1. Objectives of Pletronics Quality System Providing well defined quality metrics for each department within Pletronics, bringing problem areas into the open and undertaking a focused approach towards resolution leading to quality improvement

2. Methods to achieve Objectives Establishing metrics and standards for each department within Pletronics Analyzing and identifying Root Causes Preventing reoccurrence of Root Causes Formulating and executing effective Permanent Corrective Actions Developing accurate prediction and prevention of quality problems by insuring effective communication between departments and with Pletronics allied foundries

3. Improving the Quality Management System Maintaining certification of International Standards for the Quality Management System within Pletronics and our allied foundries Setting Quality targets based on Management review and quality policy, establishing actions to achieve targets and executing improvement plans Ensuring effective communication exists within Pletronics and between Pletronics and our allied foundries

4. Pletronics Component Quality Design Engineering –Develop product concept and specifications –Directs the design effort –Follows the product and makes requested changes and corrections throughout the life of the product Material Quality-Material Quality Engineering –Provides procedures and criteria to insure quality of assembly components Process Control-Process Engineering –Provides process flow, assembly procedures, machine setup and maintenance, process control points and continuous process improvement Test Engineering –Provides measurement capability analysis to ensure testing is accurate repeatable and reproducible. –Insures components meet required specifications Quality Engineering –Provide analysis of the manufacturing process at all stages to improve the quality of the production process and its products. –Focusing on Quality Control and Quality assurance management through the use of technology, international standards and statistical tools.

5. Pletronics Component Testing Qualification Production Testing Factory Quality Audit Testing Reliability Audit

6. Pletronics Qualification Test Name General RequirementsHAST ESD HBMMarking Permanency ESD MMMechanical Vibration Latch-upMechanical Shock CharacterizationPhysical Dimensions Thermal specificationsExternal Visual HTOLSolderability Pre/post HTOL CharacterizationLow Temperature Storage Infant Mortality/EFRLeak Test Temperature CycleLead Integrity High Temperature StorageBond Stength Moisture Sensitivity LevelDie Shear Temperature Humidity BiasResistance to Soldering Heat

7. IQC Blank Wash Hi-Temp Epoxy Cure Crystal Mount Epoxy Dispense Base Plate Carrier Preparation 1 Incoming Freq. B/P Mask dimension Carrier dimension F/P Mask Dimension Outgoing Freq. B/P OCAP Scrap Coplanarity C/M OCAP Scrap Misalignment Dot size Scrap 2 Dot Size C/M OCAP IC Assembly and Vacuum Bake

8. Bubble Leak Test He Leak Test Laser Mark Seam Weld Tuning Pre-Tack Pre-Age 1 3 Freq. Check Visual Insp Yield Check 2 Tuning OCAP Scrap S/W OCAP Scrap

9. FC-40 Bomb T&R Final Test 1 AQL Sample TC 3 Ship O defects? DLD 100%TC Final Test 2 Leak Test Freq. Test Reflow Pass Fail Engineering Gate

10. Pletronics FQA Factory Quality Audit – The primary goal of factory audit testing is to validate all units have been produced and tested to meet critical requirements. –Test conditions are identical to the specification of the Datasheet Including, voltages, temperatures, frequency, power, rise time, fall time and loading

11. Pletronics Reliability Audit Reliability Audit –Reliability audits are conducted to validate that a process and product maintains the required level of quality and reliability throughout the life of the product –The reliability environments are a subset of those used for product qualification Test Name Characterization Thermal specifications HTOL Pre/post HTOL Characterization Temperature Cycle High Temperature Storage Die Shear Resistance to Soldering Heat Physical Dimensions External Visual Solderability Low Temperature Storage Leak Test Lead Integrity Bond Stength

12. Typical FA Flow

13. Thank you.