1 CiS Forschungsinstitut für Mikrosensorik GmbH Ongoing R&D Activities at CiS Forschungsinstitut für Mikrosensorik: Bump Bonding 23.6.2015 Sabine Nieland,

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Presentation transcript:

1 CiS Forschungsinstitut für Mikrosensorik GmbH Ongoing R&D Activities at CiS Forschungsinstitut für Mikrosensorik: Bump Bonding Sabine Nieland, Alexander Lawerenz, Tobias Wittig, Arno Kompatscher, Christian Maier, Ralf Röder

2 CiS Forschungsinstitut für Mikrosensorik GmbH Ongoing R&D Activities at CiS: Bump Bonding Outlook Introduction and state of the art of Under Bump Metallisation (UBM) Under Bump Metallisation (electroless plating) Immersion soldering Light-induced plating (LIP) Flip-chipping Ni/Au + solder

3 CiS Forschungsinstitut für Mikrosensorik GmbH Introduction Contact points are spread over the whole sensor and chip area, with a high density of small contact points. Materials have to withstand the high LHC luminosity. Temperature stability has to be from -40 °C to RT. (FhG-IZM) Chip Sensor Particle Bump-Bonds

4 CiS Forschungsinstitut für Mikrosensorik GmbH State of the art 40 µm UBM: Ti/Pt/Au Solder: In Processing: evaporation (plating base), lithography & lift-off UBM: Ti/W/Cu Solder: SnAg3.5 Processing: sputtering (plating base), lithography, electroplating, lift-off & etching of plating base UBM: electroless Ni/Au Solder: SnAg3.5 as solder ball Processing solder: solderball placement 50 µm 40 µm Karlsruhe KIT Berlin FhG-IZM Pac Tech, Nauen

5 CiS Forschungsinstitut für Mikrosensorik GmbH UBM at CiS: electroless AlSi pad as the base for electroless Ni + Au plating Passivation on the AlSi as a mask for the electroless plating No need for a PVD plating base No need for lithography and a photoresist No need for lifting-off (etching) the photoresist

6 CiS Forschungsinstitut für Mikrosensorik GmbH UBM at CiS: electroless AlSi pad as the base for electroless Ni + Au plating Passivation on the AlSi as a mask for the electroless plating oldnew First trials with older ATLAS/CMS-Pixel sensors New experiments with new sensors: much better quality, pads are higher: some microns of Ni + thick Au layer. Surface much more homogenious

7 CiS Forschungsinstitut für Mikrosensorik GmbH UBM at CiS: electroless old

8 CiS Forschungsinstitut für Mikrosensorik GmbH Immersion Soldering Wafer or diced sensor is immersed into solder bath or moves along a solder filled groove. Solder adheres to Ni/Au-UBM & forms bumps. FhG IZM (Berlin FhG IZM)

9 CiS Forschungsinstitut für Mikrosensorik GmbH Ni-UBM + SnAg3.5 solder First trials with older ATLAS pixel sensors homogeneity quite well height and width still quite small Better results with younger sensors Ni/Au pads as well as the solder bumps are higher. Pads stick out of the sensor. Ni/Au Ni/Au + solder Ni/AuNi/Au + solder Ni/Au

10 CiS Forschungsinstitut für Mikrosensorik GmbH LIP – Light Induced Plating Growth of the UBM and solder is stimulated by laser light. UBM is only growing on the passivation openings. No additional process steps are necessary no plating base / resist, no stripping / etching. Less cost & time consuming (in cooperation with TU Ilmenau)

11 CiS Forschungsinstitut für Mikrosensorik GmbH LIP – Light Induced Plating First trials done on CMS-pixel sensors (no difference to ATLAS pixel):... works in principle. Homogeneity of Ni is “improvable”. Also old sensor with bad Al surface used (better results expected with new sensors) Next steps Combine Ni-UBM (LIP or chemical) with LIP solder Alternative to immersion soldering different electrolytes Sn, SnAg3.5, In, In/Sn Additional usage of lacquer mask to grow higher solder pillars (in cooperation with TU Ilmenau)

12 CiS Forschungsinstitut für Mikrosensorik GmbH Flip-chipping at CiS FineplacerDie-Bonder

13 CiS Forschungsinstitut für Mikrosensorik GmbH Flip-chipping at CiS: Daisy Chains Daisy chain dummies are in production. Geometry is based on CMS Pixel. Different bump pad parameters will be tested: different bump pad diameters, different UBM and solder variants (also with bumps from FhG-IZM), large quantity, different sensor/chip sizes. Measurement of resistance Current paths Bump Bond Chip Sensor FhG IZM

14 CiS Forschungsinstitut für Mikrosensorik GmbH Conclusion & Outlook CiS is exploring different kinds of UBM & flip-chip technologies. Focus is layed on cost efficiency, dimensions (UBM and solder size), in-house processes (complete or partial). Different technologies are considered and are investigated. Mask-less Ni/Au UBM + SnAg3.5 solder look promising at the moment. Possibilities of light induced plating and solder immersion are extended. Flip-chip tests are on the way.