowerPC ProgrammingGE electrical-BOC to connect to FE-I4 modules without opto-link (debug the initial system)INFN responsibility
11 Flex Hybrid Design (GE) Stave flex (technology / test demonstrator)Final layout made at GE submitted to CERN PCB workshop: in production5 Cu layers and 1 Al layer (for LV)Total thickness = 0.45mm(Designed) Impedance = 80OhmSeveral additional designsSingle layer module flex, test boards,Simulation of the full chain undergoing at GESimulation of transmission: CLK/DT-IN (40 MHz, multipoint)Simulation of transmission: DT-OUT (160 Mbps, multipoint)EOSWingBus (10mm wide)
12 PP2 Redesign (MI) IBL needs new Power Distribution System: Increase of current per channel worst case (up to ~ 4A)Solution: use two LDO (low drop outputs) / channel with current limitController boardto improve the existing design (new FPGA)Collaboration between Milano and BarcellonaFPGA: same ACTEL family but need to qualify for radiation tolerancePP2 CrateRegulator BoardController Board
13 Stave Design (MI) STAVE CARACTERISTICS SIMULATION RESULTS 2.4 / 3.0 Pipe ID/OD[mm]Omega Thickness[µm]Foam Density[g/cm3]CoolantX/X0 [%]Thermal Figure of Merit (Γ)[ºC•cm2/W]Bare Stave with CoolantFull layer (+ Module + Flex)CF pipe, heavy foam2.4 / 3.01500.55C3F80.481.05617.25CF pipe, light foam0.25CO20.360.95618.56Ti 3mm pipe, light foam2.8 / 3.03000.661.2762.79Ti 2mm pipe, light foam2.0 / 2.20.571.1663.22BaselineDesign baseline defined:Ti cooling pipe with CO2 cooling.Prototyping and testMany prototypes madeStatus: finalizing base line designMajor technical contributions from MI and ~1/3 of the project under financial responsibility of INFN
15 TDR: Status & Schedule Motivation for delay in TDR printout: LHC machine plans after Chamonix, luminosity profile, machine shut-downs impacted on IBL TDR.Need of better documentation of Physics performance for the TDR ATLAS EB "IBL physics and performance taskforce” (M. Elsing, A. Andreazza)The TF will reinforce the efforts to ensure the completion of the IBL performance studies for the IBL TDR by end of August.TDR draft (Schedule)First draft circulated to selected readers, comments received, being implemented.Second review by experts: mid July.TDR draft ready for distribution to IBL Collaboration: 2nd week of AugustFinal TDR ready: 4th week of AugustSubmission to LHCC: 1st week of SeptemberIBL (Staves)Ed MoiseIBL in the Physics Simulation & in the Engineering CAD RenderingExisting B-layerIourii GusakovIBL (Staves)
16 Physics & Performance TF consolidate and extend present studiessingle particle performance (pions and muons)tracks in jets (100 and 500 GeV di-jets, top, WH)primary vertexing with high lumi. Pileupb-tagging, especially redo high-pt jets studiesstudy different pileup scenarioszero, 1034, 2*1034 and 3*1034 luminosityestimate efficiency and fake rate vs lumidemonstrate how IBL helps for robust tracking in jets, with fakes, …add emulation of Pixel/SCT readout problemsstudy robustness of tracking and how IBL recovers performanceStatusIBL geometry existing, motecarlo production ongoingChecking results on single tracks, tuning jets and vertexingTDR editing… keep deadline!!!
17 IBL Performance (TF Results) Simulation shows:Clear improvement in impact parameter resolution (plot 1)Specially in the region pT<10 GeV, that in ATLAS is dominated by multiple scattering50% improvement of rejection power in b-tagging (plot 2)Performance are stable even if existing b-layer is off (plot 3).Plot 1(top events)Plot 1Light jets rej.Plot 3IP resol.
