22/11/2013 Gerrit Jan Focker, BE/BI/PM 1 BI review on Radiation development and testing. Analogue Electronics for: - L4 Grids, - L4 Scanners, - PS Complex.

Slides:



Advertisements
Similar presentations
Controller Tests Stephen Kaye Controller Test Motivation Testing the controller before the next generation helps to shake out any remaining.
Advertisements

12/02/2013 Gerrit Jan Focker, BE/BI/PM 1 WireGrid electronics in the Linac 4 tunnel.
Linac4 BPM and Phase Pickup L. Søby08/ LINAC4 Beam Position, Phase and intensity Pick-ups.
Integrated Circuits (ICs)
F.Brinker, DESY, July 17 st 2008 Injection to Doris and Petra Fitting the detector in the IP-region Radiation issues Beam optic, Target cell Polarisation.
Network topology.
Tom Kubicki.  Booster HLRF System to be upgraded using 1kW Solid State Driver (SSD) Amplifiers.  Used to drive the 200kW Power Amplifier  Eliminates.
LECC 2006 Ewald Effinger AB-BI-BL The LHC beam loss monitoring system’s data acquisition card Ewald Effinger AB-BI-BL.
Performance of the DZero Layer 0 Detector Marvin Johnson For the DZero Silicon Group.
Network Topologies.
VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.
SCADA and Telemetry Presented By:.
Network PHY - Cabling Cabling Issues with cabling LANs Types of equipment/choices Version2, 12/09/2015Slide 1.
Proposal of new electronics integrated on the flanges for LAr TPC S. Cento, G. Meng CERN June 2014.
Electronics for PS and LHC transformers Grzegorz Kasprowicz Supervisor: David Belohrad AB-BDI-PI Technical student report.
LHC ARC Commissioning report during LS1 Agenda: VRGPE documentation (former VRJGE) Active Penning modification By-Pass Valves modification LHC ARC commissioning.
PMF: front end board for the ATLAS Luminometer ALFA TWEPP 2008 – 19 th September 2008 Parallel Session B6 – Programmable logic, boards, crates and systems.
Domestic Wiring Two wires come from the power pole to the house. The ACTIVE wire is 240 V RMS. The NEUTRAL wire is 0 V and is connected to.
Design and Technical Challenges of the ILC Small Angle Interaction Regions October 19 th, 2006J. Borburgh, CERN, AB/BT Electrostatic separator limits With.
K.C.RAVINDRAN,GRAPES-3 EXPERIMENT,OOTY 1 Development of fast electronics for the GRAPES-3 experiment at Ooty K.C. RAVINDRAN On Behalf of GRAPES-3 Collaboration.
Uli Raich CERN BE/BI Instrumentation for the new H - Source Test Bench Linac-4 Ion Source Review 2011 Uli Raich CERN BE/BI Linac 4 ion source review, CERN.
BI day 2011 T Bogey CERN BE/BI. Overview to the TTpos system Proposed technical solution Performance of the system Lab test Beam test Planning for 2012.
Status of Beam loss Monitoring on CTF3 Results of Tests on LINAC and PETS as R&D for TBL Anne Dabrowski Northwestern University Thibaut Lefevre CERN CTF3.
Electronic Components Circuit/Schematic Symbols. RESISTOR Resistors restrict the flow of electric current, for example a resistor is placed in series.
TE/MPE/EE J. Mourao T/MPE/EE 1 November 2012 LHC Machine Local protection Redundant Power supply (DQLPUR) & interface Module (DQLIM) progress status.
Beam diagnostics in the beamlines
CMS ECAL End Cap Meeting CERN 18 Oct to 22 Oct ECAL End Cap High Voltage and Fibre Optic Monitoring Systems Progress. Progress on High Voltage and.
Excom ® Remote I/O in Zone 1. excom ® excom ® One system for all requirements in Zone 1.
TE/MPE/EE J. Mourao T/MPE/EE 23 December 2012 LHC Machine Redundant Power supply (DQLPUR) & interface Module (DQLIM) assembling during LS1.
BKLM RPC Signal & Ground Schematic Gerard Visser, Indiana University (for the barrel KLM team) 10th B2GM, 11/2011 magnet structure GND 7mm FOAM 3mm GLASS.
Acquisition Crate Design BI Technical Board 26 August 2011 Beam Loss Monitoring Section William Vigano’ 26 August
