Page 1 © 2014 X2Y Technology Presentation – May 2014

Page 2 © 2014 X2Y Technology Presentation – May 2014 MLCC Design X2Y ® Design AB Shield Electrodes G1 A G2 B + = A B G1 G2 A B or G1 G2 A B A B A B

Page 3 © 2014 X2Y Technology Presentation – May 2014 Low Inductance Design 1.Shorter current path to ground. 2.Dual current path to ground. 3.Opposing internal current flow X2Y® 4. Efficient use of mutual inductance lowers net ESL when mounted on the PCB. MLCC

Page 4 © 2014 X2Y Technology Presentation – May 2014 Two Circuit Solutions CM Choke Replacement DC-DC HF Filtering I/O EMI Filtering RFI Susceptibility Filter Replace 4-7 MLCCs / X2Y 30% Via Reduction 40% PCB Layout Savings Unparalled Decoupling Performance EMI FILTERING (Dual-line) IC POWER BYPASS (Decoupling)

Page 5 © 2014 X2Y Technology Presentation – May 2014 X2Y ® Capacitors, Nearly Ideal Shunts Two closely matched capacitors in one package. Considerably less noise-mode conversion then discretes Very low inductance between terminals. Extends HF filtering to GHz range X2Y ® Capacitors for EMI Filtering

Page 6 © 2014 X2Y Technology Presentation – May 2014 X2Y Circuit Solutions Replace 4-7 MLCCs / X2Y 30% Via Reduction 40% PCB Layout Savings Unparalled Decoupling Performance EMI FILTERING (Dual-line) IC POWER BYPASS (Decoupling)

Page 7 © 2014 X2Y Technology Presentation – May 2014 Common Mode Filtering Study

Page 8 © 2014 X2Y Technology Presentation – May 2014 Series Magnetic Filters vs Shunt X2Y Filter Study Agilent E5071C ENA 100 kHz GHz 4-port measurements Mixed mode derivations Precision test boards Short/Open/Load/Through Calibration to de-embed fixture effects

Page 9 © 2014 X2Y Technology Presentation – May 2014 Differential Signal Filtering Mixed mode measurements: SDD21, shows filter cut off frequency for differential signals SCD21, mode conversion and radiated emissions SDC21, mode conversion and EMI susceptibility SCC21, shows filter cut off frequency for common signals Key focus: total common mode power past filter output: Sum of: Source CM power * CM (SCC21) attenuation and Source Signal power * mode conversion (SCD21) X2Y ® mode conversion is typically much better than magnetics

Page 10 © 2014 X2Y Technology Presentation – May 2014 DUT Component Size (mm) L x W x HDC Current Rating Photo (not to scale) X2Y® x 3.2 x 2.3In bypass, no current limit X2Y® x 1.6 x 1.3In bypass, no current limit X2Y® x 0.8 x 0.7In bypass, no current limit (1) 4000 Ohm CMC5.0 x 3.6 x mAmps (1) 1000 Ohm CMC5.0 x 4.7 x mAmps (1) 4.7 mH CMC A9.0 x 6.0 x mAmps (1) 4.7mH CMC B9.3 x 5.9 x mAmps (2) 1uH Chip Inductors(2) 3.2 x 1.6 x mAmps (2) 120 Ohm Ferrite Beads(2) 3.2 x 1.6 x mAmps (2) 600 Ohm Ferrite Beads(2) 3.2 x 1.6 x mAmps Devices Under Test

Page 11 © 2014 X2Y Technology Presentation – May 2014 Footprint Comparisons

Page 12 © 2014 X2Y Technology Presentation – May 2014 Measured CM Rejection 50Ohm Z SOURCE, 50Ohm Z ANTENNA Common Mode Rejection Comparisons

Page 13 © 2014 X2Y Technology Presentation – May 2014 Measured CM Rejection 50Ohm Z SOURCE, 150Ohm Z ANTENNA Common Mode Rejection Comparisons

Page 14 © 2014 X2Y Technology Presentation – May 2014 Differential to Common Mode Conversion Measurements Parasitic capacitive coupling in CM chokes results in significant mode conversion at even modest frequencies. Typical ≈ 350MHz (F KNEE IEC ) Some devices are much worse Results in weak ESD immunity.

