Presentation is loading. Please wait.

Presentation is loading. Please wait.

HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 o HV-CMOS Hybridization G. Darbo – INFN / Genova Future Pixel Chip Design – Vidyo.

Similar presentations


Presentation on theme: "HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 o HV-CMOS Hybridization G. Darbo – INFN / Genova Future Pixel Chip Design – Vidyo."— Presentation transcript:

1 HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 o HV-CMOS Hybridization G. Darbo – INFN / Genova Future Pixel Chip Design – Vidyo 18 Mar 2014 On Behalf of Genova ATLAS Pixel & Genova Low Temperature Detector (LTD) Lab Indico agenda: https://indico.cern.ch/event/289724/

2 HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 2 How to Glue HV2FEI4 to FE-I4 Requirements: Thin uniform dielectric layer (5 µm?) Precise alignment of the two chips (bumps are 18µm diameter and minimum 50µm pitch on FE-I4 side) Issues on “glue & press” Difficult to keep parallelism Difficult to keep calibrated spacing (~impossible once HV-CMOS reaches full size) How to align chips in XY (if capacitors are not cantered cross-talk) FE-I4 CHIP HV2FEI4 Apply pressure Deposit Glue

3 HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 3 CCPD HV-CMOS - Hybridization How to improve – process steps: Use spacers: patterned photoresist pillars on FE-I4 Spin SU-8 photoresist (rad-hard) on FE-I4 to desired thickness Use mask for making pillars and clean rest of the surface Apply glue (or SU-8 again) to have a thin layer Apply pressure until pillars are in contact with HV2FEI4 Test done – see talk at 9 th Trento WS by M. Biasotti: http://indico.cern.ch/event/273880/session/5/contribut ion/68/material/slides/0.pdf http://indico.cern.ch/event/273880/session/5/contribut ion/68/material/slides/0.pdf The tiny HV2FEI4p1 prototype glued on the large FE-I4 HV2FEI4 2.2 × 4.4 mm 2 60 columns × 24rows FE-I4 R/O CHIP Spin SU-8 photoresist Pattern pillars by mask Glue deposition R/O CHIP DETECTOR CHIP Align & pressure Pillar 15.92 Pillar 26.07 Pillar 35.92 Pillar 45.92 2x2 pillar height test: -distance 4 mm -height in µm Low Tempreature Detector facility – LTD Genova Ref.: M. Biasotti et al., 9 th “Trento” Workshop – Genova 26-28/2/2014

4 HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 4 How Genova May Contribute to CCPD Hybridization Genova has expertise and instruments >20 years development of pixel detectors (ATLAS) and low temperature detectors (LTD) Process on dies (not full wafer) We may consider to do more than gluing – look at the combined facilities at the same department floor! Collaboration between ATLAS Pixel Lab (APL) Low Temperature Detector (LTD) Genova Lab (see next slides) ATLAS Pixel Lab (Genova) – APL KLA-TENCOR P7 stylus profiler Scan length: 150mm - 6” wafer Repeatability/reproducibility: 4/15 Å Vertical resolution: 0.01/0.60 Å Manual flip-chip machine

5 HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 5 Micro-fabrication and Thin Film Facility - Genoa LTD Lab Class1000-CR for lithography PLD film deposition Laser shot for Ir, W, Re deposition TES on SiN membrane Thin Film Growth Systems 2 E-guns 4 material each @ 10 -9 mbar 2 AC & 1 DC Magnetron Sputtering Systems Pulsed Laser Deposition System @ 10 -10 mbar Micro-fabrication Reactive Ion Etching, Plasma & Wet etching 2 Mask Aligners, Oxygen Plasma & Ion Beam Critical Point Dryer

6 HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 6 Bolometer for 145 GHz-Back etched and spiderweb shaped SiN membrane on Si wfr 250 µm 10 µm Cryogenic Silicon Ballistic Phonon detector for GeV cosmic protons for L2 orbit payload 5 µm Micro-fabrication and Thin Film Facility - Genoa LTD Lab

7 HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 7 Next Steps Try pillars technique on full size 2x2 cm 2 Glue face-to-face FE-I4 to FE-I4 Deposit SU-8 on FE-I4, mask off and leave columns, measure height Glue and align second FE-I4 using manual flip-chip machine Make sections and measure thickness Then… … proceed with functional components


Download ppt "HV-CMOS – FE-I4 Hybridization G. Darbo – INFN / Genova 18 March 2014 o HV-CMOS Hybridization G. Darbo – INFN / Genova Future Pixel Chip Design – Vidyo."

Similar presentations


Ads by Google