19 Memorandum of Understanding IBL Memorandum of Understanding (MoU)Between The ATLAS COLLABORATION, and Funding Agencies/Institutions of the ATLAS Collaboration constructing the IBL (for the ATLAS construction was between Institutes and CERN).The MoU comprises all of the actions needed to construct and commission the IBL. The operation and maintenance of IBL is not a part of the present MoU and will be included, following its completion, within the M&O MoU framework. (IBL once delivered will be part of the Pixel Detector)Annexes define: work sharing and responsibility, cost contribution, project organization and management structure.IBL interim MoU – Why an interim MoU?Ad Interim MoU until sensor technology is chosen (Planar Silicon / 3D Silicon / Diamond) - Decision on sensor technology (Spring 2011) – Sensor R&D and IBL communities work in tight collaboration to finalise a design matching IBL specification.Consolidate interest of Institutes and availability of funds
20 Development of Interim-MoU IBL (interim)-MoU Status:“IBL Kick-off” meeting (8/7/2009)Institutes express their interest in the IBL based on project WBS (Workpackage Breakdown Structure).Institute Board created with the Institutes interested in the projectExtended Pixel IB (Meetings: 1/03/2010 and 18/06/2010)Defined sharing of work, cost amongst Institutes/Funding Agencies (i-MoU annexes)All project is covered by resources – need x-check with Funding Agencies (FA)StatusCollecting feedback from FA on funding and general project supportGoing to sign the interim-MoU?INFN (BO, GE, MI, UD)Quite active in the project, very good synergy and collaboration keeps up INFN visibility.
21 Institutes and Contributions to IBL Technology options refer to supplementary costs that are sensor technology specific and will be known before the definite MoU takes effect.42 Institutes in the interim-MoU (few others are “observers” ).14 Countries + CERN9.7 MCH total project costNote: the numbers in the table "are not final, nor are the suggested financial contributions yet firm, but are meant for a common overall discussion.”
22 INFN Contribution to IBL Total IBL cost:9741 kCHTotal INFN contribution:1400 kCH (14.4 %)1047 kCH CORE354 kCH M&O-A in-kind~100 kCH presently on M&O-A could be deducted from INFN if cables (assigned as work responsibility) becomes in-kind contribution.
23 INFN Contribution to MoU Items Resources and deliverables are summarized in the two tables
24 RICHIESTE FINANZIARIe 2011 – Programma attività INFN, richieste finanziarie, responsabilità, milestonesRICHIESTE FINANZIARIe
25 BOLOGNA Attività 2011: Sviluppo PCB prototipo ROD. Sviluppo firmware FPGA e software PowerPC del RODporting software da DSP (old Pixel ROD) a PowerPCTest bench per sviluppo software TDAQ del ROD (Crate e Single Board Computer – SBC)
26 GENOVAAttività 2011Sviluppo prototipo funzionale Flex Hybrid per lo stave e per il moduloDisegno versione 2 del FE-I4 (sottomissione Autunno 2011)Catena alta tensione: Test della catena completa di alta tensione con PS, cavi a PP1, Flex hybrid, sensoreSi sta discutendo di installare I cavi nell Shut Down 2012/13 – sono su M&O-A, potrebbero essere presi in-kind (stima ~40÷50 kCH).Sviluppo prototipo & test dei moduli: in vista della produzione (2012) del 50% del totaleSviluppo scheda BOC (back of crate card) elettrico per leggere moduli con ROD senza opto-link (per QC RoD, test-beam, system test, produzione moduli…). In collaborazione con BO e gruppi tedeschi (BOC)
27 MILANO Attività Milano 2011: Prototipaggio e preproduzione stave Modifiche schede regolatori PP2 (differenti specifiche FE-I4: VDD , IDD ), scheda controller PP2 (nuova FPGA da qualificare con irraggiamento), backplaneSviluppo bump-bonding con Selex (alternativa technologica alla IZM)
28 TRENTO (Dot.1 PD) Attività 2011: Simulazione sensori in 2 D e 3D layout sensori 3D (slim e active edge), layout maschere bump-bondingTest strutture su wafer sensori 3D: prima e dopo irraggiamenti
29 UDINEAttività 2011:Sviluppo sensori 3D insieme a UD e TN (fase di prototipaggio),Bump-bonding di FE-I4 con sensori 3DTest-beam, irraggiamenti sensori 3DPre-produzione sensori (tecnologia da decidere a metà 2011)
30 Sommario Richieste e Responsabilità IBL Responsabilità nel progetto IBL:Giovanni Darbo: IBL Project Leader L1 https://twiki.cern.ch/twiki/bin/view/Atlas/InnerDetectorOrganisationDanilo Giugni Stave WG Coordinator L2 https://espace.cern.ch/atlas-ibl/Shared%20Documents/IBL_Organization.v1.2.pdf
31 Milestones INFN Milestones – ATLAS IBL: IBL -Test beam di rivelatori con chip FE-I4 30/4IBL - Scelta baseline per i sensori 31/7BL - produzione e test prototipo ROD/BOC 31/10
32 Conclusions IBL planned to be completed by 2015 CERN/Experiments agree on a shutdown in 2016TDR is progressing and documenting the technical design of the IBLDeadline for submission to LHCC early SeptemberiMoU ready to signSome Countries/Institutes already did.INFN balanced between money contribution and visibility of activities, butCompetition is high … and many want a seat on boat!