Results of the argon beam test at Linac3 D. Küchler BE/ABP/HSL Including feedback from R. Scrivens and M. Bodendorfer.
March 9, 2005 HBD CDR Review 1 HBD Electronics Preamp/cable driver on the detector. –Specification –Schematics –Test result Rest of the electronics chain.
Networking Topology 1.BUS Topology 2.RING Topology 3.STAR Topology
CEA DSM Dapnia Sédi Streamer theory Streamer theory Protection schemes Protection schemes Some ideas Some ideas Input Protection for Gas Detector Electronic.
Compilation of Dis-/Advantages of DC-DC Conversion Schemes Power Task Force Meeting December 16 th, 2008 Katja Klein 1. Physikalisches Institut B RWTH.
HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system.
SP & DC-DC Considering the benefits of combining serial powering and DC-DC conversion technologies in powering ATLAS SCT upgrade modules & staves Richard.
Beam Interlock System MPP Internal ReviewB. Puccio17-18 th June 2010.
Dept. of Information & Communications Technology Circuit Diagram and Prototype Construction (Project 1) slide L1-1 Objectives v How to read schematic Diagrams.
Chapter 2 Network topology and Networking devices.
DaMon: a resonator to observe bunch charge/length and dark current. > Principle of detecting weakly charged bunches > Setup of resonator and electronics.
PSD upgrade: concept and plans - Why the PSD upgrade is necessary? - Concept of the PSD temperature stabilization and control - Upgrade of HV control system.
L4 BCC – 1 Sep 2011 F. Roncarolo, U. Raich L.Soby, J.Tan, C.Zamantzas, F. Lenardon, C.Vuitton, G-J.Focker.
28/01/2013 Gerrit Jan Focker, BE/BI/PM 1 Isolde SGIU Beam Instrumentation Remarks on status and possible development.
Notes on visit to Rome 28/04/2014 Christian Joram Szymon Kulis Samir Arfaoui.
05/12/2014 Gerrit Jan Focker, BE/BI/PM 1 PSB-Injection H - and H 0 Dump detectors and Stripping Foil current measurement.
E.Guschin (INR,Moscow) 26 February 2008PS/SPD commissioning meeting CERN PS/SPD LED monitoring system status Tuning of SPD ‘C’ side: We concentrated our.
A+ Computer Repair Lesson 4 Introduction to Electricity and Safety.
Beam Instrumentation of CEPC Yue Junhui (岳军会) for the BI Group Accelerator Center, IHEP HF2014.
PHOTOTUBE SCANNING SETUP AT THE UNIVERSITY OF MARYLAND Doug Roberts U of Maryland, College Park.
30GHz system improvements Jan Kovermann RF meeting
LIU-PSB Working Group meeting: 25/06/2015, Markus Zerlauth Consolidation of magnet interlocks in the PS complex – Warm magnet Interlock System (WIC) R.Mompo,
Basics of Bypass Capacitor, Its Functions and Applications.
Organization for Micro-Electronics desiGn and Applications HGCAL Front-End Electronics Christophe de LA TAILLE, Marcello MANNELLI sept 2015.
P10203 LV1 MOTOR CONTROLLER FINAL REVIEW MAY 14, 2010 Electrical: Kory Williams, Adam Gillon, Oladipo Tokunboh Mechanical: Louis Shogry, Andrew Krall.
Logic Families There are several different families of logic gates. Each family has its capabilities and limitations, its advantages and disadvantages.
Markus Friedl (HEPHY Vienna)
BI-day 2014, The SEM-grid renovation project Michel Duraffourg
Analog FE circuitry simulation
SUMMARY OF THE ORSAY LD-TPC ELECTRONICS MEETING
Injectors BLM system: PS Ring installation at EYETS
PIN DIODE.
Power pulsing of AFTER in magnetic field
LHC BLM system: system overview
Compilation of Dis-/Advantages of DC-DC Conversion Schemes
BESIII EMC electronics
MOSFETs AIM: To understand how MOSFETs can be used as transducer drivers PRIOR KNOWLEDGE: Output transducers, Current in circuits, Calculating resistor.
Clement Derrez European Spallation Source ERIC Date
Orange box input.
Presentation transcript:

22/11/2013 Gerrit Jan Focker, BE/BI/PM 1 BI review on Radiation development and testing. Analogue Electronics for: - L4 Grids, - L4 Scanners, - PS Complex Grids.

