1. PXD Summary Tests PXD9 Pilot Production ASICs Components Plans:
- beam test
- production
Contributions from:
Bejing, Bonn, Desy, Giessen, Göttingen, Heidelberg, HLL, Karlsruhe, LMU, Mainz, MPP, Prague, Tabuk, TLU, Valencia
H-.G. Moser, 18th B2GM, June 2014

2. Pilot Run Sensor Production
3 hot wafers (W30, W35, W36) ware advanced in a pilot run
First tests of phase II (and III)
W30 finished (copper, thinning, cut)
W35 was held back for wafer level tests: ready for copper
W36 had problems with copper: to be repeated
Results (shorts) after Al2, before copper:
W30: no change after copper
13 of 18 chips usable
Can construct 2 inner ladders and 4 outer ladders

3. Drain current spread
Worst case: 24µA

4. High Speed Links

5. Noise measurements
µfit=0.49ADU
W31-3
µfit=0.61ADU

6. Preliminary Matrix (64x32) results

7. ASIC optimization
stuck
toggling
comparator offset

8. Tests with Hybrid 5
e.g. DCD <-> DHP communication

9. Boundary Scan Test Tests connectivity of Bump bond pins -Within a chip
-From chip to chip
Tests possible with needle card (no kapton)

10. Needle Card Tests
First opportunity to tests sensor & ASIC (before Kapton assembly)
First results very promising
given that good contact can be achieved essentially the full functionality of a module can be tested

11. ASIC Status and final submission
ASIC review in July

12. Outcome Switcher: faster rise time termination resistors
bump pad changes
DCD: improve digital data transmission
fix JTAG
revised gain and pedestal settings
understand missing codes

13. Schedule

14. SMD assembly
Original plan: SMD assembly in Valencia using solder spitting (PACTECH) – failed
Backup: use Finetech machine at HLL using a dispenser

15. Status:

16. DHE/DHC Trigger card for gated mode tests
Controls trigger / veto / laser
Optical links
Use Glenair transmitters
(rad hard)
Offer: 52 k€ (30k€ by MPP)
Order in ~ 2 weeks

17. DATCON Concentrator board (15 to be ordered)
DHE for tracking and ROI generation (3 to be produced)
Custom backplane (ordered)
SFP extension card (5 produced)

18. PS & Services 15 L2bwd produced L1bwd designed
Production after test of pilot
Power cables: prototypes produced and tested
Ready to start procurement

19. MARCO (Cooling) MARCO presently used at DESY for thermal mock-up
Problem: pump wear leads to frequent clogging of filters
Will be replaced by a new, more reliable pump (tested!)
Pump was bought by Tabuk and will be delivered soon
MACRO to be used:
Thermal mock-up
Ladder assembly at MPP (?)
SVD/PXD integration and tests at KEK before installation (pending CERN)

20. COSMIC Ray Setup Cosmic ray setup for tests of
PXD & SVD after integration at KEK B1
Scintillator panels & trigger logic
Geometry presently optimized by Tabuk
Still in work (remove bias of cosmic MC generator)

21. Beam Tests PXD only beam test at DESY in November
b) Combined PXD/VXD beam test in April 1016
use 2 ladders PXD9 pilot with new ASICs
main emphasis on system aspects

22. Conclusions
Sensor: First wafer of the pilot run fully processed, 2 more wafers will follow
ASICs: Review before final submission in July
after some additional work:
DHP and Switcher are submitted
DCD will be submitted in September
expect chips to be back in January
Module Assembly: First PXD9 module assembled (up to Kapton)!
Tests: Many tests done with various setups
Important results (used for ASIC review & follow up)
Still a lot of optimization to be done
Important: be ready for PXD9 tests
Plans:
Test PXD9 pilot modules
Series production of sensors to start in December
Test final ASICs in January
Assembly pilot modules with final electronics in March
(combined beam test and BEAST II)