1. Semiconductor

2. - Kyoritsu can provide RCA to technical issue
Hermetic Sealant
Benefits
- Kyoritsu can provide RCA to technical issue
- Kyoritsu has 70% ww share in hermetic sealant
Future
- Low moisture permeability
- Reflowable 260℃
- Low outgas
- High Tg/modulus
Hermetic sealant
TDS
　Product Name
8723K9B
package lid
5920
WLP, pkg
Measurement method
Viscosity
mPa･s
30,000
31,000
CONE/PLATE TYPE Viscometer,
10rpm at 25C
Recommended
cure condition
6,000mJ/cm2 +
120C x 30 min
Metal Halide Lamp
Water vapor transmittance %
6.5
5.3
1.3mmt, 85C/85%RH
Outgas
0.93
0.85
270C, 10 min Tg C
171
150
TMA method Α1
1/C
8.9×10－5
5.1×10－4 Α2
2.4×10－4
1.8×10－4
Elastic Modulus
MPa
5,040
6,000
No.3 DUMBBELL SPEED:10mm/min

3. - UV Curable (+Heat Anneal) Sealant⇒High Reliability
WL-CSP by Liquid sealant process
Benefits
After lamination of Si / Glass wafer
- UV Curable (+Heat Anneal) Sealant⇒High Reliability
- Vacuum Screen Printing⇒Low cost Patterning process
- Vacuum Lamination⇒Void less Lamination
UV Curable Sealant
We can provide sealant material and information of total process solution.
Process
Hermetically Cavity
Step 1. Seal patterning
Validation result
After back grinding and dicing
> Screen printing on glass wafer
Step 2. Wafer bonding
> Vacuum bonding with Si wafer and Glass wafer
In house test result
Step 3. Curing
Test Condition
Test Result
HTHH (85C/85%×1000h)
No abnormal appearance
TC (-40C⇔85C×1000cyc,
-45C⇔100C×100cyc)
JEDEC MSL1.+260C reflow
Chip Bending after Dicing
Very Low
Chip Bending after Reflow
> UV cure 6,000mJ/cm2 (200mW/cm2 × 30sec)
> Heat annealing 120 C × 30min

4. - Realizing high resistance product
Clear Molding
Benefits
Case1：with Glass
Case2：without Glass
- High productivity
- Realizing high resistance product
Future
- Keeping good optical performance after reliability test
- Wide range viscosity
- Reflowable（265C）
TDS
Product Name
801SE-L
8776LS2
5500
5580
Prototype
(w/o glass)
Base Material
Acrylate
Epoxy
Viscosity
mPa・s
3000
900
170
2,400
7,100
Curing Condition
mJ / cm2
1,500~3,000
3, C x 30 min
3,000
3, C x 60 min or
150 C x 30 min
1,500 +
120 C x 30 min
Hardness
Shore
A75
D 86
D 70
D 88
D83
Volume Shrinkage %
4.4
1.8
4.2
5.8 Tg C 3
146.4
39.4
112.6 α1
1/C
6.7 x 10-5
6.9 x 10-5
2.7 x 10-4
6.8 x 10-5 α2
1.7 x 10-4
1.8 x 10-4
6.0 x 10-4
1.9 x 10-4

5. Achieve low load mounting for thin chip (NAND)
Non Conductive Die Bonding
Benefits
Achieve low load mounting for thin chip (NAND)
TDS
　Product Name
XS-DBC-040
XS-DBC-041
Condition
Color
Liquid
Black
Visual Contact
Main Component
Epoxy
One Component
Viscosity
~ mPa･s ~
24,500
23,280
Cone / Plate　
Thixotropic
~T.I. ~ 2
1rpm / Cone / Plate
Bleeding OK
Ceramics
Heat Cure Condition
C×min
120 C×30min or 150 C×5min
tan δ C 23 85
DMA method 0.2mmt
25℃
MPa 42
3,500
200℃ 10 52
Shear strength
4.3
Glass / Glass, 150 C　
Outgas (TGA) %
0.8
0.2
200 C
Pot Life
Time
5 days
At Room Temperature
Guaranteed Condition
0 ~ 15
At Dark Place

6. Our Ag material does not have experience to semiconductor market.
Ag Paste for Conductive
Our Ag material does not have experience to semiconductor market.
Therefore, if you have any requirement of specification or environmental spec , please let me know.
Code No.
PELTRON®
Remarks
S-3028
XJS-3051
Feature
No Sulfide Low resistance
No Sulfide High adhesive strength Good dispensability (150μmφ dot)
Characteristics of paste
Appearance
Silver
Base resin
Epoxy
Filler Ag
Viscosity
16 Pa・s
160 Pa・s
25℃, E type viscometer 5rpm
Shelf life
6 month (Temporary)
Pot life
24h
Storage Condition
-18 C
Characteristics after cured
Cure condition
150C × 60min 170C×90sec (Snap)
140C × 30min 170C×90sec (Snap
Volume resistance
1.8 × 10-4 －
Ω･cm
Resistance of vertical conduction
16.8
31.6
mΩ / 10μm
Die share strength
21 N/mm2 CF
38 N/mm2 AF (Cu)
Cu/Si, 25℃
26 N/mm2 CF
38 N/mm2 AF (Au)
Au/Si, 25℃
14 N/mm2 CF
29 N/mm2 AF (Au)
Alumina/Au, 25℃

7. - Doesn’t decompose wire
Wire Protection
Future Si
500um
“Adhesive”
- Doesn’t decompose wire
- Doesn’t crack and delaminate under Temperature Shock test
- Viscosity doesn’t expand to active sensor area
TDS
Product Name
8840H
5210
Base Material
Acrylate
Epoxy
Viscosity
mPa・s
41,000
39,000 (T.I. 1.5)
Curing Condition
mJ / cm2
4,500 ~ 6,000
6,000 +
80 C x 30 min
Hardness
Shore
D 70
D 86
Volume Shrinkage %
3.4
4.2 Tg C 50
132 α1
1 / C
9.7 x 10-5
1.1 x 10-4 α2
2.4 x 10-4
Elastic Modulus
MPa
1,132
3,100
8840H is used for automotive devices.
8840H passed automotive TS spec. (-45 ⇔105 C X 1000h)
5210 isn’t cationic-reaction type of epoxy adhesive.
5210 has less impurity ions.

8. Thank you very much for your attention and interested!