1. Tracker Upgrade Week –Sensors Meeting Sensor Production 24. July 2014 Marko Dragicevic

2. MAPSA LIGHT SENSOR Marko Dragicevic24. July 20142

3. Status Design of sensors and all its variations is ready! –Kudos to Martin Printz (KIT) –An internal design review was conducted between sensor and electronics group –Made sure that interface between sensor and chip (location of bump bonds) is correct A wafer layout has been proposed –Already contains plenty of sensors for all envisaged assembly and sensor studies –There would still be some space left… –Otherwise it will be populated with more copies of the existing structures –Deadline: 1. August 2014 Order from procurement office to CiS is already out –CiS is waiting for the final GDS –Costs for 14 wafers: 27 kEUR (33 kCHF) Marko Dragicevic24. July 20143

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8. 2S PROTOTYPE SENSOR (FULL SIZE 6” VERSION) Marko Dragicevic24. July 20148

9. Status Sensor group is working on –Sensor design and wafer layout –Definition of materials and process options –Expected to be ready be the end of summer Start administrative process with CERN procurement now –We need to decide were we want to buy and how much 9Marko Dragicevic24. July 2014

10. Production: Costs CNM: 6” strip production not available before 2016! CiS: 6” production is new! 200 µm physical thickness could be challenging Infineon: –Low price quoted is due to sharing of costs for this run –First production of n-on-p sensors –We get 25 wafers, min 10 have to fully comply with our specs rest can be slightly outside –If run is successful, we can order additional pieces for 1000 EUR/wafer (in batches of 10) Marko Dragicevic24. July 2014 EUR per sensor CNM (4”)HPK (6”)Micron (6”) SINTEF (6”) CiS(6”)Infineon (6”) 20 pcs2850320044252000 22 pcs8200 25 pcs*2180 * for 25 wafers, min. 10 with full specs 10

11. Production: Costs Cheapest, reliable manufacturer is: HPK –Sensors of reliable quality are needed soon to test module components –HPK is an important candidate for the mass production Suggest to additionally produce with Infineon –Offers possibilities that HPK might not [O] lean, pure FZ Test of layout and process optimisations –Production needs to be qualified if we want Infineon for the mass production –Direct comparison with HPK 11Marko Dragicevic24. July 2014 EUR per sensor CNM (4”)HPK (6”)Micron (6”) SINTEF (6”) CiS(6”)Infineon (6”) 285032004425820020002180

12. We would like to have sensors from the most promising materials: –p-type MCZ and FZ, 200 µm physical thickness Suggestion: 20 x dd-FZ200 + 20 x MCZ200 –Two batches Alternative to lower costs? 10 x dd-FZ200 + 10 x MCZ200 –Single batch at HPK is around 20 – 25 wafers –I suspect that FZ and MCZ cannot be processed in the same batch –We would again end up at two batches, limited cost savings –If interesting I will clarify with HPK Total costs –40 wafer from: ≈ 120 kEUR (probably lower) –25 wafers from Infineon: 55 kEUR Number of Wafers 12Marko Dragicevic24. July 2014

13. Baseline Design 2S Sensor Wafer: –Wafer diameter (6” wafer): 150 mm –Forbidden margin 5 mm -> 140 mm usable Sensor –Strips: 1016 (8 x 127) –Strip Pitch: 90 µm –Width/Pitch: ~ 0.25 –P-stop: Atoll, 4 µm width, 6 µm spacing 2S Sensor size –Fitted size to what is used in CAD models –Not optimised for optimal wafer usage! –Sensor width: 94.183 mm –Sensor length: 102.7 mm –Active size: 100.6 x 91.5 mm 2 Marko Dragicevic24. July 2014 150 mm 5 mm 140 mm 13 94.183 mm 102.7 mm