Page 15 © 2014 X2Y Technology Presentation – May 2014 Ferrite beads and smaller value chokes improve mode conversion, but exhibit poorer common mode rejection Differential to Common Mode Conversion Measurements

Page 16 © 2014 X2Y Technology Presentation – May 2014 Different chokes with the same datasheet specifications can result in dramatically different mode conversion characteristics. LF chokes exhibit particularly poor mode conversion at high frequencies. Differential to Common Mode Conversion Measurements

Page 17 © 2014 X2Y Technology Presentation – May 2014 X2Y ® capacitors convert a small amount of differential energy to common mode due to finite tolerance mismatches. Conversion is 350MHz, 17dB better than typical CM choke / bead solution Measured Differential to Common Mode Conversion X2Y ® 0603 Capacitors Differential to Common Mode Conversion Measurements

Page 18 © 2014 X2Y Technology Presentation – May 2014 Effect of Mode Conversion on CM Output Power Upper plot: Original SCC21 and SCD21 for common mode choke Lower Plot: SCC21 shifted down 20dB to reflect assumed condition CM source noise 20dB below signal Mode conversion dominates CM output from 300MHz and up Mode conversion largely defeats the filter performance especially at high frequencies where it is most needed

Page 19 © 2014 X2Y Technology Presentation – May 2014 X2Y ® vs CM Choke Superior mode conversion of X2Y ® capacitors results in far less HF signal energy conversion into CM noise For CM 20dB below signal at the source, 5.6pF X2Y ® yields substantially less CM noise at high frequencies that dominate signal energy (X2Y ® devices must be selected for acceptable signal performance.)

Page 20 © 2014 X2Y Technology Presentation – May 2014 Comparative Performance Application In this design, a X2Y uF capacitor was used to replace a common mode choke, two resistors and two capacitors to achieve the filter results shown above uF 50V 51µH CMC 220nF Caps 3.9KΩ Res CLASS D AUDIO DRIVER

Page 21 © 2014 X2Y Technology Presentation – May 2014 Test Comparisons Example, Single Board Computer Power Feed: 68HC11 processor 5uH CM choke tested PI filter w/ 5uH CM choke tested 0.1uF cap_5uH CM choke_220nF cap Seven values of X2Y ® capacitors tested 47pF, 100pF, 220pF, 330pF, 470pF, 560pF, 1000pF Radiated Emissions Setup: Receiver GTEM Ets-Lindgren DUT inside 50 Ohm Coax Cable Computer

Page 22 © 2014 X2Y Technology Presentation – May 2014 Comparative Performance Application HC11 (50MHz –1GHz, 1000pF X2Y) 1MHz – 500MHz, 1,000pF X2Y ® X2Y ® 1,000pF high frequency radiated emissions vastly better then CMC or PI 1000pF

Page 23 © 2014 X2Y Technology Presentation – May 2014 X2Y ® Capacitors, Best Practices Circuit 1 Performance is typically limited by external capacitor wiring inductance: L3A/L3B, L4A, L4B Maximize performance by minimizing L3x, and L4x inductances. Follow X2Y ® mounting guidelines. L1x, and L2x inductance is OK and even beneficial when balanced. Limitation on L2 is to keep connection close to egress.

Page 24 © 2014 X2Y Technology Presentation – May 2014 Locate capacitors close to bulkhead Minimize, L3A, L3B Connect A, B pad connections near base of pads Minimize L4A, L4B: Connect G1/G2 to RF return polygon on an internal PCB layer as close to the capacitor surface as possible. Chassis for metal enclosures Power common plane for plastic enclosures. 12mil vs 4mil upper dielectric costs about 3dB insertion Metal enclosures attach RF return polygon to chassis w/ low inductance Multiple attachments along PCB edge recommended X2Y ® Capacitors, Best Practices Circuit 1

Page 25 © 2014 X2Y Technology Presentation – May 2014 X2Y ® Capacitors, Best Practices Circuit 1

Page 26 © 2014 X2Y Technology Presentation – May 2014 X2Y ® Capacitors, Ethernet Application

Page 27 © 2014 X2Y Technology Presentation – May 2014 Common Mode Summary Most EMI problems are Common Mode. Reduce common mode by attenuating driving voltage and/or mismatching antenna impedance. Properly mounted X2Y ® caps do both Series elements suffer from mode conversion and/or poor CM insertion loss at high frequencies. X2Y ® capacitors maintain good CM insertion loss and mode conversion figures into the GHz.

