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3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 2009 o IBL per Marzio G. Darbo - INFN / Genova Agenda page:

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Presentation on theme: "3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 2009 o IBL per Marzio G. Darbo - INFN / Genova Agenda page:"— Presentation transcript:

1 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 2009 o IBL per Marzio G. Darbo - INFN / Genova Agenda page:

2 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June IBL Organization The IBL (Insertable B-Layer) is an ATLAS Upgrade project: It will deliver a fourth pixel layer, including a new beam-pipe, to the Inner Detector When delivered, it will become a part of the Pixel Detector and of the Inner Detector and the organization will be absorbed into the Pixel & ID Module WG IBL MB (Management Board) IBL MB (Management Board) Stave WG Stave WG I&I WG I&I WG Off-det WG Off-det WG IBL IB (Institute Board) IBL IB (Institute Board) Pixel Institutes in IBL Pixel Institutes in IBL New Institutes in IBL New Institutes in IBL ATLAS UPO ATLAS UPO ATLAS UPGRADE IBL IBL PL IBL TC

3 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Management Board (MB) Module WG (2 coordinators) FE-I4 Sensors Bump-Bonding Modules Test & QC Irradiation Module WG (2 coordinators) FE-I4 Sensors Bump-Bonding Modules Test & QC Irradiation Stave WG (1 Phys + 1 Eng.) Staves Cooling Design & Stave Thermal Management HDI Internal Services Loaded Stave Test & QC Stave WG (1 Phys + 1 Eng.) Staves Cooling Design & Stave Thermal Management HDI Internal Services Loaded Stave Test & QC IBL Integr.-Install. (2 Eng.) Stave Integration Global Sup. Beam Pipe (BP) Ext.services inst. IBL+BP Installation Cooling Plant Test & QC IBL Integr.-Install. (2 Eng.) Stave Integration Global Sup. Beam Pipe (BP) Ext.services inst. IBL+BP Installation Cooling Plant Test & QC Off-detector (1 Phys + 1 E.Eng.) Power DCS ROD Opto-link Ext.serv.design/proc. Test Beam System Test Off-detector (1 Phys + 1 E.Eng.) Power DCS ROD Opto-link Ext.serv.design/proc. Test Beam System Test IBL Management Board Membership: IBL PL + IBL TC 2 coordinators from each WG Plus extra members IBL Management Board Membership: IBL PL + IBL TC 2 coordinators from each WG Plus extra members Ad-interim membership IBL Project Leader: G. Darbo IBL Technical Coordinator: H. Pernegger Module WG (2 Physicists): F. Hügging & M. Garcia- Sciveres Stave WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni IBL Assembly & Installation WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet Off-detector WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux Extra members: Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling) Offline liaison Pixel Off-line coordinator: A. Andreazza TDR editor (temporary): K. Einsweiler

4 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Ref: N. Hartman: Single Stave Layouts Several layouts under study: 14 staves at R min =~3.2 cm TurbineInverted Rail Space Sensor

5 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Ref: N. Hartman: BiStave Layouts BiturbineCastellated Sensor

6 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Frontend Chip - FE-I4 FE-I4 Status Prototype blocks in MPW (MOSIS) submitted 3/2008, measurements, irradiation Design review (3/2009): Design Technical Issues on full scale design FE-I4 Collaboration meeting 1/7/2009 Foreseen complete design review after Summer and submission later this year. 7.6mm 8mmactive 2.8mm FE-I3 74% active 16.8mm 20.2mm ~2mm ~200 μ m FE-I4 ~89% Chartered reticule (24 x 32) IBM reticule ~19 mm New FE-I4 Pixel size = 250 x 50 µm 2 Pixels = 80 x 336 Technology = 0.13µm Power = 0.5 W/cm 2 FE-I3

7 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June FE-I4 Review & Collaboration FE-I4 – Design Technical Issue Review March 2 nd, Review agenda page:

8 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Modules & Stave Arrangement Two module options: Single chip modules abut one against the next Small sensor type: like 3D, active edge Multi chip modules: chip look the same if using multi-chip modules As present sensor size (~2xFE-I4) : like planar n-on-n assuming no Z-shingling, no space. W-bond pads

9 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Requirements - Fluence Requirements discussed in previous meetings New simulation of n fluences as input for the IBL design (see box) Other requirements are: IBL design Peak Luminosity = 3x10 34, Integrated Luminosity seen by IBL = 550 fb -1 Fit made for 2 < r < 20 cm for L=1000fb -1 Gives for 3.7 cm (550 fb -1 ): 1MeV =2.4x10 15 (1.2 MGy) Safety factors not included in the computation (pp event generator: 30%, damage factor for 1 MeV fluences: 50%) Ref. Ian Dawson - AUW

10 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Sensors - Time line IBL project started now: TDR March 2010 – sensor option not decided before FE-I4.v1 prototyping FE-I4.v1 submitted (earliest) 15/10/2009 – Wafer back 31/4/2010 FE-I4.v1 prototype modules and testing – second half 2010 Sensor decision on FE-I3 and FE-I4.v1 prototypes End of 2010 Sensor production and testing 8 months production assumed. Testing could last 4 months after end production. Production starts beginning 2011.

11 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June How Many 3D Sensor Wafers For IBL we need: 14 staves (+6 spares) 32 FE-I4 (3D sensors) Total need = 640 single FE-I4 tiles = 54 Wafer If we consider yields: Sensor (0.5) Bump Bonding Module ~ 150÷200 wafer for whole IBL 4 Wafer – Fits 12 FE-I4

12 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Beam-pipe - Layout Beam-pipe radius can be reduced by at least 4mm On-site survey has shown that cavern floor is stable (~1mm respect 9.8mm foreseen) See LEB (LHC Experimental Beam-pipes) WG – 5/3/2009: Smaller beam-pipe Layout options Better physics performance obtained with reverse turbine layout -sensor facing beam-pipe – cooling redundancy (two cooling pipes) for beam-pipe bake-out 1 mm

13 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Material Budget Physics performance low material budget Strategy for reducing X 0 : carbon foam, carbon fiber (CF) cooling pipe, CO 2 cooling,… Omega Carbon foam Epoxy Sensor R/O chips Flex Cooling pipe (Al) Cooling fluid (C3F8) General total Total structure Structure+cool. Fluid Omega Carbon foam Epoxy Sensor R/O chips Flex Cooling pipe (CF) Cooling fluid General total Total structure Structure + cool. Fluid X 0 - Ti cooling pipe option X 0 - CF cooling pipe option

14 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Inner Tracker R&D Status – November 2008 Approved by Executive Board EoI, Proposal presented to USG Pixel Strips Inner Detector

15 3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June Calorimeter, Muon & Other R&D Status – November 2008 Approved by Executive Board EoI, Proposal presented to USG Calorimeter Muon Trigger, Elec, …


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