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HV-CMOS Hybridization

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Presentation on theme: "HV-CMOS Hybridization"— Presentation transcript:

1 HV-CMOS Hybridization
G. Darbo – INFN / Genova Future Pixel Chip Design – Vidyo 18 Mar 2014 On Behalf of Genova ATLAS Pixel & Genova Low Temperature Detector (LTD) Lab Indico agenda:

2 How to Glue HV2FEI4 to FE-I4
Requirements: Thin uniform dielectric layer (5 µm?) Precise alignment of the two chips (bumps are 18µm diameter and minimum 50µm pitch on FE-I4 side) Issues on “glue & press” Difficult to keep parallelism Difficult to keep calibrated spacing (~impossible once HV-CMOS reaches full size) How to align chips in XY (if capacitors are not cantered cross-talk) Deposit Glue FE-I4 CHIP Apply pressure HV2FEI4 FE-I4 CHIP

3 CCPD HV-CMOS - Hybridization
How to improve – process steps: Use spacers: patterned photoresist pillars on FE-I4 Spin SU-8 photoresist (rad-hard) on FE-I4 to desired thickness Use mask for making pillars and clean rest of the surface Apply glue (or SU-8 again) to have a thin layer Apply pressure until pillars are in contact with HV2FEI4 Test done – see talk at 9th Trento WS by M. Biasotti: Spin SU-8 photoresist Pattern pillars by mask R/O CHIP Glue deposition R/O CHIP Align & pressure R/O CHIP DETECTOR CHIP Ref.: M. Biasotti et al., 9th “Trento” Workshop – Genova 26-28/2/2014 Low Tempreature Detector facility – LTD Genova 2x2 pillar height test: distance 4 mm height in µm The tiny HV2FEI4p1 prototype glued on the large FE-I4 FE-I4 Pillar 1 5.92 Pillar 2 6.07 Pillar 3 Pillar 4 HV2FEI4 2.2 × 4.4 mm2 60 columns × 24rows

4 How Genova May Contribute to CCPD Hybridization
Genova has expertise and instruments >20 years development of pixel detectors (ATLAS) and low temperature detectors (LTD) Process on dies (not full wafer) We may consider to do more than gluing – look at the combined facilities at the same department floor! Collaboration between ATLAS Pixel Lab (APL) Low Temperature Detector (LTD) Genova Lab (see next slides) ATLAS Pixel Lab (Genova) – APL KLA-TENCOR P7 stylus profiler Scan length: 150mm - 6” wafer Repeatability/reproducibility: 4/15 Å Vertical resolution: 0.01/0.60 Å Manual flip-chip machine

5 Micro-fabrication and Thin Film Facility - Genoa LTD Lab
Laser shot for Ir, W, Re deposition PLD film deposition Thin Film Growth Systems 2 E-guns 4 material 10-9 mbar 2 AC & 1 DC Magnetron Sputtering Systems Pulsed Laser Deposition mbar Micro-fabrication Reactive Ion Etching, Plasma & Wet etching 2 Mask Aligners, Oxygen Plasma & Ion Beam Critical Point Dryer Class1000-CR for lithography TES on SiN membrane

6 Micro-fabrication and Thin Film Facility - Genoa LTD Lab
Bolometer for 145 GHz-Back etched and spiderweb shaped SiN membrane on Si wfr 250 µm 10 µm Cryogenic Silicon Ballistic Phonon detector for GeV cosmic protons for L2 orbit payload 5 µm

7 Next Steps Then… Try pillars technique on full size 2x2 cm2
Glue face-to-face FE-I4 to FE-I4 Deposit SU-8 on FE-I4, mask off and leave columns, measure height Glue and align second FE-I4 using manual flip-chip machine Make sections and measure thickness Then… … proceed with functional components

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