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CCTC MFG Capabilities & Technology Roadmap 2010. SIZE Maximum Processed finish board size 22 X 16inch Average Processed finish board size 8 X 6inch Board.

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Presentation on theme: "CCTC MFG Capabilities & Technology Roadmap 2010. SIZE Maximum Processed finish board size 22 X 16inch Average Processed finish board size 8 X 6inch Board."— Presentation transcript:

1 CCTC MFG Capabilities & Technology Roadmap 2010

2 SIZE Maximum Processed finish board size 22 X 16inch Average Processed finish board size 8 X 6inch Board Size Tolerance ±0.004inch Maximum Panel Size 24 X 24inch Minimum Panel Size 14 X 10inch THICKNESS Maximum Processed Thickness.250inch Average Processed Thickness.062inch Board Thickness Tolerance +/-10% Warp / Bow and Twist - Inch per Inch 0.5% LAYER CONSTRUCTION Maximum Processed Layer Count 28 Average Processed Layer Count 8 Minimum Dielectric Thickness (not including Microvia layers).002inch Minimum Core Thickness 0.004inch Layer to Layer Registration.003inch Dielectric Tolerance Layer to Layer ±10% CCTC Manufacturing Capabilities

3 ASPECT RATIO Maximum Aspect Ratio - Plated Through Holes 10: 1 Maximum Aspect Ratio - Microvia Holes 1: 1 Minimum Drill Size - Mechanically Drilled holes prior to plating.008inch Minimum Mechanically Drilled Hole size Preferred.010inch Smallest Finished PTH.006inch Smallest Finished PTH - Tolerance ±.002inch Nominal Finished PTH.023inch Nominal Finished PTH - Tolerance ±.003inch HOLE SIZE TOLERANCE PTH Standard ±.003inch PTH Compliant Pin ±.002inch NPTH ±.002inch True Position Tolerance ±.002inch CCTC Manufacturing Capabilities

4 CONDUCTOR WIDTH Minimum Inner Layer Width.003inch Typical Inner Layer Width.005inch Minimum Outer Layer Width.003inch Typical Outer Layer Width.005inch Minimum Trace on 3 oz base copper +/-.002 Minimum Trace on 4 oz base copper Minimum Trace on 5 oz base copper +/-.003 CONDUCTOR SPACE Minimum Inner Layer Space - Trace to Trace.003inch Typical Inner Layer Space - Trace to trace.005inch Minimum Outer Layer Space - Trace to Trace.003inch Typical Outer Layer Space - Trace to trace.005inch Minimum SMD Land Pattern Pitch 0.016inch CONTROLLED IMPEDANCE Impedance Typical - Value Ohms 50, 75, 100 Impedance Typical - Tolerance ±10% Maximum Impedance Capability - Value Ohms 150 Minimum Impedance Capability - Value Ohms 28 Maximum Impedance Capability - Tolerance ±20%(value < 50 Ohms) Minimum Impedance Capability - Tolerance ±8%(single ended impedance value > 100 Ohms) Impedance Modeling Tool (Type/Name) (I.e.True FieldSolver) Polar CITS25 Impedance Measurement Technique (Equipment/Type) Polar CITS500S Differential Impedance Measurement Technique (Equipment/Type) Polar CITS500S

5 CCTC Heavy Copper Capability ItemNormal cap.Special Cap. Layer8 5oz min. line/space Inner layer16/16 mil14/14 mil Outer layer (finish)12/12 mil10/10 mil 3oz min. line/space Inner layer12/12 mil10/10 mil Outer layer (finish)8/8 mil7/7 mil Line tolerance Inner 3OZ±2 mil±1.5 mil Inner 5OZ±3 mil±2.5 mil Min. Drill bitmm20 mil16 mil

6 CCTC Heavy Copper Capability Item Normal Cap. Special Cap. Min. copper clearance 3OZ12mil 5OZ15mil Inner layer annular ring (to drill bit) Inner 3OZ9 mil8mil Inner 5OZ15 mil12mil Dielectric Thickness Inner 3OZ Copper density70% 0.15mm Inner 3OZ 35%copper density<70% 0.25mm Inner 5OZ0.2mm

7 CCTC Heavy Copper Capability Item Normal capabilit y Special capability Hole to Linemil9mil8mil Min. Legend widthmil X 5.5 Min. Legend spacemil 7.5 6X 7.5 Inner layer copper density Inner 3OZ35% Inner 5OZ80%

8 TECHNOLOGY Buried Vias - Conventional YES Blind Vias - Conventional YES Blind Micro vias YES - How many sequential layers of Micro vias (one side) 3 Buried Micro vias (through an individual internal laminate) YES Buried Resistors - Omega N/A Buried Resistors – Printed N/A Buried Capacitance N/A Conductive Via Fill (CB100) N/A Other Specify N/A Flex (Layer Count) N/A Rigid Flex N/A CCTC HDI Manufacturing Capabilities

