1. Glass Frit Bonding
Anas Al-Azawi

2. Principle of glass frit bonding
Using glass glass as a special intermediate layer
Advantages: Hermetic sealing, metallic lead - throughs,
narrow bonding frames, and high bonding yield

3. Glass Frit Materials
Low melting point glass which allow reflow in the temperature range 400C- 450C
Main components of Ferro FX glass frit paste
RoHS directive constrict the use of lead additves

4. Screen Printing Structurd film supported by the mesh
Bond frames are structured in silicon and printed with glas frit paste

5. Thermal Conditioning
Organics from the binder and te solvents would cause large bubbles in the glass at the process temperature at which the glass compound melt and wet he surface
Three step thermal preprocess to burn out the primer and to transform the paste into real pre melted glass is essential for higj quality bond

6. Thermal Conditioning
1) Directly after printing, the glass paste has to be dried and stabillized at 120C. Solvents disappear and the binder is internally crosslinked and stabillized
2) Binder is burned out at 360C. Glass is not melted but viscosity is reduced. Complete burn out takes 10 min.
3) The glass particles are completely melt and fuse into glass at 450C. Filler particles are enclosed in the glass but not fused into it.

7. Wafer Bond Process The bonding process, which is,
from the physics, driven by temperature, has to be supported by mechanical pressure
on the wafers, in order to compensate for wafer bow influences and screen
printing inhomogeneities

8. Wafer Bond Process