34 IBL Project Status in Pills All the aspect of the IBL project are pretty well covered:Some in advanced design or prototype phase, as mentioned sensor and FE-I4Just to mention a fewStave: baseline CO2 cooling & Ti-pipe, TM measurements & FEA simulation well on its way.Stave/module flex-hybrid: multi-layer and stacked single layer prototyping.Internal services: design, simulation, prototypingOff-detector R/O: architecture defined, detailing board design and firmwarePower chain: upgrade study of the PP2 regulator. Simulation & design, waiting FE-I4 for selecting power scheme. Sensor decision impacts HV selection.Integration in SR1, installation mockup in bld. 180: designs, prototypes, getting partsStave loading: ideas, testing, looking at jigsLayout: global supports, beam-pipe flanges, IST2012 shutdown: preparatory activities in the pit for IBLInstallation: guiding pipe, insertion/extraction table, ALARACooling: cooling plant parameters, TM studies and prototypes for beam-pipe bakeoutFor most updated overview checkout June IBL Workshop at hold Geneva Univ.:
35 IBL Layout Layout parameters: Baseline layout decided 14 Staves, “reverse turbine” (there were two main options in Barcelona)Beam-pipe reduction:Inner R: 29 25 mmVery tight clearance:“Hermetic” to straight tracks in Φ (1.8º overlap)No overlap in Z: minimize gap between sensor active area.Layout parameters:IBL envelope: 9 mm in R14 staves.<R> = 33 mm.Z = 60 cm (active length).η = 2.5 coverage.
36 Extraction/Insertion Progresses on many areas:Installation mock-up (Geneva & CERN ) in bld 180Extraction/Insertion “table” (LPSC Grenoble)Long Guiding Tube (Brandeis)Integration and Envelopes definition (CERN Atlas TC)Beam-pipe split flanges (CERN Vacuum group)ALARA (CERN Atlas TC)InstallationMock-up in bld.180
37 IBL TDR Editors: M.Capeans (CERN), K. Einsweiler (LBNL) Chapter Editors: G.Darbo, T.Flick, M.Garcia-Sciveres, C.Gemme, H.Pernegger, O.Rohne, R.Vuillermetand quite many Contributors to different chapters: A.Andreazza, O.Beltramello, A.Catinaccio, I.Dawson, D.Ferrere, KK.Gan, D.Giugni, Y.Gousakov, N.Hartman, I.Hinchliffe, F. Huegging, S.Kersten, N.Massol, P.Morettini, D.Muenstermann, L.Nicolas, M.Raymond, S.Rozanov, D.Su, W.Trischuk, C.da Via, E.Vigeolas and S.WenigChapters’ Structure:Overview – IBL history, lifetime and failure issues, requirements, physicsModules – sensors (3 technologies), FE electronics, integration (bump-bonding, “mini- Flex”)Staves - mechanical concept for the stave, module loading, cooling and thermal issues, electrical integration, internal servicesIntegration - mounting staves with beampipe, services integration, final surface testingControl, Readout, and Integration - power supplies, opto-links, off-detector readout electronics, external services, cooling plant, DCS, integration with the present detector DAQ/DCSInstallation – beampipe extraction, mock-up, IBL transport and installation, connection and testingCommissioning – calibration, early data-taking plan with random triggers, charge injection, cosmic ray data-takingPrototyping, Production Testing, System TestingCritical Integration Issues – cooling, bakeout, powering, detector weight, material budgetProject Management and OrganizationDraft has 200 pages (too long?).Circulated to selected readers (many comments received):Attilio Andreazza, Andrea Catinaccio, Allan, Nigel Hessey, Tim Jones , Leonardo Rossi, Steinar Stapnes, Georg Viehhauser, Norbert Wermes