9 LAMINATE MATERIALSSupplier FR4 Standard Di-Functional Tg = Shengyi S1000-2, Isola HR370 FR4 Standard Multifunctional Tg = 170 Iteq, GW, Grace FR4 Tetra functional Tg = 140 Shengyi, GW, Grace Resin Coated Copper Tg = 140 LG Chemical Getek-Nelco-13 N/A Getek-Nelco-13 Equivalent Isola FR408HR Polyimide Arlon, Isola BT Epoxy Isola, MGC Cyanate Ester N/A PTFE - Teflon Arlon Halogen Free Panasonic, Shengyi Rogers RO4350 Rogers Omega-Ply N/A Mixed Dielectrics (specify) Rogers 4350/FR4 Metal Backed Substrates N/A Metal Core N/A CCTC Manufacturing Capabilities

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11 Basic Property Comparison for Various Material According to our experiments on lead free material, the experience during the PCB manufacturing and also the feedback from our customers during their assembly, we compared the general property parameters of various lead free material. Please refer to below table: LaminateType LF HF Tg ( ) /DSC Td- 5% ( )/ TG A IPC-4101B Z-CTE/TMA T-260 (min)/ TMA T-288 (min)/ TMA Dk/ 1MHz Df/ 1M Hz Fill Anti CAF Res sys a1/a2 ppm / ) Isola PCLFR- 370-HR YN IPC- 4101B/126 45/2202.6% YYPN IsolaFR408YN IPC- 4101B/99 19/ % NYMF ShengyiS1000YN IPC- 4101B/99 48/2503.3% YYPN ShengyiS1000-2YN IPC- 4101B/126 45/2202.8% YYPN ITEQIT158TCYN IPC- 4101B/99 40/2503.3% YYPN ITEQIT180ATCYN IPC- 4101B/126 45/2402.8% YYPN

12 ELECTRICAL TEST Net List Extraction YES Net List Comparison YES Simultaneous Top and Bottom 100% Net List YES Maximum number of Nodes Other (Specify) PRODUCTION CYCLE TIME Average Production Cycle Time - Days Quick Turn Capability - Days days Average Production Lot Size (Panels) 100 Maximum Production Lot Size (Panels) 300 Minimum Production Lot Size (Panels) 80 IPC Class 2 and 3 YES BELLCORE COMPLIANCE SEC Testing in House YES SEC Testing Subcontractor N/A SIR Testing in House YES SIR Testing Subcontractor N/A Solderability Testing (Frequency) Per lot for shipment Steam Age Testing Capability in House N/A Steam Age Testing Subcontractor N/A Gold Porosity Measurement Technique YES,POROSITY TESTER Gold Roughness Measurement Technique N/A Gold Thickness Measurement Technique X-Ray

13 Item Current Mass Production R&D Mass Production R&D Mass Production R&D Resin System FR-4 Tg 180C°Yes---Yes---Yes--- Halogen Free FR-4 Tg 170C°Yes---Yes---Yes--- PTFE---Yes---Yes --- Rogers Tg 280C°Limited---Limited---Yes--- BT Tg 200 C°Limited---Limited---Yes--- Polyimide Tg 260C°Limited---Limited---Yes--- RCC and LDP Normal Epoxy Tg 140C° Td 310C° Yes---Yes---Yes--- Halogen Free Epoxy Tg 150C°Td 350C° Yes---Yes---Yes--- LDP 170C°Yes---Yes---Yes--- Current Supplier 1. Shengyi; 2. Grace; 3. Isola; 4. Rogers; 5. MEM; 6. Nanya; 7. Arlon; 8. MGC; 9. Hitachi. 10. Panasonic CCTC Tech Roadmap

14 Item Current Mass Production R&D Mass Production R&D Mass Production R&D Max. layer count HDI N+C+N via on buried hole/ stack via Yes---Yes---Yes--- Max. Panel size24 x 2028 x 2224 x 2030 x 2424 x 2030 x 24 Max. board thickness ( mm / mil ) 5.6 / / / /2507.0/.276 Min. board thickness ( mm / mil ) 0.4/ / /16--- Tolerance of thickness T 1.0 mm ± 8%± 7%± 8%± 7% mm T 2.0 mm ± 8%± 7%± 8%± 7% ± 6% T 2.0 mm± 10%± 8%± 10%± 8%± 10%± 8% CCTC Tech Roadmap

