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Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process.

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Presentation on theme: "Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process."— Presentation transcript:

1 Delphi Confidential Precision Bump Formation Mushroom type bump X-Sec laser ablate plated up bump Fabrication process

2 Delphi Confidential –Simultaneous Laser Operation »Define dot location »Define alignment hole location »Position tolerance +/-.002 w b h h = bump height in. b = bump base w + h w = bump opening 6,8,10 mils The bump is plated within and above the coverlay material. Precision Bump Formation Mushroom type bump Design considerations (dot to dot spacings)

3 Delphi Confidential Precision Bump Formation Mushroom type bump Examples of mushroom type bump parts For military and commercial applications

4 Delphi Confidential Photolithography Bump Formation Photoresist defined bump Laminate Photoresist Photo / Develope Plating Strip Photoresist Fabrication process The shape of the bump is controlled by the photoresist image, so various shapes can be defined. Typically used with larger or gross opening in the coverlay Bump heights are in. Bump Widths are in. smaller than the trace widths

5 Delphi Confidential Photolithography Bump Formation Photoresist defined bump Examples of mushroom type bump parts For military and commercial applications

6 Delphi Confidential Precision Bump Formation Etch-a-dot type bump Laminate coverlay Laser coverlay openings Plasma Clean openings Plate mushroom bump Etch smaller bump tip On mushroom bump Fabrication process The bump is plated within and above The coverlay surface.

7 Delphi Confidential Precision Bump Formation Etch-a-dot type bump Examples of mushroom type bump parts For military and commercial applications Typical bump dimensions

8 Delphi Confidential Typical Gold dot circuit layout Circuit Trace Capabilities:.0025/. 0025[0.0635/0.0635] Width/ Space Calculating Contact Pitch: For Column Pitch: Pcolumn=(No rows-1) x (Trace width) + Base Pad Dia + (No Rows) x Conductor Spacing Bump Height*Bump Base Diameter Bump Base Pad Diameter.0045[0.114].008[0.216].0145[0.368] Column of Contacts Rows of Contacts Circuit Trace Bump Base Bump Base Pad

9 Delphi Confidential Precision Bump Formation Typical Performance Characteristics Rated current per dot1 amp room temp Contact Resistance<10mOhms Contact Force0-150 gms per contact Vibration10 G max. peak, Hz Mechanical shock30 G, 294 m/s peak Accel. 11 ms duration Operating temp.-40 to +125 C, continuous Bump contact Au Plated over Nickel and Copper Mating surfaceImmersion/hard gold & solder


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