22/11/2013 Gerrit Jan Focker, BE/BI/PM 2 Linac 4, Technology Choice. u Initial design was for Linac 4. u 21 Wire-grids at 11 positions, u 6 X-Y Wire-scanners. u At the time of designing the radiation levels were unknown, but said to be “high”. u Little time for development, production planned right from the start. u No choice was given about where to place the equipment. u To reach the specifications the electronics should be near the detectors (Initially 1m80, new design would allow ~8m), i.e. in the tunnel. u Therefore we have opted for a system with only the absolutely necessary electronics near the beamline: u Only amplifiers, u No logic, u Remote power supplies.

22/11/2013 Gerrit Jan Focker, BE/BI/PM 3 PS Complex (excluding L4). u While designing for L4 it was decided that the system could easily be adapted to be used for integrating amplifiers for the PS Complex as well, with different amplifiers. u Standardisation. u But: as a result the decision was taken to install this new system in the whole PS Complex during LS1. u 45 Wire-Grids at 33 positions. u Very little time for development, the production started before testing with beam.

22/11/2013 Gerrit Jan Focker, BE/BI/PM 4 Grid System overview. u Between Grid and Amplifier: two cables with twisted pairs with individual screening. The two cables will be mounted together in large Harting 72-pin connectors. u (Twisted-pairs simply because it is available at CERN…) u At the PS Complex on many grids (existing) LEMO cables will be used. u Between Amplifiers and Controls a single cable will be used (CERN ND100) mounted with Harting 108-pin connectors. u Power and I/O control are handled by the same ND100 cables, no additional cabling is foreseen. u At Linac 4: Bias +120V directly onto measuring wires. u This talk is about the Amplifiers only.

22/11/2013 Gerrit Jan Focker, BE/BI/PM 5 Amplifier-boxes. u Up to 32 channels per Motherboard, 2 Motherboards possible in one 2U chassis. u Daughter-boards carrying 4 amplifiers each.

22/11/2013 Gerrit Jan Focker, BE/BI/PM 6 Amplifier Design Details. u No electronic switches: miniature reed-relays. u No radiation problems, u Galvanic isolation, u Low contact resistance, u More problems with manufacturing… u The amplifiers cannot consume too much power, u Power: losses over 200m cable. u By reducing heat in chassis we hope to increase lifetime. u Input-protection by small-signal diodes BAV199 and zener-diode(s) BZX84Cxx. u Amplifiers AD8610ARZ, AD8032ARZ and AD8397ARZ, u All from Analog Devices XFCB process, u (Not that many alternatives anyway…) u Report from the European Space Agency and NASA: u “Commercial Components Identification In Naturally Radiation Hardened Technologies” 2002ESASP M u Chips from this family that were tested were still o.k. after 100kRad(Si) radiation. u It is claimed that these chips appear not to suffer from single event upset. u But a remote control of the Power Supplies is foreseen.

22/11/2013 Gerrit Jan Focker, BE/BI/PM 7 Linear Amplifier for Linac’s (1). u Amplifier’s Maximum Electrical Input: 10mA, u Amplifier’s highest sensitivity: 1μA full scale, u The calculated input-related noise-level is ~2nA at 1MHz BW. u Overall BW is mainly defined by the cable-length between grid and electronics, u The newer design allows cables up to 8m. u Isolated input-stage: u Bias of up to +120V on measuring wires (Linac 4). u Isolated input-stage avoids large input-capacitors. u The design includes the use of test-resistances: u At the amplifier-inputs. u Outside the vacuum-chamber at the cable-connection, u At the grid in the vacuum-chamber, u (Only applied at the new L4 grids and Scanners).

22/11/2013 Gerrit Jan Focker, BE/BI/PM 8 Linear Amplifier for Linac’s (2)

22/11/2013 Gerrit Jan Focker, BE/BI/PM 9 Linear Amplifier for Linac’s(3).

22/11/2013 Gerrit Jan Focker, BE/BI/PM 10 Scanner Amplifier (L4). u For the Scanners the same linear amplifiers are used as for the Linac SEM-Grids. u Same 4-channel Amplifier boards. u Grids have many wires: u If a channel dies one will still have a picture. u Redundancy for the scanners: u Two Amplifiers are connected to each wire, u Each channel is doubled from beginning to the end and uses two ADC channels.

22/11/2013 Gerrit Jan Focker, BE/BI/PM 11 Scanner Amplifier input.