15 Item Current Mass Production R&D Mass Production R&D Mass Production R&D Min. core thickness ( mm / mil ) 0.1 / / / /30.05 /2 Min. Prepreg thickness ( um / mil ) 50 / / / 2--- Min. inner layer base copper thickness ( OZ )/Thick 0.33/ 0.47 mil / 0.47 mil / 0.47 mil --- Max. inner layer base copper thickness ( OZ )/Thick 4.0/Ltd 4.6 mil 5.0/ 7.0mil 3.0/ 3.6 mil 5.0/ 7.0mil 3.0/ 3.6 mil 5.0/ 7.0mil Min. outer layer base copper thickness ( OZ )/Thick 0.33/ 0.47 mil / 0.47 mil / 0.47mil --- Max. outer layer base copper thickness ( OZ )/Thick 3.0/ 3.6 mil 5.0/ 7.0mil 5.0/ 7.0 mil / 7.0 mil --- CCTC Tech Roadmap

16 Item Current Mass Production R&D Mass Production R&D Mass Production R&D Min. mechanical drill hole diameter ( mm / mil ) 0.20/8 limited /8 limited /8--- Min. NPTH Tolerance +/- 25 um +/- 1 mil --- +/- 25 um +/- 1 mil --- +/- 25 um +/- 1 mil --- Min. PTH Tolerance +/- 50 um +/- 2 mil --- +/- 50 um +/- 2 mil --- +/- 50 um +/- 2 mil --- Aspect ratio of PTH hole10:112:1 16:112:116:1 PTH Hole location accuracy ( um / mil ) 50/2---50/2---50/2--- CCTC Tech Roadmap

17 Item Current Mass Production R&D Mass Production R&D Mass Production R&D Min annular ring (mil) per side Min Clearance (mil) per side Min. Laser Drill dia.( um / mil )75 / / / 3--- Aspect ratio of Microvia0.75: : :1 --- Plate Filling ViaYes---Yes---Yes--- Min. Capture Pad annular ring ( um / mil ) 100 / 1275 / 1088 / 1075 / Min. Target Pad annular ring ( um / mil ) 100 / 1275 / 1088 / 1075 / Laser drill methodLarge Window, Conformal Mask and Copper Direct CCTC Tech Roadmap

18 Item Current Mass Production R&D Mass Production R&D Mass Production R&D Min. Inner layer line width/space ( um / mil ) 75 / 350 / 275 / 350 / Min. out layer line width/space ( um / mil ) 75 / 350 / 275 / 350 / Min. SMT Pitch ( mm / mil )0.3 / / / Min. BGA Pitch ( mm / mil )0.4 / / / Min. Trace width tolerance ( Trace < 0.1 mm / 4 mil ) ( um / mil ) +/- 20 +/ / / /- 20 +/ / / Min. Layer registration ( um / mil ) 50 / / / 2--- Min. Trace to hole ( mm / mil ) 0.16 / / / / / / 6 Min. Trace to board edge ( mm / mil ) 0.25 / / / / CCTC Tech Roadmap

19 Item Current Mass Production R&D Mass Production R&D Mass Production R&D Solder Mask registration tolerance ( um / mil ) +/- 50 +/- 2 +/ / /- 50 +/- 2 +/ / / / Min. Solder dam ( um / mil )50 / / / 2--- Solder Mask type Taiyo PSR 4000, Tamura DSR 2200, Huntsman P77ma Halogen Free S/M. Green, Blue, Black Solder Mask ProcessElectrostatic Spray Coating and Silk Screen Surface Process Lead Free HASL, ENIG, ENIG+OSP, OSP, Electrolyte Ni/Au, ENIG + Gold Finger, Immersion-Silver, Immersion-Tin, Impedance control accuracy (%)±10± 7 ± 5± 7± 5 Board warp & twist tolerance % Routing Tolerance ( mm / mil ) +/ / / / / / Punching Tolerance ( mm / mil ) +/ / / / / / CCTC Tech Roadmap

20 SOLDERMASK AND LEGEND Nominal Soldermask Thickness (Measured at Crest) mil Soldermask Type and Supplier PSR4000/Taiyo, DSR2200/Tamura,Huntsman Minimum Solder Mask Web 3mil Minimum Solder Mask Clearance to Pad 2mil Soldermask Material RoHs Compliant? Yes Legend Material RoHs Compliant ? Yes Legend Type and Supplier ZM-400WF/Chuanyu, 200W/Taiyo SURFACE FINISHES HASL YES Electrolytic Ni/Gold YES Electroless Ni/Immersion Gold YES FST Dexter (Immersion Tin) YES Immersion Tin Other Specify ATO Soft Gold YES OSP YES Immersion Silver YES Tin Lead Reflow N/A Palladium R&D Selective Tin Lead Reflow N/A CCTC Manufacturing Capabilities

21 BUM1+N+1 design parameter BUM1+N+1

22 BUM1+N+1 design parameter BUM1+1+N+1+1

23 3-Build Up - CU Filled Via2-Build Up - CU Filled Via

24 Thank you!


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