Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA1 Cooling Mechatronics Schedule

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA2 Presentation Development plan Milestones Tasks to be completed Schedule Base line

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA3 Development plan SM0 and SM1 as prototype to go in H4 beam SM2 and SM3 as pre serial production Production begins at SM4 SM0 and SM1 probably need retrofitting

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA4 Milestones SM0 has to be ready for H4 beginning of July 03 –SM0 cooling has to be available beginning of May Serial calibration from March 2004

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA5 Tasks Preliminary design –Aim: study of the cooling mechanics principle Choice of the principle of the cooling: –Performed during 26 November Task Force –Agreement about cooling principle Prototype drawings –Duration: 2 months –Drawings for material to be installed in SM0 for test beam in 2003

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA6 Tasks (2) SM0 and SM1 manufacturing –Duration: 3 months –2 SM in order to be able to mount a second electronic solution when 1 SM is in test beam Prototype mounting and tests –1 month for some adjustments –Tests: Leak tests Flow equilibrium between modules Thermal performances

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA7 Tasks (3) Serial drawings –Ended after prototype mounting and tests –some minor modification can be made during tendering Market survey –Cooling bars manufacturing is a special technique: it will probably require a market survey –Has to be launched as soon as possible –Typically 6 months duration

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA8 Tasks (4) Tendering and ordering –Typically 2 months Pre serial manufacturing –2 SM: SM2 and SM3 –Needs the mould development (2 months at least) –Pre serial production needed at least for mechanical fit checks. –After the mounting, drawings corrections (if needed) then agreement about the serial production

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA9 Schedule

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA10 Base line Information coming from the electronic group have been used as the base line in the design. This information becomes requirements now to the electronic. Changing any base line data will impact the cooling mechanic schedule Some information is still needed to finalize the design. Answers are urgent in order to avoid delays.

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA11 Requirements VFE boards: –Maximum card dimensions (card nose excluded) 114 mm x 78 mm –Card nose width < 80 mm (to MB or to FE) –Maximum component height: 2,3 mm –Possible to fix the card to housing with 6 M3 screws (at least 2 very closed to card nose to MB) –8 Watt dissipation on the card

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA12 Requirements LVR board –Same dimensions as VFE cards for the PCB –Same possibility to fix it to the housing Mother board –Modularity: 1 per trigger tower –Maximum size 104 x 110 mm2 –Self sustaining –Connector to VFE cards compatible with 0,3 mm position error and insertion movement of the VFE card –Connector positioning on the card +/- 0,05 mm

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA13 Requirement FE board –In an horizontal plane –3 Watt dissipation (for 1 trigger tower) –Connector to VFE cards compatible with 0,3 mm position error of the VFE card –Connector positioning on the card +/- 0,05 mm

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA14 Missing information Mother board design –Type of connection between mother board and APD connectors –Maximum length of this connection –Thickness of the board: are there passive components to take into account? –Type of connectors, guiding needed or provided by the connector

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA15 Missing information VFE board –Kind of connector on VFE board –Fixation holes location –Layout of the components LVR board –Same information as for VFE board –Connection to the bus bar –Connection to the FE board

Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA16 Missing information FE board –Type of connection to VFE board –Maximal dimensions –Possibility to cool it down –Mechanical fixation Token ring board –Not yet taken into account in the design –No information available