March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review1 M. Garcia-Sciveres LBNL & Module Assembly & Module Assembly WBS 1.1.1.5 Hybrids Hybrids WBS.

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Presentation transcript:

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review1 M. Garcia-Sciveres LBNL & Module Assembly & Module Assembly WBS Hybrids Hybrids WBS

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review2 Schematic Cross Section (through here) Bumps Flex Hybrid Sensor Wirebonds ASICs The Pixel Module All modules are identical (barrel and disks) “Pigtails” of different varieties are attached in assembly depending on use location

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review3 Module Production COMPONENTSUS RESPONSIBILITYINSTITUTIONS Bumped 8” FE WafersProbe Thin and Dice LBNL SensorsProbeNew Mexico, Oklahoma Bare modulesProbe (no flip-chip in US)LBNL Flex HybridsFabricate Component load & Test Load MCC chip & test Oklahoma Oklahoma, Albany Oklahoma, Albany Full ModulesAssemble, Wirebond, Test, Burn-In LBNL TBD Disk PigtailsFabricate, Test, AssembleLBNL

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review4 Flowchart Support frame w/ flex hybrid No test tail.Glue and bond pigtail Remove from frame

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review & Schedule Summary

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review6 Flex Hybrids Development has so far gone through two design cycles Version 1.x (x=0,1,3,4) –80 Fabricated by CERN and Compunetics between 1998 and –Used to make “proof of principle” working modules with rad-soft electronics Version 2.x (x=1,2) –150 Fabricated by CERN and Compunetics in 2000 –Detailed performance characterization & system tests have not been possible due to lack of rad-hard electronics –Used to debug manufacturing & assembly process & to investigate mass production issues. Final Design Review during December ’00 Pixel Week –“Early” in design terms to derive max. technical benefit

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review7 Flex Hybrids (continued) Goals for Version 3 Flex design (in progress): –Qualify more vendors Increasing ease of manufacture through interaction with designs of new FE chip and services. – Test bed for first IBM FE chip run (FE-I) – to submit July 01 Accelerating design cycle and avoiding un-proven features so hybrids will be ready ahead of FE-I delivery Making compatible with existing (obsolete) controller chip –Compatible with mass assembly, testing, and handling Apply lessons learned from V2.x prototypes –Address system integration Work closely with parallel development of service connections Preliminary layout to be ready for bidding in April Expected fabrication June-Aug

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review8 WBS Funding Profile

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review9 Carrier Frame New development for Flex V.3 Needed for reliable mass production, handling, & shipping of hybrids & modules Based on module assembly and test experience with Flex V.2

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review10 Pre-Production Module Work Validate Design Debug Production Process Electrical Envelope Assembly Handling Test Parts Used “Hot” Modules Mechanical Dummies

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review11 Modules Produced To Date in FY01 23 Mechanical Dummies 1 Hot Module (limited by FE chip availability) All Use Version 2 Flex Hybrid Built by Operators on Version 1 Production Tooling following assembly line procedures

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review12 Mechanical Dummy Results 1000 pulled bonds 1000 PULLED BONDS Assembly tooling works Automatic wirebonding is feasible Adhesion and uniformity need improvement for production => better metalization Hybrids are fragile => need frame to control handling

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review13 FY01 “Hot” Module Results Full digital funtionality Excessive IR drops => need better metalization Analog performance needs more study. 150e - noise achieved but dependence on supply voltages not understood. Flex Circuitry is fragile => No tabs or soldered pigtail. Use Frame for test connections.

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review14 Global Summary of Hot Module Tests First full modules operated in 1998 –Rad-soft FE chips –Assemblies bump-bonded by Boeing –Version 1 Flex hybrid on support card –Full digital functionality. Some coherent noise issues. Hot modules with various bump technology and sensor combinations tested in 1999 –Still Rad-soft electronics –“Ideal” analog performance achieved –Many assembly problems identified In 2000 fewer hot modules built due to lack of FE chips –Aim of electrical test is to validate assembly and hybrids To do once FE-I chips are available –Reproduce “ideal” performance with new chips and new flex hybrids –Move on to multi-module system tests

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review15 “Ideal” Module Performance Threshold  = 139e - ENC = 138e -

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review16 Mechanical Dummy Program The 23 FY01 modules have no bumps- FE chips are glued to blank silicon Fabrication of 8” FE chip dummy wafers and 4” sensor dummies is under way – Expected delivery Apr. 5 Enough parts for 300 bump-bonded dummies to test: –Thinning of bumped 8” wafers –Rate capability of flip-chip vendors –Electrical continuity of bumps through module assembly –Uniformity and rate of production line module assembly Will use remaining V.2 flex and assemble modules with V.3 flex ahead of FE-I delivery. Assembly period Jun. – Nov. 2001

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review17 WBS Funding Profile

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review18 Pixel Volume PP0 Location Optical Hybrids 2cm Optic fibers OSU Optical Package (6 per hybrid) OSU Optical Hybrid Prototype PP0 Printed Flex Prototype 2cm

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review19 Optical Hybrids (continued) US to produce and test optical hybrids for disks Parallel Hybrid development in progress at Ohio State and Wuppertal Parallel optical package development at Ohio State and Taiwan Choice of a baseline optical package scheduled for June 01 First full hybrid p + irradiations scheduled for April 2001 Initial  irradiations of optical packages done in FY00

March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review20 Conclsions Flex Hybrids on track towards production design. Issues being addressed: more vendors, FE-I schedule, service integration, production assembly, handling and testing. Module production being addressed with mechanical dummy program ahead of availability of final electronics. –Mechanical integration and manufacturing issues should not depend on details of readout chip. It is understood that design choices made now are contingent on results of system tests with final electronics. Optical hybrids designs advancing toward baseline selection date of June 2001.