Connectors 13/03/2013Collaboration meeting CERN - CSEM1

Mechanical Connector 13/03/2013Collaboration meeting CERN - CSEM2 Design of Raphael Dumps In-plane connector to test fluidic samples: -two metallic plates screwed together -two plastic o-ring to avoid leaks in the connection between the wafer holes and tubes -Substain high pressure (tested up to 300 bar) -Easy to assemble -Tested in thermal cycles

Metal Soldering Connectors 13/03/2013Collaboration meeting CERN - CSEM3 ‘Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices’ Edward R. Murphy et al., The Royal Society of Chemistry, /16’’ tube Stainless steel ferrule Brass ferrule Swagelok standard objects: - assemble - swaging for sealing - soldering with tin to the metal deposited on the wafer surface 20 nm Ti nm Au

Metal Connectors-Testing 13/03/2013Collaboration meeting CERN - CSEM4 - Testing inside vacuum vessel and thermal cycling (Frame3 NA62 with C 6 F 14 fluid) 20 nm Ti nm Au On the non-polished side!! - Testing with CO 2 up to 70 bar and -10 °C. - Pressure test to check leaks  no problems up to 300 bar! 100 µm thin Si chip  no solder in the tube!!

Metal Connectors-Future Developments 13/03/2013Collaboration meeting CERN - CSEM5 -Studying the quantity of metal and the type of metal to deposit (some problems of bad soldering were observed in some samples with no RF etch cleaning before deposition) -Depositing metal just on a small surface to sold connectors masking the surface during deposition -Future plan of integrating with the full Si connector in plane full silicon connectors: -Up pool with channel for the fluid -Bottom pool integrated with micro-channels FLUID IN

Connecting Two Fluidic Devices 13/03/2013Collaboration meeting CERN - CSEM6 Inlet Outlet recirculation Future interconnection between µ-channel devices with in- plane connectors  proposal to cool down the stave detector of ALICE ITS - Bridges between micro-channels - Tubes inside micro-channels 0.31 mm tube inserted from the side in between the channels, leak tightness assured by gluing

Future Tests 13/03/2013Collaboration meeting CERN - CSEM7 -Studying the metal type and thickness for deposition -Trying to sold Si-Si with a metal layer -Interconnecting devices  tests on-going -…