22/11/2013 Gerrit Jan Focker, BE/BI/PM 12 Integrating Amplifier for circular machines (1). u Amplifier’s Maximum Electrical Input: 250nC, u Amplifier’s highest sensitivity: 2,5pC full scale, u The sensitivity appears to be limited mainly due to instabilities from the Power Supply (quite variable, 25fC ???). u Cable-length between grid and electronics defines noise and speed of the Amplifiers, u Some cables up to 20m, u For reliable measurement of the short pulses at TT2: length should be < 3m. u Test-resistances: u Only at the amplifier-inputs. u Grids and cabling would have to be rebuilt for others tests. u Two input circuits: u Active integrator for charges up to 2,5nC, u Passive integrator for higher charges. u The active integrator should be able to withstand a pulse of at least 250nC !

22/11/2013 Gerrit Jan Focker, BE/BI/PM 13 Integrating Amplifier (2)

22/11/2013 Gerrit Jan Focker, BE/BI/PM 14 Integrating Amplifier (3)

22/11/2013 Gerrit Jan Focker, BE/BI/PM 15 Integrating Amplifier (4)

22/11/2013 Gerrit Jan Focker, BE/BI/PM 16 Integrating Amplifier (5)

22/11/2013 Gerrit Jan Focker, BE/BI/PM 17 Placement of the electronics in the tunnels. u L3, PS inflection zone, Booster BTM, LEIR, TT2 and most of the L4: u Underneath or close to the Beamlines. u Help from the Radiation-to-Electronics Team (Joao), u L4: Define a position close to the Dump for a small Rack and protection. u PS and Inflection zone, u PS position 42 to 56: use the gap next to the support girder like Jeroen does. u Inflection zone: just move some electronics out of the way. u Cable-lengths: u Linac’s linear amplifiers: up to 8m. u Integrating amplifiers (not TT2): more than 8m degrades signal. u TT2: shorter than 3m.

22/11/2013 Gerrit Jan Focker, Jean Tassan-Viol, BE/BI/PM 18 Place in the Linac 4 tunnel (1) EmplacementType de montageType de capteurPosition LEBTMontage sur la poutreSEM grid 2 x 24 wiresL4L.BSGH.1151 L4L.BSGV.1151 Chopper lineMontage sur la poutre2 Wire scannersL4L.BWS.3312 L4L.BWS.3712 DTLRien CCDTLAu solSEM grid 2 x 24 wiresL4C.BSGH.0121 L4C.BSGV.0121 CCDTLAu solWire scannerL4C.BWS CCDTLAu solSEM grid 2 x 24 wiresL4C.BSGH.0421 L4C.BSGV.0421 CCDTLAu solWire scannerL4C.BWS.0622 PIMSAu solSEM grid 2 x 24 wiresL4P.BSGH.0121 L4P.BSGV.0121 PIMSAu mur, on a 75cmWire scannerL4P.BWS.0402 PIMSAu mur, on a 75cmSEM grid 2 x 24 wiresL4P.BSGH.0601 L4P.BSGV.0601 PIMSAu mur, on a 75cmWire scannerL4P.BWS.1002 Au solSEM grid 2 x 24 wiresL4T.BSGH.0223 L4T.BSGV.0223 Juste avant ligne dumpRienBSM RackSEM grid 2 x 24 wiresL4T.BSGH.0243 L4T.BSGV.0243 Ligne dumpRackSEM grid 2 x 24 wiresL4Z.BSGH.0273 L4Z.BSGV.0273 Ligne dumpRackSEM grid 2 x 24 wiresL4Z.BSGH.0287 L4Z.BSGV.0287 VirageRackSEM grid 2 x 24 wiresL4T.BSGH.0523 L4T.BSGV.0523 L4TAu solSEM grid 2 x 24 wiresL4T.BSGH.1247 L4T.BSGV.1247

22/11/2013 Joao Pedro De Carvalho Saraiva, Jean Tassan-Viol, Gerrit Jan Focker, BE/BI/PM 19 Place in the Linac 4 tunnel (2)

CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 20

CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 21

CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 22

CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 23

CPS Radiation levels 22/11/2013 Original slides from Joao Pedro De Carvalho Saraiva, EN/STI/EET 24

22/11/2013 Gerrit Jan Focker, BE/BI/PM 25 Conclusions. u Little choice of chips suiting our requirements, u From the chips we found at least the family characteristics seem to allow to use them in a somewhat radioactive environment. u No radiation tests done. If done, they would always have been afterwards… u Thanks to R2E for the great job finding reasonable positions in the tunnels!