14. Wafer Layout Marko Dragicevic24. July 2014 2S sensor –94 mm x 103 mm Test sensors –1 x BabyStrip: 127 ch x 50 mm –6 x BabyStrixel: 127 ch x 23 mm –4 x TinyStrixel: 127 ch x 12.5 mm Teststructures –Wafer will be filled with Teststructures –Currently only Diodes are implemented –Size of TS will be significantly reduced compared to old “Halfmoon” 14 2S Sensor BabyStrip BabyStrixel TinyStrixel

15. 2S Sensor BabyStrip BabyStrixel TinyStrixel Design Options BabyStrip: –Standard test sensors for CBC with 5 cm strips BabyStrixel 1.P-stop Atoll geometries Following the results from the KIT/CNM run 2.P-stop Common geometries Consumes less space, should have similar performance 3.Strixel segmentation area Optimising the pitch between strixels at the segmentation area 4.Center Bias Line for strixels To connect strixels at the center Moves bond pad nearer to sensor edge 5.Irradiation Sensor Standard design like main 2S Sensor Prototype 6.??? TinyStrixel 1.No P-stop 2. - 4.??? 15Marko Dragicevic24. July 2014

16. Material: 20 x dd-FZ200@200 + 20 x MCZ200 –All in 200 µm physical/active thickness –We consider using dd-FZ200 (active: 200 µm/ physical 320 µm) which is thinned to 200 µm to get a lower [O] spread –FTH200 = dd-FZ320@200 ≠ dd-FZ200@200 Process options (for both materials) –14 x standard p-stop (as suggested by HPK/used for the HPK campaign) –2 x p-stop Dose/Depth Variation 1 (tbd) –2 x p-stop Dose/Depth Variation 2 (tbd) –2 x p-spray (as suggested by HPK/used for the HPK campaign) Total of 40 Wafer: ≈ 120 kEUR Process Options - HPK 16Marko Dragicevic24. July 2014

17. Process Options - Infineon Material: 20 x FZ200+ 5 x MCZ200 –All in 200 µm physical/active thickness –The FZ material is pure oxygen lean ([O] < 2E16/cm 3 ) FZ Process options –First production of NonP sensors at Infineon –Need to tune parameters for all implantations, especially p- stop and p-spray –Will discuss with Infineon Total of 25 Wafer: = 55 kEUR (Then 10 kEUR/10 wafers with same masks) 17Marko Dragicevic24. July 2014

18. Tentative Timeline Until September (CMS Upgrade Week) –Finalize sensor design and wafer layout –Define materials and process –Start administrative process with CERN Procurement (HPK and Infineon) September – Beginning 2015 –Start the production –HPK: Approximate lead time is 4 months, procurement of wafers might add some time –Infineon: potentially faster, but many unknowns 18Marko Dragicevic24. July 2014

19. Conclusions I The 2S Prototype Sensors are an essential step in the Tracker R&D to successfully: Evaluate the design of the 2S sensor –Test of different sensor layout options with small sensors Evaluate radiation hardness of sensor design and material –Continuation of the HPK Thin Sensor Campaign Evaluate the 2S module design by building a full size prototype –Already needed now to test 8xCBC hybrid prototypes Evaluate vendors and prepare for the mass production 19Marko Dragicevic24. July 2014

20. 8” N-ON-P SENSORS WITH INFINEON Marko Dragicevic24. July 201420

21. Status Order is already out for some time –To encourage Infineon to work on it Costs: 120 kEUR Sensor design and layout will be inherited from the 6” 2S Sensor Prototype Run Infineon has defined the process plan They have processed one batch of 8” wafers going through the complete process with arbitrary masks (Kurzläufer) Goal: Estimate the yield for a 8” production at 200 µm thickness Outcome: All wafers survived! 21Marko Dragicevic24. July 2014

22. Conclusions II 22Marko Dragicevic24. July 2014 Upcoming sensors productions (2S, MAPSA- light and 8”) will yield plenty of test sensors and structures! Great opportunity to: Join the effort to characterise sensors and test structure To perform interesting studies with your students If you are interested contact Alexander Dierlamm Marko Dragicevic

23. THANKS FOR YOUR ATTENTION!