Page 28 © 2014 X2Y Technology Presentation – May 2014 X2Y Circuit Solutions Replace 4-7 MLCCs / X2Y 30% Via Reduction 40% PCB Layout Savings Unparalled Decoupling Performance EMI FILTERING (Dual-line) IC POWER BYPASS (Decoupling)

Page 29 © 2014 X2Y Technology Presentation – May 2014 All commonly deployed DC-DC converter topologies have at least one switched port. Parasitic capacitance across filter inductors passes high frequency switching noise to filtered ports HF noise propagation through filtered and switched ports is proportional to filter capacitor mounted ESL at each. The unique construction of X2Y ® capacitors results in essentially constant mounted ESL in larger body parts such as 1206, as in smaller body parts such as Enables massive improvement in filter performance w/o extra magnetics. X2Y® in DC-DC Converters

Page 30 © 2014 X2Y Technology Presentation – May X2Y ® vs 1206 MLC (µStrip mounting config.) X2Y µF HF Impedance |S21| Impedance, 1206 Size MLC vs X2Y ® MLC µF HF Impedance X2Y nF HF Impedance 100Ω 10Ω 1.0Ω 100mΩ 10mΩ 1mΩ 100kHz 1MHz 10MHz 100MHz 1GHz 10GHz Frequency Impedance 20:1 HF Noise Attenuation from 60 – 1000 Mhz X2Y® in DC-DC Converters

Page 31 © 2014 X2Y Technology Presentation – May 2014 X2Y ® Low ESL attenuates HF spikes at both input and output nodes for all common topologies: X2Y® in DC-DC Converters

Page 32 © 2014 X2Y Technology Presentation – May 2014 Filter parasitics pass HF noise, often 200MHz or more to output Solutions: 1) Add series filters Increases Cost, Space, DC loss 2) Reduce filter capacitor inductance MOUNTED ESL (µstrip) MLC 1206 caps: > 1.0nH X2Y ® 1206 caps: 40-55pH 10X-20X+ better than conventional 1206 Value depends on mounting configuration X2Y® in DC-DC Converters

Page 33 © 2014 X2Y Technology Presentation – May 2014 X2Y® in DC-DC Converters X2Y ® low ESL shunts HF noise: Noise “Brick Wall” Reduced EMI from converter into application PCB Reduced EMI from application PCB conducted back through converter No extra magnetics Reduces cost for performance Saves space No extra DC drop

Page 34 © 2014 X2Y Technology Presentation – May 2014 Buck DC-DC Converter Input Filter X2Y ® Location

Page 35 © 2014 X2Y Technology Presentation – May 2014 Radiated Emissions from DC-DC Feed GPS DC-DC Converter

Page 36 © 2014 X2Y Technology Presentation – May 2014 Conducted Emissions from a Commercial Vehicle Lighting Supply Multiple output switching power supply Original design included many LC, and Pi form networks to suppress PCB level noise and conducted emissions Replaced these networks at the I/O w/ X2Y capacitors in Circuit 1 1) One half X2Y to a given I/O Circuit 2 for decoupling ICs Big parts count, real-estate, and cost reduction over and above massive improvement in conducted emissions

Page 37 © 2014 X2Y Technology Presentation – May Semiconductor Manufacturer's Technical References

Page 38 © 2014 X2Y Technology Presentation – May 2014 Size, Voltage, Capacitance Offering 10

Page 39 © 2014 X2Y Technology Presentation – May 2014 X2Y Eval. & PCB Design Guide

Page 40 © 2014 X2Y Technology Presentation – May 2014 Common Mode Filter Study (detailed) GSM RFI Suppression (detailed) DC Motor Filtering (5 App. Notes) Low Acoustic Noise (Microphonics) Data Connector Filtering Improving Common Mode BW of InAmps Additional Information: EMI Filtering

Page 41 © 2014 X2Y Technology Presentation – May 2014 Additional Information: Power Bypass Amplifier VCC Noise Comparisons (NEW) Decoupling FPGAs etc. Impact of PCB Stack and Via Design on PDN High Performance Bypass Methods & PDN Synthesis X2Y Advantage on IC Backside X2Y Altera Stratix II GX SerDes Bypass Demo X2Y Live FPGA Bypass Demo

Page 42 © 2014 X2Y Technology Presentation – May 2014 Technical References JDI WEBSITE X2Y Filter Evaluation and PCB Design Guide GSM RFI Suppression with X2Y® EMI Filters Improve Instrument Amplifier Performance with X2Y Optimized Input Filter TI Analog Elab Video: GSM Cell Phone Filtering TI Analog Elab Video: Improve Instrumentation Amplifier Performance Using X2Y Capacitors X2Y DC Motor Filtering Basics Impact of PCB Stack and Via Design on PDN X2Y Altera Stratix II GX SerDes Bypass Demo X2Y Live FPGA Bypass Demo Mounting X2Y for Power Bypass

Page 43 © 2014 X2Y Technology Presentation – May 2014 Thank You ! For Application Information: Let us show you the advantages of using X2Y ® in your products. Johanson Dielectrics, Inc. can provide application engineering assistance, application specific laboratory test results and product samples. For product samples or more technical information please contact your local representative or: Steve Cole X2Y Business Development Mgr. Tel: (603) Website: